JPS59182939U - Semiconductor package cage with radiator - Google Patents

Semiconductor package cage with radiator

Info

Publication number
JPS59182939U
JPS59182939U JP7769083U JP7769083U JPS59182939U JP S59182939 U JPS59182939 U JP S59182939U JP 7769083 U JP7769083 U JP 7769083U JP 7769083 U JP7769083 U JP 7769083U JP S59182939 U JPS59182939 U JP S59182939U
Authority
JP
Japan
Prior art keywords
radiator
semiconductor package
package cage
cage
abstract
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7769083U
Other languages
Japanese (ja)
Inventor
越智 博樹
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP7769083U priority Critical patent/JPS59182939U/en
Publication of JPS59182939U publication Critical patent/JPS59182939U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図および第2図はそれぞれ本考案のラジェータ付き
半導体パッケージの一実施例を示す斜視図および側面図
である。 図において、1・・・・・・半導体チップ、2・・・・
・・放熱フィン、3・・・・・・取付は部、4・・・・
・・絶縁部、5・・・・・・外部端子、6・・・・・・
上蓋。
1 and 2 are a perspective view and a side view, respectively, showing an embodiment of a semiconductor package with a radiator according to the present invention. In the figure, 1...semiconductor chip, 2...
・・Radiation fin, 3・・・・Installation is in part, 4・・・・
...Insulation section, 5...External terminal, 6...
Top lid.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体チップの取付は部と、該取付は部と一体構造をな
す放熱用フィン占を備えることを特徴とするラジェータ
付き半導体パッケージ。
1. A semiconductor package with a radiator, comprising: a mounting section for a semiconductor chip; and a heat dissipation fin section integrally formed with the mounting section.
JP7769083U 1983-05-24 1983-05-24 Semiconductor package cage with radiator Pending JPS59182939U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7769083U JPS59182939U (en) 1983-05-24 1983-05-24 Semiconductor package cage with radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7769083U JPS59182939U (en) 1983-05-24 1983-05-24 Semiconductor package cage with radiator

Publications (1)

Publication Number Publication Date
JPS59182939U true JPS59182939U (en) 1984-12-06

Family

ID=30207713

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7769083U Pending JPS59182939U (en) 1983-05-24 1983-05-24 Semiconductor package cage with radiator

Country Status (1)

Country Link
JP (1) JPS59182939U (en)

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