JPS59128741U - semiconductor conversion equipment - Google Patents
semiconductor conversion equipmentInfo
- Publication number
- JPS59128741U JPS59128741U JP2276883U JP2276883U JPS59128741U JP S59128741 U JPS59128741 U JP S59128741U JP 2276883 U JP2276883 U JP 2276883U JP 2276883 U JP2276883 U JP 2276883U JP S59128741 U JPS59128741 U JP S59128741U
- Authority
- JP
- Japan
- Prior art keywords
- raised bottom
- semiconductor conversion
- conversion equipment
- notch hole
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来の半導体変換装置の分解斜視図、第2図は
本考案の実施例による半導体変換装置の分解斜視図であ
る。
1:共通冷却体、2:半導体素子、3:変圧器、4:平
滑コンデンサ、5:変流器、6:抵抗器、7:箱体、8
:蓋、9:冷却体、10:箱体。FIG. 1 is an exploded perspective view of a conventional semiconductor conversion device, and FIG. 2 is an exploded perspective view of a semiconductor conversion device according to an embodiment of the present invention. 1: Common cooling body, 2: Semiconductor element, 3: Transformer, 4: Smoothing capacitor, 5: Current transformer, 6: Resistor, 7: Box, 8
: Lid, 9: Cooling body, 10: Box body.
Claims (1)
た上げ底部を設け、この上げ底に切欠き穴を設けるとと
もに、この切欠き穴より上方に突出させて半導体素子お
よび発熱小物部品を取付けた冷却体をその冷却フィンガ
外気に接するように上げ底下に取付け、深底部に大形部
品を収納し、上部を蓋で覆うようにしたことを特徴とす
る半導体変換装置。A raised bottom part is provided on one side of the box body, the lower part of which is passed through between the opposing sides in a tunnel-like manner, and a notch hole is provided in this raised bottom part, and semiconductor elements and small heat-generating parts are made to protrude upward from this notch hole. A semiconductor conversion device characterized in that the mounted cooling body is mounted under the raised bottom so that its cooling fingers are in contact with the outside air, large components are stored in the deep bottom, and the top is covered with a lid.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2276883U JPS59128741U (en) | 1983-02-18 | 1983-02-18 | semiconductor conversion equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2276883U JPS59128741U (en) | 1983-02-18 | 1983-02-18 | semiconductor conversion equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59128741U true JPS59128741U (en) | 1984-08-30 |
JPS6331393Y2 JPS6331393Y2 (en) | 1988-08-22 |
Family
ID=30153862
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2276883U Granted JPS59128741U (en) | 1983-02-18 | 1983-02-18 | semiconductor conversion equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59128741U (en) |
-
1983
- 1983-02-18 JP JP2276883U patent/JPS59128741U/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6331393Y2 (en) | 1988-08-22 |
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