JPS60154697A - Method of mounting electronic part - Google Patents
Method of mounting electronic partInfo
- Publication number
- JPS60154697A JPS60154697A JP59010110A JP1011084A JPS60154697A JP S60154697 A JPS60154697 A JP S60154697A JP 59010110 A JP59010110 A JP 59010110A JP 1011084 A JP1011084 A JP 1011084A JP S60154697 A JPS60154697 A JP S60154697A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- electronic component
- printed circuit
- circuit board
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は電子部品の実装方法に係り、特に高密度に′電
子部品をプリン１一基板に実装する場合に好適な実装方
法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a mounting method for electronic components, and particularly to a mounting method suitable for mounting electronic components on a printed circuit board 1 at a high density.
従来の電子部品の実装方法では、部品をプリン１〜基板
に挿入後リードを折り曲げる事で基板に固定（以後、リ
ードクリンチとする）していたので、折り曲げたリード
の長さ分だけスペースが余分に必要となり、あまり部品
どうし接近させて配置出来ない、パターンを逃がしてや
る必要がある等、プリント基板への電子部品の高密度実
装に妨げとなるという欠点があった。In the conventional mounting method for electronic components, after inserting the component into the board, the lead is bent to fix it to the board (hereinafter referred to as lead clinch), so there is extra space for the length of the bent lead. This has drawbacks such as the inability to place components very close to each other and the need to space out the patterns, which hinders high-density mounting of electronic components on printed circuit boards.
本発明の目的は電子部品をリードクリンチせずにプリン
１一基板に実装する事により、電子部品のプリント基板
への高密度実装を提供する事にある。An object of the present invention is to provide high-density mounting of electronic components on a printed circuit board by mounting electronic components on a printed circuit board without lead clinching.
本発明はプリン１一基板に電子部品を、Ｖ′６密度実装
した場合に、従来の実装方法ではクリンチした電子部品
のリードが近接した他の部品のリードと接触したり、余
分なスペースを必要とする為パターンを余、ＩＩに逃げ
る必要がある等の点に注目し、リードクリンチせずに部
品を実装する事でプリン１〜基板への電子部品の高密度
実装を実現しよつとするものである。In the case of V'6-density mounting of electronic components on a printed circuit board, the present invention has been proposed in such a way that, with the conventional mounting method, the leads of the clinched electronic components come into contact with the leads of other nearby components, and extra space is required. This is an attempt to realize high-density mounting of electronic components on the printed circuit board 1 to the board by paying attention to the point that it is necessary to escape the pattern to the left and the second in order to achieve this, and by mounting the components without lead clinching. It is.
以下、本発明の一実施例を第２図により説明する。１が
抵抗器やダイオード等の電子部品本体であり、リード３
ｂによりプリント基板２に固定されている。リード線は
両側をつまんだ様につぶされている。この実施例によれ
ば、リードをつぶすだけでり−１−外径を十分大きく取
る事が出来るので、少々プリン１一基板のリード挿入穴
がリード径に対し大ぎずぎでも確実に固定する４ｔが出
来る。An embodiment of the present invention will be described below with reference to FIG. 1 is the main body of electronic components such as resistors and diodes, and lead 3
b is fixed to the printed circuit board 2. The lead wires are crushed as if pinched on both sides. According to this embodiment, the outer diameter can be made sufficiently large by simply crushing the lead, so even if the lead insertion hole of the printed circuit board is slightly larger than the lead diameter, the 4t can be securely fixed. I can do it.
第３図に本発明の他の実施例を示す。３Ｃが電子部品の
り−１−であるが、本実施例ではリード先端が２つに割
りさかれている。この実施例によれば、切断後のリード
が短かく取れるので、プリント基板２の１ぐ側に余分な
スペースを取る必要が小テい。FIG. 3 shows another embodiment of the invention. 3C is electronic component glue-1-, and in this example, the lead tip is divided into two. According to this embodiment, the leads after cutting can be shortened, so there is no need to take up extra space on the first side of the printed circuit board 2.
本発明によれば、プリン１〜基板に電子部品をり−ｊ・
クリンチせずに固定する事が出来るので、余分なスペー
スを必要としない。したがって、電子部品どうしを非常
に接近させて配百する事ができ、かつ、早口」ブリッジ
もしにくくなる。又、パターンの逃げも必要最小限にお
さえるＪＪ（ができ、プリン１一基板へ電子部品を高密
度に実装出来るという効果がある。According to the present invention, electronic components are attached to the print board 1 to the board.
Since it can be fixed without clinching, no extra space is required. Therefore, electronic components can be placed very close to each other, and rapid bridges are also difficult to occur. In addition, it is possible to reduce pattern escape to the necessary minimum (JJ), which has the effect of allowing high-density mounting of electronic components on the printed circuit board.
第１図は従来の実装方法を示した図、第２図。 第３図は本発明の実施例を示した図である。 ■・・・電子部品本体、２・・プリン１へ基板、３ａ。 FIG. 1 is a diagram showing a conventional mounting method, and FIG. 2 is a diagram showing a conventional mounting method. FIG. 3 is a diagram showing an embodiment of the present invention. ■...Electronic component body, 2...Substrate to printer 1, 3a.
Claims (1)
ーピングされた前記電子部品を自動インサータによりリ
ールもしくは箱から取り出してプリン１〜基板に挿入後
、プリン１へ基板の下部に出た前記部品のリードの外径
をリード挿入用穴径よりも大きくなるよう加工してリー
ドを切断する事により、前記電子部品のリードを折り曲
げる事なくプリント基板に固定する事を特徴とする電子
部品実装方法。 ２、前記電子部品のリードの加工において、リードを平
たく、もしくはそれに類似した形状に加工する事を特徴
とする特許請求の範囲第１項記載の電子部品実装方法。 ３、前記電子部品のリードの加工において、リードを切
断後、その端面を割る、もしくはそれに類似した方法で
前記電子部品のリードの先端を広げる事を特徴とする特
許請求の範囲第１項記載の電子部品実、装方法。[Claims] 1. In a method for mounting an electronic component on a printed circuit board, the taped electronic component is taken out from a reel or box by an automatic inserter, inserted into the printer 1 to the board, and then inserted into the printer 1 at the bottom of the board. An electronic device characterized in that the leads of the electronic component are fixed to a printed circuit board without bending by machining the outer diameter of the lead of the electronic component to be larger than the diameter of the hole for inserting the lead and cutting the lead. Component mounting method. 2. The electronic component mounting method according to claim 1, wherein in processing the lead of the electronic component, the lead is processed into a flat shape or a similar shape. 3. In processing the lead of the electronic component, after cutting the lead, the end face of the lead is split or a similar method is used to widen the tip of the lead of the electronic component, as set forth in claim 1. Electronic component mounting method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59010110A JPS60154697A (en) | 1984-01-25 | 1984-01-25 | Method of mounting electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59010110A JPS60154697A (en) | 1984-01-25 | 1984-01-25 | Method of mounting electronic part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60154697A true JPS60154697A (en) | 1985-08-14 |
Family
ID=11741172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59010110A Pending JPS60154697A (en) | 1984-01-25 | 1984-01-25 | Method of mounting electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60154697A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08111596A (en) * | 1994-10-07 | 1996-04-30 | Nippon Precision Circuits Kk | Ic mounting device |
-
1984
- 1984-01-25 JP JP59010110A patent/JPS60154697A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08111596A (en) * | 1994-10-07 | 1996-04-30 | Nippon Precision Circuits Kk | Ic mounting device |
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