JPS5982788A - Printed circuit board - Google Patents
Printed circuit boardInfo
- Publication number
- JPS5982788A JPS5982788A JP19305382A JP19305382A JPS5982788A JP S5982788 A JPS5982788 A JP S5982788A JP 19305382 A JP19305382 A JP 19305382A JP 19305382 A JP19305382 A JP 19305382A JP S5982788 A JPS5982788 A JP S5982788A
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- printed wiring
- wiring board
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は電気機器、産業機器、電子機器、計算機器等に
用いられるプリント配線板に関するもので、その目的と
するところは電気絶縁性劣化のないプリント配線板を提
供することにある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a printed wiring board used in electrical equipment, industrial equipment, electronic equipment, computing equipment, etc., and its purpose is to provide a printed wiring board without deterioration of electrical insulation properties. There is a particular thing.
従来、回路形成したプリント配線基板回路面は部品塔載
金ＭＪｊｌ出部以外に液状ソルダーレジストを塗布し後
工程及使用時の加熱や吸湿によるプリント配線板の電気
絶縁性劣化を防止しているが回路面ば回路部が凸状、回
路間部が凹状を呈しているため液状ソルダーレジストは
回路部の凸状部では塗布厚みが極度に薄くなシ殆んど厚
みがつかず１回路間部の凹状部では回路部の凸状部から
流下（１）
する塗布物のため塗布厚みが極度に厚くなるのは避けら
れなく電気絶縁性劣化防止のためには塗布回数を数回反
復する必要がありそれでも回路部の厚み不足からくる電
気絶縁性劣化、短絡現象を惹起していた。Conventionally, liquid solder resist was applied to the circuit surface of the printed wiring board on which the circuit was formed, other than the exposed parts of the component mounting metal, to prevent electrical insulation deterioration of the printed wiring board due to heat and moisture absorption during post-processing and use. Since the circuit surface has a convex shape and the area between circuits has a concave shape, the liquid solder resist has an extremely thin coating thickness on the convex areas of the circuit area, and the coating thickness is almost non-existent in the area between one circuit. Since the coating material flows down (1) from the convex part of the circuit part in the concave part, it is unavoidable that the coating thickness becomes extremely thick, and it is necessary to repeat the application several times to prevent deterioration of the electrical insulation. Even so, the lack of thickness in the circuit section caused electrical insulation to deteriorate and short circuits to occur.
本発明は上記欠点を解決するもので、回路形成したプリ
ント配線基板回路面の部品塔載金属露出部以外をドライ
フィルムでシールしたプリント配線板のため回路部、回
路間部の被覆層の厚みが均−ｆあり且つピンホール等の
心配もなく東に反復塗布の必要がないため短期間で電気
絶縁性劣化のないプリント配線板を得ることができるも
のであげ次のようである。＠１図に示すようにフェノー
ル樹脂、エポキシ樹脂、不飽和ポリエステル樹脂、メラ
ミン樹脂、ポリイミド、ポリブタジェン、ポリアミド、
ポリアミドイミド、ポリスルフォン、ポリブチレンテレ
フタレート、ポリエーテルエーテルケトン、弗化樹脂等
の単独、変性物、混合（２）
物等から々る積層板用樹脂液をガラス、アスベスト等の
無機繊維やポリエステル、ポリアミド、ポリビニルアル
コール、アクリル等の有機合成繊維や木綿等の天然繊維
からなる織布、不織布、マット或は紙等の積層板用基材
に含浸したプリプレグを所要枚数重ね史にその最外層に
銅箔、アルミニウム箔、真鍮箔、ニッケル箔等の金属箔
を重ねた積層体を加熱加圧成Ｊしｊ２てなる金属箔張り
積層板にスルホール処理やプリント配線等の回路１を形
成したプリント配線基板２回路面のランドやチップ部品
塔載部等の部品塔載金属露出部３以外をポリエステルフ
ィルム、高錯化アセテートフィルム、アセテートフィル
ム、ポリスチレン系フィルム、ビール［を脂系フィルム
等のドライフィルム４ （例えば商品名、リストン７３
０ＦＲ）でシールしたものであるため回路部、回路間部
の被榎厚みが均一で且つピンホールがなく更に短期間で
電気絶縁性劣化のないプリント配線板を得ることができ
るものである。ドライフィルムの厚みは特に限定するも
ので力（必要とする電気絶縁性の程度により（３）
厚みを任意に選択できるものである。々おドライフィル
ムは好捷しくはソルダーレジスト用ドライフィルムを用
いることが望ましい。加えて本発明は片面回路板、両面
回路板の如何を問わず適用されるものである。The present invention solves the above-mentioned drawbacks, and because the printed wiring board on which circuits are formed is sealed with a dry film on the circuit surface other than the exposed metal parts on which the components are mounted, the thickness of the coating layer in the circuit parts and the areas between the circuits is reduced. It is possible to obtain a printed wiring board without deterioration of electrical insulation in a short period of time because it has a uniform f, does not have to worry about pinholes, etc., and does not require repeated coating. @1 As shown in the figure, phenolic resin, epoxy resin, unsaturated polyester resin, melamine resin, polyimide, polybutadiene, polyamide,
Polyamide-imide, polysulfone, polybutylene terephthalate, polyether ether ketone, fluorinated resin, etc. alone, modified products, and mixtures (2). A required number of sheets of prepreg impregnated into a laminate base material such as woven fabric, non-woven fabric, mat, or paper made of organic synthetic fibers such as polyamide, polyvinyl alcohol, and acrylic, and natural fibers such as cotton are coated with copper on the outermost layer. A printed wiring board in which a circuit 1 such as through-hole treatment or printed wiring is formed on a metal foil-clad laminate made by heating and pressing a laminate of metal foils such as foil, aluminum foil, brass foil, nickel foil, etc. 2. The areas other than the exposed metal parts 3, such as the land on the circuit surface and the chip part mounting part, are covered with a dry film 4 such as polyester film, highly complex acetate film, acetate film, polystyrene film, beer film, oil-based film, etc. For example, the product name, Liston 73
Since it is sealed with 0FR), the printed wiring board has a uniform thickness in the circuit portion and the portion between the circuits, has no pinholes, and can produce a printed wiring board without deterioration of electrical insulation in a short period of time. The thickness of the dry film is not particularly limited, and the thickness can be selected arbitrarily depending on the degree of electrical insulation required.It is preferable to use a dry film for solder resist. In addition, the present invention is applicable to both single-sided and double-sided circuit boards.
上記のように本発明によれば電気絶縁性劣化のない、短
絡現象のない安心して使用することのできるプリント配
線板を提供することができるものである。As described above, according to the present invention, it is possible to provide a printed wiring board that is free from deterioration in electrical insulation properties and free from short-circuit phenomena and can be used with peace of mind.
第１図は本発明の一実施例を示す簡略断面図である。
１は回路、２けプリント配線゛基販、３け部品塔載金属
露出部、４はドライフィルムである。
特許出願人
松下電工株式会社
代理人弁理士 竹元敏丸 （ほか２名）（４）FIG. 1 is a simplified sectional view showing one embodiment of the present invention. 1 is a circuit, 2 printed wiring boards, 3 parts with exposed metal parts, and 4 are dry films. Patent applicant Matsushita Electric Works Co., Ltd. Representative patent attorney Toshimaru Takemoto (and 2 others) (4)
Claims (1)
出部以外をドライフィルムでシールしたことを特徴とす
るプリント配線板。A printed wiring board characterized in that the circuit surface of the printed wiring board on which a circuit is formed is sealed with a dry film except for the exposed parts of the metal on which the components are mounted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19305382A JPS5982788A (en) | 1982-11-02 | 1982-11-02 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19305382A JPS5982788A (en) | 1982-11-02 | 1982-11-02 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5982788A true JPS5982788A (en) | 1984-05-12 |
Family
ID=16301395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19305382A Pending JPS5982788A (en) | 1982-11-02 | 1982-11-02 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5982788A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55166992A (en) * | 1979-06-14 | 1980-12-26 | Tokyo Shibaura Electric Co | Method of manufacturing printed circuit board |
| JPS5759396A (en) * | 1980-09-26 | 1982-04-09 | Hitachi Chemical Co Ltd | Method of producing printed circuit board |
| JPS5867097A (en) * | 1981-10-16 | 1983-04-21 | 日立化成工業株式会社 | Method of producing printed circuit board |
-
1982
- 1982-11-02 JP JP19305382A patent/JPS5982788A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55166992A (en) * | 1979-06-14 | 1980-12-26 | Tokyo Shibaura Electric Co | Method of manufacturing printed circuit board |
| JPS5759396A (en) * | 1980-09-26 | 1982-04-09 | Hitachi Chemical Co Ltd | Method of producing printed circuit board |
| JPS5867097A (en) * | 1981-10-16 | 1983-04-21 | 日立化成工業株式会社 | Method of producing printed circuit board |
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