JPS60111489A - Board for placing electronic parts and method of producing same - Google Patents
Board for placing electronic parts and method of producing sameInfo
- Publication number
- JPS60111489A JPS60111489A JP21908783A JP21908783A JPS60111489A JP S60111489 A JPS60111489 A JP S60111489A JP 21908783 A JP21908783 A JP 21908783A JP 21908783 A JP21908783 A JP 21908783A JP S60111489 A JPS60111489 A JP S60111489A
- Authority
- JP
- Japan
- Prior art keywords
- board
- printed wiring
- metal plate
- wiring board
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は、チップ素子又は半導体素子などの電子部品か
らの熱放散性を向上させ、電子部品への湿度の影響を向
上し、かつ薄型と小型化し得る電子部品搭載用基板及び
その製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention provides an electronic component mounting device that improves heat dissipation from electronic components such as chip elements or semiconductor devices, improves the influence of humidity on electronic components, and can be made thinner and smaller. This invention relates to a substrate and its manufacturing method.
従来半導体素子などの電子部品を直接プリント配線基板
に塔載し、ワイヤボンディングによｆｌａｔ気的に接続
された基板が時計やカメラなどの内装基板として使用さ
れている。第１図は、電子部品を直接プリント配線基板
に塔載する例であり、プリント配線基板としては、セラ
ミック基板又は、有機系樹脂基板が用いられている。2. Description of the Related Art Conventionally, electronic components such as semiconductor elements are directly mounted on a printed wiring board, and the board is connected in a flat manner by wire bonding, and the board is used as an interior board for watches, cameras, and the like. FIG. 1 shows an example in which electronic components are directly mounted on a printed wiring board, and a ceramic substrate or an organic resin substrate is used as the printed wiring board.
第２図に示すようにザグリ加工又は積層成形により半導
体素子実装部分の基板表面に凹部を設けその凹部内に半
導体素子を塔載したプリント配線基板がある。As shown in FIG. 2, there is a printed wiring board in which a recess is formed on the surface of the substrate in a portion where a semiconductor element is mounted by counterbore processing or laminated molding, and a semiconductor element is mounted within the recess.
第２図のプリント配線基板は第１図に示すものに比較し
て半導体素子を搭載後のプリント配線基板全体を薄くす
る利点がある。The printed wiring board shown in FIG. 2 has an advantage over the printed wiring board shown in FIG. 1 in that the entire printed wiring board after mounting semiconductor elements can be made thinner.
しかしながら、これら従来のプリント配線基板において
は塔載した半導体素子からの発熱に対して十分カ熱放散
が得られず、低い出力の半導体素子すなわち発熱が少い
半導体素子のみに適用されており、高い出力の半導体素
子は放熱用のフィンを用けるなどの対策が必要である。However, these conventional printed wiring boards do not provide sufficient heat dissipation for the heat generated by the mounted semiconductor elements, and are only applied to low-output semiconductor elements, that is, semiconductor elements that generate little heat. It is necessary to take measures such as using heat dissipation fins for the output semiconductor element.
特に有機系樹脂基板は、金属に比較し熱伝導率が小さく
半導体素子からの熱放散性は劣っている。一方アルミナ
などのセラミックス基板においても最近の高集積された
高い出力の半導体素子の搭載には不十分である。In particular, organic resin substrates have lower thermal conductivity than metals and are inferior in heat dissipation from semiconductor elements. On the other hand, ceramic substrates such as alumina are also insufficient for mounting recent highly integrated, high output semiconductor elements.
本発明は、上記従来のプリント配線基板の欠点である熱
放散性を向上させるために、金属板の放熱特性を最大限
に発揮させる構造とすべく、プリント配線用基板と金属
板とを接着剤などを介して接合し一体化された基板を提
供するものであり、プリント配線用基板の電子部品搭載
部に貫通穴を形成し、該貫通穴周辺部に凹部を形成後、
接着層を介して、金属板を該旧都に接合し、さらには少
くとも接合部の露出部分に金属メッキ膜を施すことによ
り、半導体素子などの電子部品から発生する熱を金属板
を通じて効率よく放散することができ、又金属板をプリ
ント配線基板の凹部に接合することにより基板全体を薄
くすることができる。In order to improve heat dissipation, which is a drawback of the conventional printed wiring boards, the present invention aims to bond a printed wiring board and a metal plate with an adhesive in order to create a structure that maximizes the heat dissipation properties of the metal plate. After forming a through hole in the electronic component mounting part of the printed wiring board and forming a recess around the through hole,
By bonding a metal plate to the old city via an adhesive layer and applying a metal plating film to at least the exposed portion of the joint, heat generated from electronic components such as semiconductor elements can be efficiently transferred through the metal plate. Furthermore, by bonding the metal plate to the recessed portion of the printed wiring board, the entire board can be made thinner.
さらには、露出接合部を被覆した金属層は、外部の湿気
が、接着層を通して基板内部への浸入を遮断することに
より基板の耐湿性が向上し、熱放散性、耐湿性が著しく
優れ、薄型化を可能とする電子部品搭載用基板を提供す
ることを目的とするものである。Furthermore, the metal layer covering the exposed joints improves the humidity resistance of the board by blocking external moisture from entering the inside of the board through the adhesive layer, and has excellent heat dissipation and moisture resistance, and is thin The purpose of the present invention is to provide a board for mounting electronic components that enables the use of electronic components.
以下本発明を図面に基いて具体的に説明する。The present invention will be specifically explained below based on the drawings.
第３図は本発明の電子部品搭載用基板を製造する工程の
一例を示すものである。FIG. 3 shows an example of the process of manufacturing the electronic component mounting board of the present invention.
第３図の（ａ）はプリント配線用基板（４）の縦断面図
である。最も代表的なものは、ガラス繊維強化エポキシ
樹脂基板（以下ガラエポ基板と略称する）、紙フエノー
ル樹脂基板、紙エポキシ樹脂基板などの他に、ポリイミ
ド樹脂基板又は、トリアジン樹脂基板などである。そし
てこれらの基板の片面又は両面には予め銅箔（５）等の
導電皮膜が積層貼着されている。次に図面（１））は、
前記プリント配線用基板の電子部品搭載部に貫通穴（６
）を形成し、貫通穴周辺部に四部（７）ｆ形成した縦断
面図である。貫通穴は、金型による打ち抜き加工又は機
械切削による加工などであり、凹部はザグリ加工などに
より形成され、また太き穴を明けた基板と小さい穴を明
けた基板とを貼り合せてつくられる。貫通穴の大きさお
よび四部の大きさ、深さなどは特に限定されるものでな
い。図面（（１）は前記プリント配線用基板に接着層（
９）ヲ介して、金属板（８）を接合した状態の縦断面図
である。前記接着１ｍ （９）としては、未硬化のエポ
キシ樹脂含浸のガラスクロス又は耐熱性の接着シート又
は、液状の樹脂などであり、接着性、耐熱性、耐久性な
どの諸特性が高い接着層が好しい。一方金属板は銅、銅
合金、鉄、鉄合金、アルミニウム、アルミニウム合金な
ど、比較的熱伝導率が太きいものであればよい。金属板
の大きさ、厚さけ、特に限定されるものではないが板厚
が厚くて、面積が大きい方が、熱放散の面では有利であ
る。図面（ｄ）は、前記プリント配線用基板をメッキに
エリ接合部、穴壁面、基板表面などに金属被膜（１０）
’ｔ−施し、プリント配線用基板と金属板とを一体化
した状態の縦断面図である。該金属被膜はプリント配線
用基板と金属板の接着層への水の浸入を遮断し金属板と
、プリント配線用基板の空隙への水の浸入を防ぐ効果が
あり又金属板と銅箔が一体化されることにより電子部品
からの発熱が銅板から銅箔へ速やかに伝導され熱放散効
果が向上する利点がある。FIG. 3(a) is a longitudinal sectional view of the printed wiring board (4). The most typical examples include glass fiber reinforced epoxy resin substrates (hereinafter abbreviated as glass epoxy resin substrates), paper phenol resin substrates, paper epoxy resin substrates, as well as polyimide resin substrates and triazine resin substrates. A conductive film such as a copper foil (5) is laminated and pasted on one or both sides of these substrates in advance. Next, drawing (1)) is
A through hole (6
) is formed, and is a vertical cross-sectional view in which four parts (7)f are formed around the through hole. The through hole is formed by punching with a mold or machine cutting, and the recess is formed by counterboring or the like, or by bonding a substrate with a thick hole and a substrate with a small hole. The size of the through hole, the size of the four parts, the depth, etc. are not particularly limited. The drawing ((1) shows an adhesive layer ((1)) on the printed wiring board.
9) is a vertical cross-sectional view of a state in which a metal plate (8) is joined through the metal plate (8). The adhesive 1m (9) is an uncured epoxy resin-impregnated glass cloth, a heat-resistant adhesive sheet, or a liquid resin, and the adhesive layer has high properties such as adhesiveness, heat resistance, and durability. I like it. On the other hand, the metal plate may be made of copper, copper alloy, iron, iron alloy, aluminum, aluminum alloy, etc., as long as it has a relatively high thermal conductivity. Although the size and thickness of the metal plate are not particularly limited, a thicker plate and a larger area are advantageous in terms of heat dissipation. Drawing (d) shows a metal coating (10) on the edge joint, hole wall surface, substrate surface, etc. after plating the printed wiring board.
It is a longitudinal cross-sectional view of a state in which a printed wiring board and a metal plate are integrated. The metal coating has the effect of blocking water from entering the adhesive layer between the printed wiring board and the metal plate, and preventing water from entering the gap between the metal plate and the printed wiring board, and also prevents the metal plate and the copper foil from being integrated. This has the advantage that the heat generated from the electronic components is quickly conducted from the copper plate to the copper foil, improving the heat dissipation effect.
さらに前記基板表面に感光性樹脂被膜を貼着し、電子部
品実装用穴を含む所望の回路パターンを形成し、エツチ
ングにより導体回路を形成する。又必要によりその後、
ソルダーレジストの塗布や、ニッケル、金などのメッキ
を行ってもよい。図面（ｅｌは本発明の電子部品搭載用
基板の縦断面図であり、図面（０は、前記基板に半導体
素子を実装しワイヤボンディングにより結線した状態の
縦断面図である。この図面において半導体素子（１１）
は、金属板（８）の上に直接塔載し、さらに基板の導体
回路部と半導体素子とをワイヤー（１２）で結線して電
気的に接続されている。Furthermore, a photosensitive resin film is adhered to the surface of the substrate, a desired circuit pattern including holes for mounting electronic components is formed, and a conductive circuit is formed by etching. Also, if necessary,
Application of solder resist or plating with nickel, gold, etc. may be performed. Drawing (el) is a vertical cross-sectional view of the electronic component mounting board of the present invention, and drawing (0 is a vertical cross-sectional view of a state in which a semiconductor element is mounted on the board and connected by wire bonding. In this drawing, the semiconductor element (11)
is mounted directly on the metal plate (8), and the conductive circuit portion of the board and the semiconductor element are electrically connected by wires (12).
このようにして本発明のプリント配線基板の金属板に半
導体素子を直接塔載し実装すれば半導体素子の発熱は金
属板（８）に伝導し金属板銅箔、メッキ層の表面より効
率よく外気に放散される。If the semiconductor element is directly mounted and mounted on the metal plate of the printed wiring board of the present invention in this way, the heat generated by the semiconductor element will be conducted to the metal plate (8), and the outside air will be more efficiently transferred to the surface of the metal plate copper foil and plating layer. is dissipated into.
以上のように本発明の電子部品搭載用基板は、発熱が大
きい電子部品を塔載しても、熱放散性が高いため該基板
に蓄熱することはなく、又実装された電子部品へ基板を
通して外部の水分が浸入することは極めて小さく耐久性
が向上するとともに、実装後のプリント配線基板を薄く
する利点がある。As described above, even if the electronic component mounting board of the present invention is mounted with an electronic component that generates a large amount of heat, due to its high heat dissipation property, heat will not be accumulated on the board, and the mounted electronic component can be passed through the board. There is an advantage that the intrusion of external moisture is extremely small, improving durability, and that the printed wiring board after mounting can be made thinner.
第１図、第２図は従来のプリント配線基板の縦断面図、
第３図は本発明のプリント配線基板の製造方法を示す該
基板の縦断面図である。
（１）・・・・・・・・プリント配線基板（２）・・・
・・・・・導体回路
（３）・−・・・・・・電子部品塔載部（４）・・・・
・・・・・プリント配線用基板（５）・・・・・・・・
・銅箔
（６）・・・・・・・・貫通穴
（７）・・・・・・・・・凹部
（８）・・・・・・・・金属板
（９）・・・・・・・・接着層
（１０）・・・・・・金属メッキ層
（１１）・・・・・・半導体素子
（１２）・・・・・ボンディングワイヤー特許出願人の
名称
イビデン株式会社
代表者多賀潤一部
第１図
第２図Figures 1 and 2 are vertical cross-sectional views of conventional printed wiring boards;
FIG. 3 is a longitudinal sectional view of a printed wiring board showing the method of manufacturing the printed wiring board of the present invention. (1)...Printed wiring board (2)...
...Conductor circuit (3)...Electronic component mounting section (4)...
...Printed wiring board (5)...
・Copper foil (6)...Through hole (7)...Concavity (8)...Metal plate (9)... ...Adhesive layer (10) ...Metal plating layer (11) ...Semiconductor element (12) ...Name of bonding wire patent applicant Junichi Taga, representative of IBIDEN Co., Ltd. Part 1 Figure 2
Claims (1)
成され、該貫通穴の周辺部に接着層を介して金属板を装
着し、プリント配線用基板と金属板との少くとも接触露
出部分が金属メッキ膜で被覆されていることを特徴とす
る電子部品搭載用基板。 ２、前記貫通穴の周辺部に凹部が形成され、該凹部に接
着層を介して金属板が装着されていることを特徴とする
特許請求の範囲第１項記載の電子部品塔載用基板。 ３、前記プリント配線用基板は有機系樹脂素材のプリン
ト配線用基板から成ることを特徴とする特許請求の範囲
第１項〜第２項記載の電子部品塔載用基板。 ４、プリント配線用基板に貫通穴を形成する工程と、該
貫通穴の周辺部に凹部を形成する工程と、該凹部に接着
層を介して金属板を接合する工程と、スＭホールメッキ
により前記基板と金属板との少くとも接触露出部分に金
属被覆する工程から成る電子部品塔載用基板の製造方法
。[Claims] 1. A through hole is formed in at least one location of the printed wiring board, a metal plate is attached to the periphery of the through hole via an adhesive layer, and the printed wiring board and the metal plate are bonded together. 1. A board for mounting electronic components, characterized in that at least the exposed contact portion of the board is covered with a metal plating film. 2. The electronic component mounting board according to claim 1, wherein a recess is formed around the through hole, and a metal plate is attached to the recess through an adhesive layer. 3. The electronic component mounting board according to claims 1 to 2, wherein the printed wiring board is made of an organic resin material. 4. Forming a through hole in the printed wiring board, forming a recess around the through hole, bonding a metal plate to the recess via an adhesive layer, and through M-hole plating. A method for manufacturing a board for mounting an electronic component, comprising the step of coating at least the contact exposed portion of the board and the metal plate with metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21908783A JPS60111489A (en) | 1983-11-21 | 1983-11-21 | Board for placing electronic parts and method of producing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21908783A JPS60111489A (en) | 1983-11-21 | 1983-11-21 | Board for placing electronic parts and method of producing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60111489A true JPS60111489A (en) | 1985-06-17 |
| JPH0360191B2 JPH0360191B2 (en) | 1991-09-12 |
Family
ID=16730053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21908783A Granted JPS60111489A (en) | 1983-11-21 | 1983-11-21 | Board for placing electronic parts and method of producing same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60111489A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6134990A (en) * | 1984-07-25 | 1986-02-19 | イビデン株式会社 | Substrate for placing electronic part and method of producing same |
| JPS6489547A (en) * | 1987-09-30 | 1989-04-04 | Ibiden Co Ltd | Board for mounting semiconductor element |
| JP2010258260A (en) * | 2009-04-27 | 2010-11-11 | Nec Corp | Heat radiation printed board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59132641U (en) * | 1983-02-25 | 1984-09-05 | 日本電気株式会社 | Substrate for semiconductor devices |
-
1983
- 1983-11-21 JP JP21908783A patent/JPS60111489A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59132641U (en) * | 1983-02-25 | 1984-09-05 | 日本電気株式会社 | Substrate for semiconductor devices |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6134990A (en) * | 1984-07-25 | 1986-02-19 | イビデン株式会社 | Substrate for placing electronic part and method of producing same |
| JPH0446478B2 (en) * | 1984-07-25 | 1992-07-30 | Ibiden Co Ltd | |
| JPS6489547A (en) * | 1987-09-30 | 1989-04-04 | Ibiden Co Ltd | Board for mounting semiconductor element |
| JP2010258260A (en) * | 2009-04-27 | 2010-11-11 | Nec Corp | Heat radiation printed board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0360191B2 (en) | 1991-09-12 |
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