JPS5984438A - Sheet expansion device - Google Patents

Sheet expansion device

Info

Publication number
JPS5984438A
JPS5984438A JP57193878A JP19387882A JPS5984438A JP S5984438 A JPS5984438 A JP S5984438A JP 57193878 A JP57193878 A JP 57193878A JP 19387882 A JP19387882 A JP 19387882A JP S5984438 A JPS5984438 A JP S5984438A
Authority
JP
Japan
Prior art keywords
sheet
pellets
pellet
expansion
fulcra
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57193878A
Other languages
Japanese (ja)
Inventor
Hideaki Takano
英明 高野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP57193878A priority Critical patent/JPS5984438A/en
Publication of JPS5984438A publication Critical patent/JPS5984438A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0052—Means for supporting or holding work during breaking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)

Abstract

PURPOSE:To enable pellet arrangement to form orderly matrix by making a fulcrum at the time of sheet expansion a straight line as well as by expanding in one direction at first, then in another direction making an angle of 45 deg. with the former direction. CONSTITUTION:On a sheet 4 not yet expanded, breaking is done and a wafer 5 made into pellets is stuck. Under the sheet 4, a cylindrical member 2 including a bilt-in heater and four rollers 6 as fulcra at the time of sheet expansion are arranged. Four sides of the sheet 4 are fixed by supporting plates 7 respectively. When a couple of the supporting plates 7 which support opposed sides of the sheet 4 are pressed down and then another couple of the plates are pressed down successively to expand the sheet 4 in each direction in turn, fulcra become straight lines and uniform force effects on the sheet 4 so that the pellet arrangement becomes orderly matrix. Therefore registration of the pellets in process of pellet automatically pick-up operation with collet becomes easy.

Description

【発明の詳細な説明】 本発明はブレーキング済みのウェハーを接着した伸張性
シートを拡張する装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for expanding a stretchable sheet with bonded broken wafers.

半導体装置の製造工程においては、ウェハーをスクライ
ブし、これをブレーキングして複数個のチップを採取す
る工程がある。この工程には、まず上記ウェハーを粘着
性のある伸張性のシートに張り付け、該ウェハにスクラ
イブとブレーキングをほどこした後、該シートの周囲を
第１図に示したごとく、２枚の支持板１ではさみ、固定
して、その中央部をヒーター内蔵の円筒形部材２で加熱
し、筒状の部材３を支点にし、前記支持板１を下方に押
し、下げる工程がある。このようにすれば、シート４は
伸張性に富んでいるので、すでにブレーキングされてい
るウェハー５のペレットの間隔は、該ペレットが、後工
程に使用するコレットに吸着されるだけの寸法にまで広
げられる。しかし、上記方法では、第３図（ａ）に示す
ようにシート４が筒状の部材３の中心から放射状に均一
に拡張されるため、ペレット配列は整然としたマトリッ
クス状とはなりがたく、凸形に湾曲した２次元配列とな
る傾向が強かった。しかるに、ペレットのコレットによ
る採取は自動化された機構で行なわれるものであるから
、上述のような現象が現れるとペレットの位置合せに相
当時間がかかったり１位置合わせ不能なペレットも現わ
れるという問題がある。尚、第１図（ａ）は第１図ｔｂ
＞のＡ−Ａ部の断面図である。2. Description of the Related Art In the manufacturing process of semiconductor devices, there is a process of scribing a wafer, braking the wafer, and collecting a plurality of chips. In this process, the wafer is first pasted on a sticky stretchable sheet, the wafer is scribed and braked, and then two support plates are placed around the sheet as shown in Figure 1. There is a step of sandwiching and fixing the support plate 1 with the support plate 1, heating the center part with a cylindrical member 2 with a built-in heater, and using the cylindrical member 3 as a fulcrum to push the support plate 1 downward and lower it. In this way, since the sheet 4 is highly stretchable, the interval between the pellets of the wafer 5 that has already been braked can be reduced to a size that allows the pellets to be attracted to the collet used in the subsequent process. It can be expanded. However, in the above method, as the sheet 4 is uniformly expanded radially from the center of the cylindrical member 3 as shown in FIG. There was a strong tendency to form a curved two-dimensional array. However, since the collection of pellets with a collet is performed by an automated mechanism, when the above-mentioned phenomenon occurs, there is a problem that it takes a considerable amount of time to align the pellets, and some pellets may not be aligned at all. . In addition, Fig. 1(a) is Fig. 1tb.
> is a cross-sectional view of the AA section.

そこで、本発明はこうした欠点を無くすためのもので、
シート拡張時の支点を直線にすることにより、また、一
方向にまず伸ばし、つづいて前記方向と直角方向に伸ば
すことにより、ペレット配列を整然としたマトリックス
状とならしめることを目的としている。Therefore, the present invention is aimed at eliminating these drawbacks.
By making the fulcrum at the time of sheet expansion into a straight line, and by first stretching in one direction and then in a direction perpendicular to said direction, the purpose is to arrange the pellets in an orderly matrix.

本発明の特徴はブレーキング済みの半導体ウェハーを接
着したシートの周辺部を保持して該シート中央部を加熱
し、該シートを引き伸ばして、所定のペレット間隔を得
る拡張装置において、該シートを伸ばす支点が直線とな
る部品を有し、一方向にまず伸ばし、つづいて前記方向
と直角方向に伸ばす手段を有したシート拡張装置にある
。The feature of the present invention is to hold the periphery of a sheet to which broken semiconductor wafers are bonded, heat the central part of the sheet, and stretch the sheet in an expansion device to obtain a predetermined pellet spacing. A sheet expanding device having a part whose fulcrum is a straight line and having means for first stretching in one direction and then in a direction perpendicular to said direction.

以下図を用い詳細に説明する。This will be explained in detail below using figures.

第２図は本発明による拡張装置の実施例の構造を示す断
面図（ａ）と平面図（ｂ）である。尚、平面図（ｂ）の
Ａ−Ａ部の断面が（ａ）である。未だ伸張されていない
シート４上にブレーキングが施されペレット状となされ
たウェハ５が張りつけられており、その一方で該シート
の下部には、ヒーターを内蔵した円筒形部材２とシート
拡張時の支点となる４本のローラ６が設置しである。ま
た、シートの４辺はそれぞれ支持板７で固定されている
。いま、シートの対辺を支持している一組の支持板を下
方に押し下げ、つづいて他の一組を下方に押し下げるこ
とにより、一方向づつシートを伸ばし、また支点が直線
となりＪシートに均一に力が加わり、ペレット配夛すは
整然としたマトリックス状となる。FIG. 2 is a sectional view (a) and a plan view (b) showing the structure of an embodiment of the expansion device according to the present invention. Note that (a) is a cross section taken along the line A-A in the plan view (b). A wafer 5 which has been braked and made into a pellet is pasted on the sheet 4 which has not yet been expanded, while a cylindrical member 2 with a built-in heater and a cylindrical member 2 with a built-in heater are attached to the bottom of the sheet. Four rollers 6 that serve as fulcrums are installed. Further, each of the four sides of the sheet is fixed by a support plate 7. Now, by pushing down one set of support plates that support the opposite sides of the sheet, and then pushing down the other set, the sheet will be stretched in one direction at a time, and the fulcrum will be a straight line, evenly spread over the J sheet. As force is applied, the pellets are distributed in an orderly matrix.

また、各ペレットの間隔は、支持板の押し下げ量を変更
することにより、可変となる。Further, the interval between each pellet can be changed by changing the amount by which the support plate is pushed down.

本発明による拡張装置を用いれば、第３図（ｂ）のよう
に拡張されるので、コレットによるペレット自動採取時
にペレットの位置合わせが容易になり、また、位置合わ
せ不能という問題もなくなり、作業性が著しく向上する
という効果がある。If the expansion device according to the present invention is used, it will be expanded as shown in FIG. 3(b), so it will be easier to align the pellets when automatically collecting pellets using a collet, and the problem of inability to align will be eliminated, improving work efficiency. This has the effect of significantly improving.

【図面の簡単な説明】[Brief explanation of drawings]

第１図（ａ）は従来のシート拡張機構の断面図、（ｂ）
は従来のシート拡張機構の平面図、第２図（ａｌは本発
明による拡張機構の断面図、第２図ｔｂ）は本発明によ
る拡張機構の平面図、第３図（ａ）は従来のシート拡張
機構により拡大されたシートの伸び状態図、第３図（ｂ
）は本発明によるシート拡張機構により拡大されたシー
トの状態図である。 図中、１・・・・・・旧装置のシート支持板、２・・・
・・・ヒータ内蔵円筒部材、３・・・・・・筒状部材、
４・・・・・・シート、５・・・・・・ブレーキング済
みウエノ）−１６・・・・・・ローラー、７・・・・・
・シート支持板、８・・・・・・ペレットである。 （（１）’ （ｉ￥２ 偵　１　図 ｔ−ｅ） 笑２図 （θう （１−） 菓３図Figure 1 (a) is a sectional view of a conventional seat expansion mechanism, (b)
is a plan view of a conventional seat expansion mechanism, FIG. 2 (al is a sectional view of the expansion mechanism according to the present invention, FIG. 2 tb) is a plan view of the expansion mechanism according to the present invention, and FIG. Fig. 3 (b)
) is a state diagram of a sheet expanded by the sheet expansion mechanism according to the present invention. In the figure, 1... Seat support plate of the old device, 2...
... Cylindrical member with a built-in heater, 3... Cylindrical member,
4... Seat, 5... Braked Ueno)-16... Roller, 7...
- Sheet support plate, 8... pellets. ((1)' (i￥2 rectification 1 figure t-e) lol 2 figure (θu (1-) ka 3 figure

Claims (1)

【特許請求の範囲】[Claims] ブレーキング済みの半導体ウェハーを接着したシートの
周辺部を保持して該シート中央部を加熱し、該シートを
引き伸ばして、所定のペレット間隔を得る拡張装置にお
いて、該シー　トを伸ばす支点が直線となる部品を有し
、一方向にまず伸ばし、つづいて前記方向と直角方向に
伸ばす手段を有することを特徴としたシート拡張装置。In an expansion device that holds the periphery of a sheet to which broken semiconductor wafers are adhered, heats the center of the sheet, and stretches the sheet to obtain a predetermined pellet spacing, the fulcrum for stretching the sheet is a straight line. 1. A sheet expanding device comprising: first stretching in one direction and then means for stretching in a direction perpendicular to said direction.
JP57193878A 1982-11-04 1982-11-04 Sheet expansion device Pending JPS5984438A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57193878A JPS5984438A (en) 1982-11-04 1982-11-04 Sheet expansion device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57193878A JPS5984438A (en) 1982-11-04 1982-11-04 Sheet expansion device

Publications (1)

Publication Number Publication Date
JPS5984438A true JPS5984438A (en) 1984-05-16

Family

ID=16315241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57193878A Pending JPS5984438A (en) 1982-11-04 1982-11-04 Sheet expansion device

Country Status (1)

Country Link
JP (1) JPS5984438A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01205443A (en) * 1988-02-10 1989-08-17 Nec Corp Sheet stretching mechanism
EP0720521A1 (en) * 1994-07-20 1996-07-10 Loomis Industries, Inc. Apparatus and method for dicing semiconductor wafers
FR2794443A1 (en) * 1999-06-02 2000-12-08 Commissariat Energie Atomique METHOD FOR TRANSFERRING ELEMENTS AND DEVICE FOR TRANSFERRING THE SAME
JP2012204747A (en) * 2011-03-28 2012-10-22 Tokyo Seimitsu Co Ltd Chip division and separation apparatus, and chip division and separation method
JP2014022382A (en) * 2012-07-12 2014-02-03 Disco Abrasive Syst Ltd Tape extension device
JP2014207358A (en) * 2013-04-15 2014-10-30 株式会社ディスコ Tape extension device
JP2014232843A (en) * 2013-05-30 2014-12-11 株式会社東京精密 Work dividing device and work dividing method
JP2017045898A (en) * 2015-08-27 2017-03-02 株式会社村田製作所 Film extension device and manufacturing method for electronic component using the same

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01205443A (en) * 1988-02-10 1989-08-17 Nec Corp Sheet stretching mechanism
EP0720521A1 (en) * 1994-07-20 1996-07-10 Loomis Industries, Inc. Apparatus and method for dicing semiconductor wafers
EP0720521A4 (en) * 1994-07-20 1996-12-18 Loomis Ind Inc Apparatus and method for dicing semiconductor wafers
FR2794443A1 (en) * 1999-06-02 2000-12-08 Commissariat Energie Atomique METHOD FOR TRANSFERRING ELEMENTS AND DEVICE FOR TRANSFERRING THE SAME
WO2000075968A1 (en) * 1999-06-02 2000-12-14 Commissariat A L'energie Atomique Method for transferring elements and device enabling said transfer
JP2012204747A (en) * 2011-03-28 2012-10-22 Tokyo Seimitsu Co Ltd Chip division and separation apparatus, and chip division and separation method
JP2014022382A (en) * 2012-07-12 2014-02-03 Disco Abrasive Syst Ltd Tape extension device
JP2014207358A (en) * 2013-04-15 2014-10-30 株式会社ディスコ Tape extension device
JP2014232843A (en) * 2013-05-30 2014-12-11 株式会社東京精密 Work dividing device and work dividing method
JP2017045898A (en) * 2015-08-27 2017-03-02 株式会社村田製作所 Film extension device and manufacturing method for electronic component using the same

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