JPS5920641U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS5920641U
JPS5920641U JP11552382U JP11552382U JPS5920641U JP S5920641 U JPS5920641 U JP S5920641U JP 11552382 U JP11552382 U JP 11552382U JP 11552382 U JP11552382 U JP 11552382U JP S5920641 U JPS5920641 U JP S5920641U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
semiconductor device
resin material
external leads
molded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11552382U
Other languages
Japanese (ja)
Inventor
井口　憲昭
野村　正廣
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Priority to JP11552382U priority Critical patent/JPS5920641U/en
Publication of JPS5920641U publication Critical patent/JPS5920641U/en
Pending legal-status Critical Current

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  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来のＤＩＰ半導体装置の外観斜視図、第２図
は従来のＤＩＰ半導体装置をプリント基板に設置した状
態を示す外観斜視図、第３図は本考案に係る半導体装置
の一実施例の外観斜視図、第４図は本考案に係る半導体
装置の他の実施例の外観斜視図、第５図は第４図の半導
体装置をカセットケース内に組み込んだ状態を示す外観
斜視図を示す。 ７図中、６：封止樹脂材、７：外部リード、８：り一ド
フレーム、９：孔、１０：カセットケース、１１：位置
決めピン。FIG. 1 is an external perspective view of a conventional DIP semiconductor device, FIG. 2 is an external perspective view showing the conventional DIP semiconductor device installed on a printed circuit board, and FIG. 3 is an embodiment of the semiconductor device according to the present invention. FIG. 4 is an external perspective view of another embodiment of the semiconductor device according to the present invention, and FIG. 5 is an external perspective view showing the semiconductor device of FIG. 4 installed in a cassette case. . In Figure 7, 6: sealing resin material, 7: external lead, 8: lead frame, 9: hole, 10: cassette case, 11: positioning pin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 外部リードが導出される半導体チップを樹脂材にてモー
ルドしてなる半導体装置において、前記モールドした樹
脂材の一部にて外部リードを支持せしめ、その支持部分
をコネクターとして構成したことを特徴とする半導体装
置＝A semiconductor device in which a semiconductor chip from which external leads are led out is molded with a resin material, characterized in that the external leads are supported by a part of the molded resin material, and the supporting portion is configured as a connector. Semiconductor device =
JP11552382U 1982-07-28 1982-07-28 semiconductor equipment Pending JPS5920641U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11552382U JPS5920641U (en) 1982-07-28 1982-07-28 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11552382U JPS5920641U (en) 1982-07-28 1982-07-28 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS5920641U true JPS5920641U (en) 1984-02-08

Family

ID=30266639

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11552382U Pending JPS5920641U (en) 1982-07-28 1982-07-28 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS5920641U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5632752A (en) * 1979-08-23 1981-04-02 Seiko Instr & Electronics Ltd Parts of segmented electrode
JPS5853155B2 (en) * 1975-07-07 1983-11-28 サンエスセツコウ カブシキガイシヤ How to prepare the base for floor finishing

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5853155B2 (en) * 1975-07-07 1983-11-28 サンエスセツコウ カブシキガイシヤ How to prepare the base for floor finishing
JPS5632752A (en) * 1979-08-23 1981-04-02 Seiko Instr & Electronics Ltd Parts of segmented electrode

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