JPS59146957U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS59146957U JPS59146957U JP4111683U JP4111683U JPS59146957U JP S59146957 U JPS59146957 U JP S59146957U JP 4111683 U JP4111683 U JP 4111683U JP 4111683 U JP4111683 U JP 4111683U JP S59146957 U JPS59146957 U JP S59146957U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor equipment
- circuit board
- printed circuit
- protrusions
- recorded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の一実施例の、プリント基板へのパッケ
ージ取付面を上側にした斜視図である。
１・・・・・・樹脂封止パッケージ、１ａ・・・・・・
プリント基板への取付面、２・・・・・・外部導出リー
ド、３・・・・・・位置決め用突起。FIG. 1 is a perspective view of an embodiment of the present invention, with the surface for mounting the package on the printed circuit board facing upward. 1...Resin sealed package, 1a...
Mounting surface to printed circuit board, 2...External lead, 3...Protrusion for positioning.
Claims (1)
個の突起を有することを特徴とする半導体装置。At least 2 on the package surface on the printed circuit board mounting side
A semiconductor device characterized by having a plurality of protrusions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4111683U JPS59146957U (en) | 1983-03-22 | 1983-03-22 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4111683U JPS59146957U (en) | 1983-03-22 | 1983-03-22 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59146957U true JPS59146957U (en) | 1984-10-01 |
Family
ID=30171713
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4111683U Pending JPS59146957U (en) | 1983-03-22 | 1983-03-22 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59146957U (en) |
-
1983
- 1983-03-22 JP JP4111683U patent/JPS59146957U/en active Pending
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