JPS60101742U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS60101742U
JPS60101742U JP1983193376U JP19337683U JPS60101742U JP S60101742 U JPS60101742 U JP S60101742U JP 1983193376 U JP1983193376 U JP 1983193376U JP 19337683 U JP19337683 U JP 19337683U JP S60101742 U JPS60101742 U JP S60101742U
Authority
JP
Japan
Prior art keywords
semiconductor device
semiconductor equipment
bonded
thermal expansion
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983193376U
Other languages
English (en)
Inventor
公一 加藤
敏行 山口
英司 玉田
Original Assignee
株式会社デンソー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社デンソー filed Critical 株式会社デンソー
Priority to JP1983193376U priority Critical patent/JPS60101742U/ja
Publication of JPS60101742U publication Critical patent/JPS60101742U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来例の断面図、第２図は本考案の半導体装置
の断面図、第３図は格子状部材の図、第４図は半田接合
部の詳細図である。 １・・・アルミケース、２・・・アルミナ基板、３・・
・半導体素子、４・・・半田−合部、５・・・格子状部
材。

Claims (1)

  1. 【実用新案登録請求の範囲】 半導体素子とケースの間に部材を介して接合固定した半
    導体装置において、　　− 相互に接合固定する上、下部材の異なる熱膨張係数の中
    間の熱膨張係数を有し、かつ熱伝導が良好な材料で形成
    された格子部材を前記上、部材の゛　　　　　接合部に
    挿入していることを特徴とする半導体装置。
JP1983193376U 1983-12-14 1983-12-14 半導体装置 Pending JPS60101742U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983193376U JPS60101742U (ja) 1983-12-14 1983-12-14 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983193376U JPS60101742U (ja) 1983-12-14 1983-12-14 半導体装置

Publications (1)

Publication Number Publication Date
JPS60101742U true JPS60101742U (ja) 1985-07-11

Family

ID=30415928

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983193376U Pending JPS60101742U (ja) 1983-12-14 1983-12-14 半導体装置

Country Status (1)

Country Link
JP (1) JPS60101742U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04192341A (ja) * 1990-11-24 1992-07-10 Hitachi Ltd 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04192341A (ja) * 1990-11-24 1992-07-10 Hitachi Ltd 半導体装置

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