JPS5897845U - Power IC mounting structure - Google Patents

Power IC mounting structure

Info

Publication number
JPS5897845U
JPS5897845U JP19548881U JP19548881U JPS5897845U JP S5897845 U JPS5897845 U JP S5897845U JP 19548881 U JP19548881 U JP 19548881U JP 19548881 U JP19548881 U JP 19548881U JP S5897845 U JPS5897845 U JP S5897845U
Authority
JP
Japan
Prior art keywords
power
mounting structure
heat sink
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19548881U
Other languages
Japanese (ja)
Inventor
浅賀 力
中里 幸夫
Original Assignee
クラリオン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by クラリオン株式会社 filed Critical クラリオン株式会社
Priority to JP19548881U priority Critical patent/JPS5897845U/en
Publication of JPS5897845U publication Critical patent/JPS5897845U/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図a、  bは共に従来例を示す斜視図、第2図a
、  bは共に本考案実施例−を示す斜視図である。 1・・・プリント基板、2・・・パワーIC,−3・・
・放熱板、7・・・サブ放熱板。
Figures 1a and b are both perspective views showing the conventional example, and Figure 2a is a perspective view of the conventional example.
, b are both perspective views showing an embodiment of the present invention. 1... Printed circuit board, 2... Power IC, -3...
- Heat sink, 7...Sub heat sink.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント基板に半田付けされたパワーICがサブ放熱板
により押さえられるようにして放熱板に−取り付けられ
てなることを特徴とするパワーIC取付構造。
A power IC mounting structure characterized in that a power IC soldered to a printed circuit board is attached to a heat sink so as to be pressed by a sub-heat sink.
JP19548881U 1981-12-24 1981-12-24 Power IC mounting structure Pending JPS5897845U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19548881U JPS5897845U (en) 1981-12-24 1981-12-24 Power IC mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19548881U JPS5897845U (en) 1981-12-24 1981-12-24 Power IC mounting structure

Publications (1)

Publication Number Publication Date
JPS5897845U true JPS5897845U (en) 1983-07-02

Family

ID=30108763

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19548881U Pending JPS5897845U (en) 1981-12-24 1981-12-24 Power IC mounting structure

Country Status (1)

Country Link
JP (1) JPS5897845U (en)

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