JPS60121727A - Molding method for resin-sealed electronic component - Google Patents

Molding method for resin-sealed electronic component

Info

Publication number
JPS60121727A
JPS60121727A JP14052484A JP14052484A JPS60121727A JP S60121727 A JPS60121727 A JP S60121727A JP 14052484 A JP14052484 A JP 14052484A JP 14052484 A JP14052484 A JP 14052484A JP S60121727 A JPS60121727 A JP S60121727A
Authority
JP
Japan
Prior art keywords
resin
electronic component
index
molding
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14052484A
Other languages
Japanese (ja)
Inventor
Tomio Yamada
富男 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14052484A priority Critical patent/JPS60121727A/en
Publication of JPS60121727A publication Critical patent/JPS60121727A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To facilitate the directional discrimination of components by eliminating burrs generating in an index part made up of a projection by a method wherein, in molding of an electronic component with resin, one end of a lead frame sandwiched by the upper and lower metal molds is provided with the inward projection, and the resin outflow from a cavity is blocked at the time of resin molding. CONSTITUTION:The electronic component is fixed on the lead frame 10 consisting of outer leads 10a, dams 10b, and inner leads 10c, and, in covering the upper and lower surfaces of the frame 10 with a resin molded layer 14 while the outer leads 10a are projected outward, the following process is taken: one end of the component-mounting part is provided with the inward recess 10d for index formation, and the upper and lower metal molds for molding are provided with recesses covering them so as to prevent the invasion of resin to the recess 10d. This manner allows the generation of no burrs at the index recess 10d for discriminating the direction of components, and accordingly the discrimination is facilitated that much.

Description

【発明の詳細な説明】 本発明は、樹脂月１１・型電子部品のモールド′法に関
するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a molding method for resin month 11 type electronic components.

レジン１１止型パンケージと称される樹脂封止型電子部
品の組立にはリードフレームが用いられ、例えばその組
立方法は特公昭４．５−１１３７号公報に開示されてい
る。A lead frame is used to assemble a resin-sealed electronic component called a resin-sealed pancage, and a method for assembling it is disclosed, for example, in Japanese Patent Publication No. 4.5-1137.

従来、この種のパッケージは上記公報にも開示されてい
るようにフラットな長方形状をしており、その両側にそ
れぞれ一列状にリードが配置されるいわゆるデュアル・
イン・ラインタイプのものが多い。Conventionally, this type of package has a flat rectangular shape, as disclosed in the above publication, and has a so-called dual package in which leads are arranged in a row on both sides.
There are many in-line types.

ところで、その方向識別を容易にするためしばしばパッ
ケージの端面に四部などからなるインデックス部が設け
られる。通常、このインデックス部の形成は、レジンモ
ールド工程において形成すべとインデックス部に対応し
た形状のモールド金型を使用して行われる。この場合、
上下のモールド金型の間には、その開にはさまれるリー
ドフレームの厚さに担当する厚さのぼりが生ずるが、従
来技術によると、この種のぼりはインデックス形成部に
も当然に生じていた。インデックス部に生じたぼりは、
これを残しておくと光学的に方向性をチェックする場合
に障害になるので、モールド後にリードフレームからダ
ム部を切断してリード部を分離する際に金型により除去
されていた。あるいは、別の方法としてインデックス形
成位置にはりを生じないようモールド金型を特別の形状
にすることも試みられていた。Incidentally, in order to facilitate direction identification, an index section consisting of four parts or the like is often provided on the end face of the package. Normally, the index portion is formed in a resin molding process using a mold having a shape corresponding to the index portion. in this case,
A thickness increase occurs between the upper and lower molds depending on the thickness of the lead frame sandwiched between the two molds, but according to conventional technology, this type of increase naturally also occurred in the index forming part. . The mark that occurs on the index part is
If this remains, it becomes an obstacle when optically checking the directionality, so it is removed by the mold when the dam part is cut from the lead frame to separate the lead parts after molding. Alternatively, attempts have been made to give the mold a special shape so as not to form a beam at the index forming position.

しかるに、これらいずれの従来技術も金型の設計・製作
に要する多大の労力と費用をさけることかで鰺ない欠点
を有する。However, all of these conventional techniques have the drawback of avoiding the large amount of labor and expense required for designing and manufacturing the mold.

本発明の目的は、安価に樹脂封止型電子部品を得るため
のモールド法を提供するものである。An object of the present invention is to provide a molding method for obtaining resin-sealed electronic components at low cost.

本発明の特徴とするところは、リードフレームを用い、
樹脂封止体の一部にその封止体の一主面より反対主面に
貫通する所望形状の凹部を形成するための樹脂封止型電
子部品のモールド法であって、リードフレームは上記四
部形状に対応した凸部を有したものを用意しそしてその
凸部をモールド金型でおさえモールドすることを特徴と
する樹脂封止型電子部品のモールド法にある。The present invention is characterized by using a lead frame,
A molding method for a resin-sealed electronic component for forming a recess in a desired shape penetrating from one main surface to the opposite main surface of the resin-sealed body in a part of the resin-sealed body, the lead frame having the above-mentioned four parts. A molding method for a resin-sealed electronic component is characterized in that an item having a convex portion corresponding to the shape is prepared and the convex portion is pressed and molded with a molding die.

本発明は、特にリードフレームにインデックス形成用内
方突出部を設け、モールド処理時に上下のモールド金型
間においてインデックス形成にばりが発生しないように
した点にある。In particular, the present invention is characterized in that the lead frame is provided with an inwardly protruding portion for forming an index, so that burrs are not generated in forming the index between upper and lower mold dies during mold processing.

次に、添付図面を参照して本発明の一実施例を詳述する
。Next, one embodiment of the present invention will be described in detail with reference to the accompanying drawings.

第１８及び第１１）図は、本発明の一実施例によるＩＣ
（集積回路）用リードフレームがモールド処理を受ける
場合のそれぞれ上面及びそのＩＩ）　Ｉｂ線断面を示し
ており、これらの図において、１０はリードフレーム、
１０ａはアウタリード部、１０１〕はダム部、１０ｃは
インナリード部、１０ｄはインデックス形成用内方突出
部、１２＾、１２Ｂは上下のモールド金型、１４はレジ
ンモールド層、１６はインナリードの一部である。上下
の金型１２Ａ、１２Ｂは、レジンモールド層１４を収容
するためのキャビティを定めるように重ね合されるもの
であり、そのと鯵の重ね合せ面が第１ａ図では参照符号
１２で示されている。レジンモールド層１４はインデッ
クス部（四部）１４ａを有するパッケージを構成する。Figures 18 and 11) illustrate an IC according to an embodiment of the present invention.
(Integrated circuit) lead frame is subjected to molding process, and shows the top surface and its II) Ib line cross section, respectively. In these figures, 10 is the lead frame,
10a is an outer lead part, 101] is a dam part, 10c is an inner lead part, 10d is an inward protrusion for forming an index, 12^, 12B are upper and lower mold molds, 14 is a resin mold layer, and 16 is one of the inner leads. Department. The upper and lower molds 12A, 12B are overlapped to define a cavity for accommodating the resin mold layer 14, and the overlapping surfaces of the molds 12A and 12B are indicated by reference numeral 12 in FIG. 1a. There is. The resin mold layer 14 constitutes a package having index parts (four parts) 14a.

したがって、第２図に示した如外ばりのない封止体の一
主面Ａより反対主面Ｂに貫通するインデックス部（四部
）１４ａを有するデュアル・イン・ラインタイプの樹脂
封止型電子部品が得られる。Therefore, a dual-in-line type resin-sealed electronic component having index portions (four portions) 14a penetrating from one principal surface A to the opposite principal surface B of the encapsulated body without external burrs as shown in FIG. 2 is obtained. is obtained.

第１図（ａ）、　（ｂ）で示したリードフレーム１０は
上下の金型１２＾、１２ｅの間においてインデックス形
成位置にはインデックス形状に対応した内方突出部（凸
部）１０ｄが設けられており、その上下の金型１２＾、
１２Ｂでおさえられているのでレジンモールド時にモー
ルＦ用キャビティからのレジンの流出が防止され、レジ
ンモールド層１４に連続したばつの発生はおさえられる
。従って、インデックス部１４ａは殆んどばりを有する
ことなく、モールド金型の規定する所望の形状（図では
半円状）のものとして形成される。それゆえ、破線Ｋか
ら内方に突出する突出部１０ｄに相当する空間をうめる
べくＪ二下の金型１２＾、１２ｏを特殊形状に加工する
必要がないからその分の労力と費用を節約できることは
明らかであろう。よって、ばつのない安価な樹脂封止型
電子部品が得られる。The lead frame 10 shown in FIGS. 1(a) and 1(b) has an inward protrusion (projection) 10d corresponding to the shape of the index provided at the index forming position between the upper and lower molds 12^ and 12e. The upper and lower molds 12^,
12B prevents resin from flowing out from the cavity for molding F during resin molding, and prevents continuous blemishes from occurring in the resin mold layer 14. Therefore, the index portion 14a has almost no burrs and is formed into the desired shape (semicircular shape in the figure) defined by the molding die. Therefore, it is not necessary to process the molds 12^ and 12o below J2 into a special shape to fill the space corresponding to the protruding portion 10d protruding inward from the broken line K, so that labor and cost can be saved. should be obvious. Therefore, a reasonably inexpensive resin-sealed electronic component can be obtained.

【図面の簡単な説明】[Brief explanation of drawings]

第１ａ図は、本発明の一実施例によるレジンモールド工
程におけるリードフレームを示す上面図、第１ｂ図は、
第１ａ図のＩｂ−１ｂ線に沿う拡大断面図、第２図は本
発明によって得られた樹脂封止型電子部品の斜視図であ
る。 １０・・・リードフレーム、１０ａ・・・アウタリード
部、１０ｂ・・・ダム部、１０ｃ・・・インナリード部
、１０ｄ・・・インデックス形成用内方突出部、１２人
、１２Ｂ・・・モールド金型、１４・・・レジンモール
ド層、１６・・・インナリードの一部。 第　１　ｂ　図 第２図FIG. 1a is a top view showing a lead frame in a resin molding process according to an embodiment of the present invention, and FIG. 1b is a
FIG. 1A is an enlarged cross-sectional view taken along line Ib-1b in FIG. 1A, and FIG. 2 is a perspective view of a resin-sealed electronic component obtained by the present invention. DESCRIPTION OF SYMBOLS 10... Lead frame, 10a... Outer lead part, 10b... Dam part, 10c... Inner lead part, 10d... Inward protrusion part for index formation, 12 people, 12B... Mold metal Mold, 14... Resin mold layer, 16... Part of inner lead. Figure 1b Figure 2

Claims (1)

【特許請求の範囲】[Claims] リードフレームを用い、樹脂封止体の一部にその封止体
の−・主面より反対主面に貫通する所望形状の四部を形
成するための樹脂封止型電子部品のモールド法であって
、リードフレームは上記四部形状に対応した凸部を有し
たちのを用意し、そしてその凸部をモールド金型でおさ
えモールドすることを特徴とする杉１脂月止型電子部品
のモールド法。A molding method for a resin-sealed electronic component using a lead frame to form four parts of a desired shape penetrating from the main surface to the opposite main surface of the resin-sealed body in a part of the resin-sealed body. A molding method for a cedar-shaped electronic component, characterized in that a lead frame having a convex portion corresponding to the four-part shape is prepared, and the convex portion is pressed and molded with a molding die.
JP14052484A 1984-07-09 1984-07-09 Molding method for resin-sealed electronic component Pending JPS60121727A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14052484A JPS60121727A (en) 1984-07-09 1984-07-09 Molding method for resin-sealed electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14052484A JPS60121727A (en) 1984-07-09 1984-07-09 Molding method for resin-sealed electronic component

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP770077A Division JPS5394179A (en) 1977-01-28 1977-01-28 Lead frame

Publications (1)

Publication Number Publication Date
JPS60121727A true JPS60121727A (en) 1985-06-29

Family

ID=15270669

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14052484A Pending JPS60121727A (en) 1984-07-09 1984-07-09 Molding method for resin-sealed electronic component

Country Status (1)

Country Link
JP (1) JPS60121727A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS559828A (en) * 1978-07-05 1980-01-24 Dantoo Kk Separating method of base film for heat-transfer paper in tile

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS559828A (en) * 1978-07-05 1980-01-24 Dantoo Kk Separating method of base film for heat-transfer paper in tile

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