JPS59151440U - Dice bonding equipment - Google Patents

Dice bonding equipment

Info

Publication number
JPS59151440U
JPS59151440U JP4503183U JP4503183U JPS59151440U JP S59151440 U JPS59151440 U JP S59151440U JP 4503183 U JP4503183 U JP 4503183U JP 4503183 U JP4503183 U JP 4503183U JP S59151440 U JPS59151440 U JP S59151440U
Authority
JP
Japan
Prior art keywords
semiconductor chip
bonding equipment
dice bonding
die bonding
transferring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4503183U
Other languages
Japanese (ja)
Other versions
JPS6328605Y2 (en
Inventor
吉人 金野
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP4503183U priority Critical patent/JPS59151440U/en
Publication of JPS59151440U publication Critical patent/JPS59151440U/en
Application granted granted Critical
Publication of JPS6328605Y2 publication Critical patent/JPS6328605Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid

Landscapes

  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来のピンセット式ダイスホンダを示す構成図
、第２図のａ、　ｂ図は本考案の一実施例であるティッ
プ形状を示す側面図、第３図、第４図は本考案のティッ
プを用いて半導体チップを挾持する状態を示す図である
。図中１１・・・ティップ、１２・・・脚部、１３・・
・アーム部、１３ａ、１３ｂ・・・テーバ面、１４・・
・半導体チップ、１４ａ・・・凹凸面。Fig. 1 is a configuration diagram showing a conventional tweezers-type die honda, Figs. FIG. 3 is a diagram showing a state in which a semiconductor chip is held between tips. In the figure 11... tip, 12... leg, 13...
・Arm part, 13a, 13b...Taber surface, 14...
- Semiconductor chip, 14a... uneven surface.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体チップを挾持して移送すると共にそのボンデング
を行なうピンセット部を有するダイスボンデング装置で
あって、該ピンセット部の先端に半導体チップすべり止
め用段部が形成されていることを特徴とするダイスボン
デング装置。A die bonding device having a tweezers portion for holding and transferring a semiconductor chip and bonding the semiconductor chip, the die bonding device having a tweezers portion for holding and transferring the semiconductor chip and bonding the same, the die bonding device having a stepped portion for preventing the semiconductor chip from slipping at the tip of the tweezers portion. Dengue device.
JP4503183U 1983-03-29 1983-03-29 Dice bonding equipment Granted JPS59151440U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4503183U JPS59151440U (en) 1983-03-29 1983-03-29 Dice bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4503183U JPS59151440U (en) 1983-03-29 1983-03-29 Dice bonding equipment

Publications (2)

Publication Number Publication Date
JPS59151440U true JPS59151440U (en) 1984-10-11
JPS6328605Y2 JPS6328605Y2 (en) 1988-08-02

Family

ID=30175553

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4503183U Granted JPS59151440U (en) 1983-03-29 1983-03-29 Dice bonding equipment

Country Status (1)

Country Link
JP (1) JPS59151440U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014067911A (en) * 2012-09-26 2014-04-17 Nec Engineering Ltd Semiconductor mounting device and bare chip transfer unit

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4867791U (en) * 1971-11-29 1973-08-28
JPS495365U (en) * 1972-04-18 1974-01-17

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4867791U (en) * 1971-11-29 1973-08-28
JPS495365U (en) * 1972-04-18 1974-01-17

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014067911A (en) * 2012-09-26 2014-04-17 Nec Engineering Ltd Semiconductor mounting device and bare chip transfer unit

Also Published As

Publication number Publication date
JPS6328605Y2 (en) 1988-08-02

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