JPS5944669U - Laser bonding chip - Google Patents

Laser bonding chip

Info

Publication number
JPS5944669U
JPS5944669U JP1982139137U JP13913782U JPS5944669U JP S5944669 U JPS5944669 U JP S5944669U JP 1982139137 U JP1982139137 U JP 1982139137U JP 13913782 U JP13913782 U JP 13913782U JP S5944669 U JPS5944669 U JP S5944669U
Authority
JP
Japan
Prior art keywords
tip
laser bonding
laser
bonding chip
passage hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982139137U
Other languages
Japanese (ja)
Other versions
JPS6350867Y2 (en
Inventor
後藤 正伯
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP1982139137U priority Critical patent/JPS5944669U/en
Publication of JPS5944669U publication Critical patent/JPS5944669U/en
Application granted granted Critical
Publication of JPS6350867Y2 publication Critical patent/JPS6350867Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案によるレーザーボンディングチップを示
す中央縦断面図、第2図はその底面図、第3図はレーザ
ーボンディングチップの下部を示す要部断面図、第4図
はその先端部を示す要部断面図、第5図はリード線が密
集した部分の半田めっきパッドに本考案によるレーザニ
ボンテインクチップを使用してリード線を半田付けする
状態を示す説明図である。 1・・・・・・レーザーボンディングチップ、2・・・
用中心軸、3・・・・・・レーザー光通過孔、4・・・
・・・レーザー 光、7・・・・・・先端部、8・・・
・・・射出口、9・・・・・・プリン −ト基板、10
・・・・・・半田めっきパッド、11・・・・・四−ド
線、12・・・・・・端面。
Fig. 1 is a central vertical sectional view showing the laser bonding chip according to the present invention, Fig. 2 is a bottom view thereof, Fig. 3 is a sectional view of essential parts showing the lower part of the laser bonding chip, and Fig. 4 shows its tip. FIG. 5 is a sectional view of a main part, and is an explanatory view showing a state in which lead wires are soldered to solder plating pads in areas where lead wires are densely packed using the laser bonding chip according to the present invention. 1... Laser bonding chip, 2...
Center axis for use, 3... Laser light passage hole, 4...
...Laser light, 7...Tip, 8...
...Injection port, 9...Printed circuit board, 10
...Solder plating pad, 11...4-wire, 12...End face.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] レーザー光を照射して半田めっきパッドにリード線を半
田付けするレーザーボンディングにおいて、中心軸部に
先端に行くに従って先細とされたレーザー光通過孔を有
すると共にこの通過孔の内周面は光を反射するように仕
上げ5れ、外形は先端に行くに従って先細とされた細長
い円錐形とされ、その先端にはレーザー光の射出口を有
すると共に上記リード線を押圧する端面が形成されたこ
とを特徴とするレーザーボンディングチップ。
In laser bonding, in which lead wires are soldered to solder-plated pads by irradiating laser light, the central shaft has a laser light passage hole that tapers toward the tip, and the inner circumferential surface of this passage hole reflects light. The outer shape is an elongated conical shape that tapers toward the tip, and the tip has an exit port for the laser beam and an end surface for pressing the lead wire. Laser bonding chip.
JP1982139137U 1982-09-14 1982-09-14 Laser bonding chip Granted JPS5944669U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982139137U JPS5944669U (en) 1982-09-14 1982-09-14 Laser bonding chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982139137U JPS5944669U (en) 1982-09-14 1982-09-14 Laser bonding chip

Publications (2)

Publication Number Publication Date
JPS5944669U true JPS5944669U (en) 1984-03-24
JPS6350867Y2 JPS6350867Y2 (en) 1988-12-27

Family

ID=30311955

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982139137U Granted JPS5944669U (en) 1982-09-14 1982-09-14 Laser bonding chip

Country Status (1)

Country Link
JP (1) JPS5944669U (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU662893B2 (en) * 1992-01-17 1995-09-21 S.L.T. Japan Co., Ltd. Method of brazing
JP2013219404A (en) * 2013-08-02 2013-10-24 Sumida Corporation Method for manufacturing antenna component

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50157068A (en) * 1974-06-07 1975-12-18
JPS51115629A (en) * 1975-03-14 1976-10-12 Lindstroem Olle Battery

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50157068A (en) * 1974-06-07 1975-12-18
JPS51115629A (en) * 1975-03-14 1976-10-12 Lindstroem Olle Battery

Also Published As

Publication number Publication date
JPS6350867Y2 (en) 1988-12-27

Similar Documents

Publication Publication Date Title
JPS5944669U (en) Laser bonding chip
JPS6083232U (en) chip parts
JPS60172360U (en) Printed board
JPS6045442U (en) Leadless chip carrier
JPS6059562U (en) Mounting structure of high-density circuit package
JPS59103449U (en) Mounting structure of semiconductor package
JPS60106375U (en) Mounting structure of external lead terminal
JPS592146U (en) Electronic component package
JPS60194376U (en) Multilayer wiring board pattern
JPS59140437U (en) Solder for bonding semiconductor elements
JPS60141145U (en) Electronic component lead structure
JPS60166150U (en) Lead frame for integrated circuit devices
JPS582881U (en) terminal connection tool
JPS5936271U (en) printed wiring board
JPS5967970U (en) printed wiring body
JPS58162664U (en) Electronic component assembly structure
JPS5829845U (en) Lead pin shape of ceramic multilayer wiring board
JPS6079775U (en) integrated circuit device
JPS5895045U (en) integrated circuit
JPS58190836U (en) head
JPS60149171U (en) Printed board
JPH0436249U (en)
JPS5952633U (en) high frequency element
JPS59131176U (en) bonding equipment
JPH0345683U (en)