JPS6142855U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS6142855U
JPS6142855U JP12728284U JP12728284U JPS6142855U JP S6142855 U JPS6142855 U JP S6142855U JP 12728284 U JP12728284 U JP 12728284U JP 12728284 U JP12728284 U JP 12728284U JP S6142855 U JPS6142855 U JP S6142855U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
abstract
processed
semiconductor device
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12728284U
Other languages
Japanese (ja)
Inventor
信裕 印丸
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP12728284U priority Critical patent/JPS6142855U/en
Publication of JPS6142855U publication Critical patent/JPS6142855U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図Ａは本考案の一実施例を示す斜視図、第１図Ｂは
同図Ａのリード部の拡大図である。 第２図Ａ， Ｂは夫々従来例を示す斜視図及びそのリー
ド部の拡大図である。 １・・・リード、２・・・リード先端、３・・・容器。FIG. 1A is a perspective view showing an embodiment of the present invention, and FIG. 1B is an enlarged view of the lead portion of FIG. 1A. FIGS. 2A and 2B are a perspective view and an enlarged view of the lead portion of a conventional example, respectively. 1...Lead, 2...Lead tip, 3...Container.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 先端部分がつりぼり状に加工されたリード端子を有する
ことを特徴とする半導体装置。A semiconductor device characterized by having a lead terminal whose tip portion is processed into a hanging shape.
JP12728284U 1984-08-22 1984-08-22 semiconductor equipment Pending JPS6142855U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12728284U JPS6142855U (en) 1984-08-22 1984-08-22 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12728284U JPS6142855U (en) 1984-08-22 1984-08-22 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS6142855U true JPS6142855U (en) 1986-03-19

Family

ID=30685930

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12728284U Pending JPS6142855U (en) 1984-08-22 1984-08-22 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS6142855U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6379361A (en) * 1986-09-24 1988-04-09 Hitachi Vlsi Eng Corp Upright installation type semiconductor device
JPH0233958A (en) * 1988-07-23 1990-02-05 Nec Corp Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6379361A (en) * 1986-09-24 1988-04-09 Hitachi Vlsi Eng Corp Upright installation type semiconductor device
JPH0233958A (en) * 1988-07-23 1990-02-05 Nec Corp Semiconductor device

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