JPS5993170U - Mounting structure of flat package IC - Google Patents

Mounting structure of flat package IC

Info

Publication number
JPS5993170U
JPS5993170U JP1982190510U JP19051082U JPS5993170U JP S5993170 U JPS5993170 U JP S5993170U JP 1982190510 U JP1982190510 U JP 1982190510U JP 19051082 U JP19051082 U JP 19051082U JP S5993170 U JPS5993170 U JP S5993170U
Authority
JP
Japan
Prior art keywords
mounting structure
flat package
circuit board
printed circuit
metal plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982190510U
Other languages
Japanese (ja)
Other versions
JPS6242549Y2 (en
Inventor
佐々見　輝歳
Original Assignee
三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三洋電機株式会社 filed Critical 三洋電機株式会社
Priority to JP1982190510U priority Critical patent/JPS5993170U/en
Publication of JPS5993170U publication Critical patent/JPS5993170U/en
Application granted granted Critical
Publication of JPS6242549Y2 publication Critical patent/JPS6242549Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図、第２図は夫々フラットパッケージ型ＩＣの上面
図及び断面図、第３図、第４図は夫々本考案取付構造に
利用されるプリント基板の上面図及び断面図、第５図は
金属板の断面図、第６図、第７図は本考案取付構造を示
す断面図である。 １・・・フラットパッケージ型ＩＣ，４・・・プリント
基板、５・・・貫通孔、７・・・金属板、１０・・・接
着剤。 第５図　　− 第６図Figures 1 and 2 are a top view and a sectional view of a flat package type IC, Figures 3 and 4 are a top view and a sectional view of a printed circuit board used in the mounting structure of the present invention, respectively, and Figure 5 is a top view and a sectional view of a flat package type IC. The cross-sectional views of the metal plate, FIGS. 6 and 7, are cross-sectional views showing the mounting structure of the present invention. DESCRIPTION OF SYMBOLS 1... Flat package type IC, 4... Printed circuit board, 5... Through hole, 7... Metal plate, 10... Adhesive. Figure 5 - Figure 6

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] フラットパッケージ型ＩＣをプリント基板に取り付ｔ／
ｉる取付構造に於いて、該プリント基板上の上記ＩＣを
取り付ける箇所に貫通孔を設けると共に、この貫通孔に
下方に放熱部を延在せしめた熱伝導性良好なる金属板を
嵌合し、この金属板上に熱伝導性良好なる接着剤で上記
ＩＣを取り付けた事を特徴とするフラットパッケージ型
ＩＣの取付構造。Attach flat package IC to printed circuit board/
In the mounting structure according to i, a through hole is provided at a location on the printed circuit board to which the above-mentioned IC is attached, and a metal plate having good thermal conductivity and having a heat dissipation portion extending downward is fitted into the through hole, A flat package IC mounting structure characterized in that the above IC is mounted on the metal plate with an adhesive having good thermal conductivity.
JP1982190510U 1982-12-15 1982-12-15 Mounting structure of flat package IC Granted JPS5993170U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982190510U JPS5993170U (en) 1982-12-15 1982-12-15 Mounting structure of flat package IC

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982190510U JPS5993170U (en) 1982-12-15 1982-12-15 Mounting structure of flat package IC

Publications (2)

Publication Number Publication Date
JPS5993170U true JPS5993170U (en) 1984-06-25
JPS6242549Y2 JPS6242549Y2 (en) 1987-10-31

Family

ID=30410468

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982190510U Granted JPS5993170U (en) 1982-12-15 1982-12-15 Mounting structure of flat package IC

Country Status (1)

Country Link
JP (1) JPS5993170U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6252942U (en) * 1985-09-20 1987-04-02
JPS6350092A (en) * 1986-08-20 1988-03-02 株式会社東芝 Hybrid integrated circuit device
JP4726729B2 (en) * 2006-07-24 2011-07-20 シャープ株式会社 Heat dissipation structure for electronic devices

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS482058U (en) * 1971-05-27 1973-01-11
JPS5753674U (en) * 1980-09-12 1982-03-29

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57111066A (en) * 1981-11-09 1982-07-10 Nec Corp Semiconuctor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS482058U (en) * 1971-05-27 1973-01-11
JPS5753674U (en) * 1980-09-12 1982-03-29

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6252942U (en) * 1985-09-20 1987-04-02
JPS6350092A (en) * 1986-08-20 1988-03-02 株式会社東芝 Hybrid integrated circuit device
JP4726729B2 (en) * 2006-07-24 2011-07-20 シャープ株式会社 Heat dissipation structure for electronic devices

Also Published As

Publication number Publication date
JPS6242549Y2 (en) 1987-10-31

Similar Documents

Publication Publication Date Title
JPS5993170U (en) Mounting structure of flat package IC
JPS59119039U (en) Heat dissipation structure for semiconductor devices
JPS58129661U (en) hybrid integrated circuit board
JPS60124094U (en) printed wiring board
JPS60114844U (en) thermal head
JPS5952641U (en) Heat dissipation device for semiconductor package
JPS5937742U (en) Heat dissipation structure
JPS5939991U (en) Mounting device for heat sink to board
JPS6071195U (en) Heat dissipation device in printed circuit board
JPS5989598U (en) heat dissipation device
JPS60121696U (en) Heat dissipation structure of printed circuit board mounting case
JPS5873548U (en) Temperature fuse mounting device
JPH0227759U (en)
JPS59131173U (en) electronic circuit package
JPS5834743U (en) Power diode mounting structure
JPS5961503U (en) chip resistor
JPS5897845U (en) Power IC mounting structure
JPS59127270U (en) printed circuit board equipment
JPS5958947U (en) Semiconductor element mounting equipment
JPS5977234U (en) parts fixing device
JPS58127780U (en) speaker holder
JPS5952643U (en) Heat dissipation device for semiconductor package
JPS59149639U (en) Transistor holding device
JPS60933U (en) IC package mounting structure
JPS5936232U (en) Electrical component