JPS6120734A - Non-alkali glass cloth base material of prepreg for printed wiring board - Google Patents
Non-alkali glass cloth base material of prepreg for printed wiring boardInfo
- Publication number
- JPS6120734A JPS6120734A JP59142917A JP14291784A JPS6120734A JP S6120734 A JPS6120734 A JP S6120734A JP 59142917 A JP59142917 A JP 59142917A JP 14291784 A JP14291784 A JP 14291784A JP S6120734 A JPS6120734 A JP S6120734A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- base material
- prepreg
- wiring board
- glass cloth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Woven Fabrics (AREA)
- Laminated Bodies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［技術分野］
本発明はプリント配線基板として好適に採用できるプリ
プレグの無アルカリガラス布基材に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a prepreg alkali-free glass cloth base material that can be suitably employed as a printed wiring board.
［背景技術］
従来のガラス布を基材として樹脂を含浸させ乾燥させて
得たプリプレグを積層成形して形成した積層板は寸法収
縮量が大きく、収縮による異方性により、プリント配線
板として採用すれば、例えば自動実装槻での部品実装ミ
スが多く信頼性に欠けるものであった。[Background technology] A laminate formed by laminating and molding a prepreg obtained by impregnating a conventional glass cloth with a resin and drying it as a base material has a large amount of dimensional shrinkage, and due to the anisotropy caused by the shrinkage, it is used as a printed wiring board. As a result, for example, there were many component mounting errors in automatic mounting tools, resulting in a lack of reliability.
［発明の目的］
本発明は上記事情に鑑みて為されたものであり、その目
的とするところは、プリント配線板の寸法安定性を着し
く向上させ、異方性がなく、確実な部品実装を可能とさ
せることにある。[Object of the Invention] The present invention has been made in view of the above circumstances, and its purpose is to significantly improve the dimensional stability of printed wiring boards, eliminate anisotropy, and ensure reliable component mounting. The goal is to make it possible.
［発明の開示］
本発明の無アルカリガラス布基材は、ＥＣＧ７５−１１
０の単糸又は相当する単糸を用い、２５ｃｍあたりの縦
糸と横糸の打ち込み本数ＸとＹが
３７≦Ｘ≦４４
０．８７１Ｘ＋１．７≦Ｙ≦０．８７１Ｘ＋４．６を満
足する平織り構成されてなるものであり、この構成によ
り上記目的を達成できたものである。[Disclosure of the Invention] The alkali-free glass cloth base material of the present invention has ECG75-11
0 single yarn or equivalent single yarn is used, and the plain weave is constructed such that the numbers of warp and weft threads per 25 cm, X and Y, satisfy 37≦X≦44 0.871X+1.7≦Y≦0.871X+4.6 With this configuration, the above object can be achieved.
以下本発明の詳細な親切する。The detailed description of the present invention will be kindly explained below.
本発明で用いる縦糸と横糸はＪＩＳ Ｒ３４１３で規定
されるＥＣＧ７５− Ｉｌｏの単糸又は相当する単糸で
ある。The warp and weft used in the present invention are ECG75-Ilo single yarns defined in JIS R3413 or equivalent single yarns.
ここでＥとは無アルカリガラス、Ｃとは長繊維、Ｇとは
糸径が９ミクロン、７５とは番手をいい、７５Ｘ１００
Ｙｄ／１ｂを示し、Ｉｌｏとは単糸を意味している。本
発明にあってはこの縦糸と横糸の２５ｃｍあたりの打ち
込み本数ＸとＹとカ３７≦Ｘ≦４４．０．８７１Ｘ＋１
．７≦Ｙ≦０．８７１Ｘ十４．６の関係を満足するよう
に平織りされていることが必須要件である。この特定の
関係を満足させることにより縦方向と横方向の寸法変化
の絶対値とその均衡に影響を与え、この無アルカリガラ
ス布基材により得たプリプレグにより形成したプリント
配線板の寸法安定性を向上させるのもである。尚、プリ
プレグはこの無アルカリがラス布基材にフェノール樹脂
、エポキシ樹脂、エリア樹脂、不飽和ポリエステル樹脂
のなどのような熱硬化性樹。Here, E means alkali-free glass, C means long fibers, G means thread diameter of 9 microns, and 75 means count, 75X100.
Yd/1b is shown, and Ilo means single yarn. In the present invention, the number of the warp and weft threads per 25 cm is X, Y, and 37≦X≦44.0.871X+1
．． It is essential that the plain weave satisfies the relationship 7≦Y≦0.871X14.6. Satisfying this specific relationship affects the absolute value and balance of dimensional changes in the vertical and lateral directions, and improves the dimensional stability of printed wiring boards formed from prepreg obtained using this alkali-free glass cloth base material. It is also about improving. In addition, prepreg is made of a thermosetting resin such as phenolic resin, epoxy resin, area resin, unsaturated polyester resin, etc. on the base material of non-alkali lath cloth.
脂を含浸乾燥させて形成し、このプリプレグを所要枚数
積層成形し、その両面又は片面に銅箔、アルミニウム笛
、ステンレス鋼箔などの金属箔を貼着してプリント配線
板を形成する。プリント配線板としては多層であっても
よい。A printed wiring board is formed by impregnating and drying fat, laminating a required number of prepregs, and pasting metal foil such as copper foil, aluminum foil, or stainless steel foil on both or one side of the prepreg. The printed wiring board may have multiple layers.
次に上述した事実を実証するために、本発明の詳細な説
明する。尚、本発明は以下の実施例に限定されるもので
はない。The present invention will now be described in detail to demonstrate the above facts. Note that the present invention is not limited to the following examples.
（実施例）
縦糸及び横糸としてＥＣに７５−１１０の単糸を用い２
５ｃＩ１１あたりの打ち込み本数Ｘ、Ｙをそれぞれ３９
本及び３６本として平織り構成し、重さ２０６ｇ／ｍ２
、厚さ０．１８ｍｍの無アルカリガラス布基材を形成し
た。(Example) Using 75-110 single yarn for EC as warp and weft 2
The number of implants X and Y per 5cI11 are each 39
Plain weave construction with 36 pieces, weight 206g/m2
, an alkali-free glass cloth substrate having a thickness of 0.18 mm was formed.
次いで、この無アルカリがラス布基材にエポキシ樹脂（
ビスフェノール八タイプ、エポキシ当量４５０〜５５０
）１００重量部、ジシアンジアミド３重量部、２−メチ
ルイミダゾール０．１重量部からなる熱硬化性樹脂組成
物を含浸させ１７０℃、８０秒かけて乾燥硬化させ、樹
脂含有量４５重量％のプリプレグを得た。Next, this alkali-free material is coated with epoxy resin (
Eight types of bisphenols, epoxy equivalent 450-550
), 3 parts by weight of dicyandiamide, and 0.1 part by weight of 2-methylimidazole was impregnated with a thermosetting resin composition and dried and cured at 170°C for 80 seconds to form a prepreg with a resin content of 45% by weight. Obtained.
この後、図面に示すよ、うに、プリプレグを８枚積み重
ねて積層基材１を形成し、その両面に厚み１８ミクロン
の銅９ｉ２を載置し、圧力４０ｋｇ／ｃ＋＋＋２、温度
１７０℃、時間１２０分で積層成形し、両面銅張プリン
ト配線板式を得た。After that, as shown in the drawing, 8 sheets of prepreg were stacked to form the laminated base material 1, and copper 9i2 with a thickness of 18 microns was placed on both sides of the base material 1, and the pressure was 40 kg/c++2, the temperature was 170°C, and the time was 120 minutes. Laminate molding was performed to obtain a double-sided copper-clad printed wiring board type.
この銅張プリント配線板へにエツチングを施し、温度８
０°Ｃで３０分間、次いで温度１７０℃で３０分間熱処
理した後の縦、横の寸法変化率を測定した。結果を第１
表に示す。Etching is applied to this copper-clad printed wiring board, and temperature 8
After heat treatment at 0°C for 30 minutes and then at a temperature of 170°C for 30 minutes, the vertical and horizontal dimensional change rates were measured. Results first
Shown in the table.
（比較例）
２５ｃｍあたりの打ち込み本数ＸＳＹをそれぞれ４４本
及び３４本とした以外は実施例と同様にして両面銅張プ
リント配線板を得、実施例と同様の条件で処理を施した
後、寸法変化率を測定した。結果を第１表に示す。(Comparative example) A double-sided copper-clad printed wiring board was obtained in the same manner as in the example except that the number of implants XSY per 25 cm was 44 and 34, respectively. After processing under the same conditions as in the example, the dimensions were The rate of change was measured. The results are shown in Table 1.
第１表
第１表の結果より、本発明の実施例により形成したプリ
ント配線板の寸法変化率は、比較例のものとは１オーグ
低く、自動実装機での部品実装ミスは１７１０以下とな
った。Table 1 From the results shown in Table 1, the dimensional change rate of the printed wiring board formed according to the example of the present invention is 1 og lower than that of the comparative example, and the number of component mounting errors by the automatic mounting machine is 1710 or less. Ta.
［発明の効果］
本発明にあっては、ＥＣＧ７５− Ｉｌｏの単糸又は相
当する単糸を用い、２５ｃｍあたりの縦糸と横糸の打ち
込み本数ＸとＹが
３７≦Ｘ≦４４
０．８７１Ｘ＋ １．７≦Ｙ≦０．８７１Ｘ＋４．６を
満足する平織゛り構成されているので、この特定の関係
を満足させることにより縦方向と横方向の寸法変化の絶
対値を小さくすると共にその均衡を図ることができ、こ
の無アルカリガラス布基材により得たプリプレグにより
形成したプリント配線板の寸法安定性を向上させ、異方
性をなくすことができるものであり、従って確実な部品
実装を可能とさせ、信頼性を高めることができる。[Effects of the Invention] In the present invention, ECG75-Ilo single yarn or equivalent single yarn is used, and the numbers of warp and weft yarns set per 25 cm, X and Y, are 37≦X≦44 0.871X+1.7 Since it has a plain weave structure that satisfies ≦Y≦0.871X+4.6, by satisfying this specific relationship, it is possible to reduce the absolute value of the dimensional change in the vertical direction and the horizontal direction and to balance them. It is possible to improve the dimensional stability of printed wiring boards formed with prepreg obtained from this alkali-free glass cloth base material and eliminate anisotropy, thus enabling reliable component mounting and increasing reliability. You can increase your sexuality.
添付図は本発明の一実施例により形成したプリント配線
板の一例を示す分解断面図であって、八はプリント配線
板、１は積層基材、２は銅箔である。
代理人 弁理士 石 １）長 、七
手続補正書（方式）
昭和６０年２月１５日
昭和５９年特許願第１４２９１７号
２、発明の名称
プリント配線板用プリプレグの無アルカリ〃ラス布基材
３、補正をする者
事件との関係 特許出願人
住 所 大阪府門真市大字門真１０４８番地名 称（
５８３）松下電工株式会社
代表者 小 林 郁
４、代理人
郵便番号 ５３０
５、補正命令の日付
昭和５９年１０月９日
６、補正の対象
明細書
７、補正の内容The attached drawing is an exploded cross-sectional view showing an example of a printed wiring board formed according to an embodiment of the present invention, where 8 is a printed wiring board, 1 is a laminated base material, and 2 is a copper foil. Agent Patent Attorney Ishi 1) Chief, 7th Procedure Amendment (Method) February 15, 1985 Patent Application No. 142917 of 1988 2 Title of Invention Alkali-free glass cloth base material of prepreg for printed wiring board 3 , Relationship with the case of the person making the amendment Patent applicant address 1048 Kadoma, Kadoma City, Osaka Prefecture Name (
583) Matsushita Electric Works Co., Ltd. Representative Iku Kobayashi 4, Agent postal code 530 5, Date of amendment order October 9, 1983 6, Specification subject to amendment 7, Contents of amendment
Claims (1)
い、２５ｃｍあたりの縦糸と横糸の打ち込み本数ＸとＹ
が ３７≦Ｘ≦４４ ０．８７１Ｘ＋１．７≦Ｙ≦０．８７１Ｘ＋４．６を満
足する平織り構成されたプリント配線板用プリプレグの
無アルカリガラス布基材。(1) Using ECG75-1/0 single yarn or equivalent single yarn, number of warp and weft yarns per 25 cm X and Y
An alkali-free glass cloth base material for prepreg for printed wiring boards having a plain weave structure satisfying 37≦X≦44 0.871X+1.7≦Y≦0.871X+4.6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59142917A JPS6120734A (en) | 1984-07-10 | 1984-07-10 | Non-alkali glass cloth base material of prepreg for printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59142917A JPS6120734A (en) | 1984-07-10 | 1984-07-10 | Non-alkali glass cloth base material of prepreg for printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6120734A true JPS6120734A (en) | 1986-01-29 |
Family
ID=15326625
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59142917A Pending JPS6120734A (en) | 1984-07-10 | 1984-07-10 | Non-alkali glass cloth base material of prepreg for printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6120734A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6319245A (en) * | 1986-07-11 | 1988-01-27 | 東芝ケミカル株式会社 | Copper-lined laminated board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58115880A (en) * | 1981-12-28 | 1983-07-09 | 三菱瓦斯化学株式会社 | Glass woven fabric base material |
-
1984
- 1984-07-10 JP JP59142917A patent/JPS6120734A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58115880A (en) * | 1981-12-28 | 1983-07-09 | 三菱瓦斯化学株式会社 | Glass woven fabric base material |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6319245A (en) * | 1986-07-11 | 1988-01-27 | 東芝ケミカル株式会社 | Copper-lined laminated board |
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