JPS5885358U - semiconductor package - Google Patents
semiconductor packageInfo
- Publication number
- JPS5885358U JPS5885358U JP18164081U JP18164081U JPS5885358U JP S5885358 U JPS5885358 U JP S5885358U JP 18164081 U JP18164081 U JP 18164081U JP 18164081 U JP18164081 U JP 18164081U JP S5885358 U JPS5885358 U JP S5885358U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor package
- lead terminals
- external lead
- attached
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来の半導体パッケージを使用した半導体装置
の斜視図、第2図は第1図の断面図、第3図は本発明の
半導体パッケージを使用した半導体装置の斜視図、第4
図は第3図の断面図、第5図は本考案の好適態様に用い
る蓋体の斜視図である。
1:基体、2:蓋体、4,41外部リード端子。FIG. 1 is a perspective view of a semiconductor device using a conventional semiconductor package, FIG. 2 is a sectional view of FIG. 1, FIG. 3 is a perspective view of a semiconductor device using a semiconductor package of the present invention, and FIG.
The figure is a sectional view of FIG. 3, and FIG. 5 is a perspective view of a lid used in a preferred embodiment of the present invention. 1: Base body, 2: Lid body, 4, 41 external lead terminals.
Claims (1)
の外部リード端子が取着されて成る半導体パッケージに
おいて、前記絶縁容器の一側面に取着された外部リード
端子の少なくとも1個はその上端が絶縁基体側面から蓋
体側面に達するまで延長されていることを特徴とする半
導体パッケージ。, in a semiconductor package in which a plurality of external lead terminals are attached to both sides of an insulating container consisting of an insulating base and a lid, at least one of the external lead terminals attached to one side of the insulating container is A semiconductor package characterized in that its upper end extends from a side surface of an insulating base to a side surface of a lid body.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18164081U JPS5885358U (en) | 1981-12-04 | 1981-12-04 | semiconductor package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18164081U JPS5885358U (en) | 1981-12-04 | 1981-12-04 | semiconductor package |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5885358U true JPS5885358U (en) | 1983-06-09 |
Family
ID=29979295
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18164081U Pending JPS5885358U (en) | 1981-12-04 | 1981-12-04 | semiconductor package |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5885358U (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5433420U (en) * | 1977-08-08 | 1979-03-05 |
-
1981
- 1981-12-04 JP JP18164081U patent/JPS5885358U/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5433420U (en) * | 1977-08-08 | 1979-03-05 |
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