JPS5944669U - Laser bonding chip - Google Patents
Laser bonding chipInfo
- Publication number
- JPS5944669U JPS5944669U JP1982139137U JP13913782U JPS5944669U JP S5944669 U JPS5944669 U JP S5944669U JP 1982139137 U JP1982139137 U JP 1982139137U JP 13913782 U JP13913782 U JP 13913782U JP S5944669 U JPS5944669 U JP S5944669U
- Authority
- JP
- Japan
- Prior art keywords
- tip
- laser bonding
- laser
- bonding chip
- passage hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は本考案によるレーザーボンディングチップを示
す中央縦断面図、第2図はその底面図、第3図はレーザ
ーボンディングチップの下部を示す要部断面図、第4図
はその先端部を示す要部断面図、第5図はリード線が密
集した部分の半田めっきパッドに本考案によるレーザニ
ボンテインクチップを使用してリード線を半田付けする
状態を示す説明図である。
1・・・・・・レーザーボンディングチップ、2・・・
用中心軸、3・・・・・・レーザー光通過孔、4・・・
・・・レーザー 光、7・・・・・・先端部、8・・・
・・・射出口、9・・・・・・プリン −ト基板、10
・・・・・・半田めっきパッド、11・・・・・四−ド
線、12・・・・・・端面。Fig. 1 is a central vertical sectional view showing the laser bonding chip according to the present invention, Fig. 2 is a bottom view thereof, Fig. 3 is a sectional view of essential parts showing the lower part of the laser bonding chip, and Fig. 4 shows its tip. FIG. 5 is a sectional view of a main part, and is an explanatory view showing a state in which lead wires are soldered to solder plating pads in areas where lead wires are densely packed using the laser bonding chip according to the present invention. 1... Laser bonding chip, 2...
Center axis for use, 3... Laser light passage hole, 4...
...Laser light, 7...Tip, 8...
...Injection port, 9...Printed circuit board, 10
...Solder plating pad, 11...4-wire, 12...End face.
Claims (1)
田付けするレーザーボンディングにおいて、中心軸部に
先端に行くに従って先細とされたレーザー光通過孔を有
すると共にこの通過孔の内周面は光を反射するように仕
上げ5れ、外形は先端に行くに従って先細とされた細長
い円錐形とされ、その先端にはレーザー光の射出口を有
すると共に上記リード線を押圧する端面が形成されたこ
とを特徴とするレーザーボンディングチップ。In laser bonding, in which lead wires are soldered to solder-plated pads by irradiating laser light, the central shaft has a laser light passage hole that tapers toward the tip, and the inner circumferential surface of this passage hole reflects light. The outer shape is an elongated conical shape that tapers toward the tip, and the tip has an exit port for the laser beam and an end surface for pressing the lead wire. Laser bonding chip.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1982139137U JPS5944669U (en) | 1982-09-14 | 1982-09-14 | Laser bonding chip |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1982139137U JPS5944669U (en) | 1982-09-14 | 1982-09-14 | Laser bonding chip |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5944669U true JPS5944669U (en) | 1984-03-24 |
JPS6350867Y2 JPS6350867Y2 (en) | 1988-12-27 |
Family
ID=30311955
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1982139137U Granted JPS5944669U (en) | 1982-09-14 | 1982-09-14 | Laser bonding chip |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5944669U (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU662893B2 (en) * | 1992-01-17 | 1995-09-21 | S.L.T. Japan Co., Ltd. | Method of brazing |
JP2013219404A (en) * | 2013-08-02 | 2013-10-24 | Sumida Corporation | Method for manufacturing antenna component |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50157068A (en) * | 1974-06-07 | 1975-12-18 | ||
JPS51115629A (en) * | 1975-03-14 | 1976-10-12 | Lindstroem Olle | Battery |
-
1982
- 1982-09-14 JP JP1982139137U patent/JPS5944669U/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50157068A (en) * | 1974-06-07 | 1975-12-18 | ||
JPS51115629A (en) * | 1975-03-14 | 1976-10-12 | Lindstroem Olle | Battery |
Also Published As
Publication number | Publication date |
---|---|
JPS6350867Y2 (en) | 1988-12-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5944669U (en) | Laser bonding chip | |
JPS6083232U (en) | chip parts | |
JPS60172360U (en) | Printed board | |
JPS6045442U (en) | Leadless chip carrier | |
JPS6059562U (en) | Mounting structure of high-density circuit package | |
JPS59103449U (en) | Mounting structure of semiconductor package | |
JPS60106375U (en) | Mounting structure of external lead terminal | |
JPS592146U (en) | Electronic component package | |
JPS60194376U (en) | Multilayer wiring board pattern | |
JPS59140437U (en) | Solder for bonding semiconductor elements | |
JPS60141145U (en) | Electronic component lead structure | |
JPS60166150U (en) | Lead frame for integrated circuit devices | |
JPS582881U (en) | terminal connection tool | |
JPS5936271U (en) | printed wiring board | |
JPS5967970U (en) | printed wiring body | |
JPS58162664U (en) | Electronic component assembly structure | |
JPS5829845U (en) | Lead pin shape of ceramic multilayer wiring board | |
JPS6079775U (en) | integrated circuit device | |
JPS5895045U (en) | integrated circuit | |
JPS58190836U (en) | head | |
JPS60149171U (en) | Printed board | |
JPH0436249U (en) | ||
JPS5952633U (en) | high frequency element | |
JPS59131176U (en) | bonding equipment | |
JPH0345683U (en) |