JPS59146961U - semiconductor conversion equipment - Google Patents

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の半導体変換装置の斜視図、第２図〜第４
図は本考案の実施例による半導体変換装置を示すもので
第２図は平面図、第３図は正面図、第４図は第３図のＡ
−Ａ断面図である。 １・・・・・・半導体素子、２・・・・・・共通冷却体
、３・・・・・・側面板、４．　５．　６・・・・・・
プリント板、７・・・・・・プリント板固定材、８・・
・・・・半導体素子、９・・・・・・共通冷却体、１０
・・・・・・半導体スタック固定板、１１・・・・・・
ファン、１２・・・・・・箱体、１３・・・・・・開閉
蓋、１４゜１５・・・・・・プリント板、１６・・・・
・・切抜穴。Figure 1 is a perspective view of a conventional semiconductor conversion device, Figures 2 to 4
The figures show a semiconductor conversion device according to an embodiment of the present invention, in which Fig. 2 is a plan view, Fig. 3 is a front view, and Fig. 4 is A of Fig. 3.
-A sectional view. 1...Semiconductor element, 2...Common cooling body, 3...Side plate, 4. 5. 6...
Printed board, 7... Printed board fixing material, 8...
... Semiconductor element, 9 ... Common cooling body, 10
...Semiconductor stack fixing plate, 11...
Fan, 12...Box body, 13...Opening/closing lid, 14゜15...Printed board, 16...
...Cutout hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 主回路用半導体スタックと制御回路電源用半導体スタッ
クとを有する強制通風冷却式の半導体変換装置において
、少くとも２個以上の半導体素子を絶縁物を介して共通
冷却体に取付けてなる主回路用半導体スタックを、一端
にファンを備え前面に開閉蓋を有して風胴を形成する箱
体に前記共通冷却体の冷却フィンが箱底面に対向するよ
うに収納するとともに、前記開閉蓋の内外面に制御回路
用プリント板を蓋面に平行して取付け、内面に取付けた
プリント板と蓋内面との間に、少くとも２個以上の半導
体素子を絶縁物を介して共通冷却体に取付けてなる制御
回路電源用半導体スタックを、その共通冷却体を蓋内面
に固定して介在させ、前記制御回路電源用半導体スタッ
クの共通冷却体が接する蓋面に切抜穴を設けたことを特
徴とする半導体変換装置。In a forced draft cooling type semiconductor conversion device having a semiconductor stack for the main circuit and a semiconductor stack for the control circuit power supply, the semiconductor for the main circuit is formed by attaching at least two or more semiconductor elements to a common cooling body through an insulator. The stack is housed in a box having a fan at one end and an opening/closing lid on the front to form a wind barrel, with the cooling fins of the common cooling body facing the bottom of the box, and the cooling fins of the common cooling body facing the bottom of the box. A control circuit in which a control circuit printed board is attached parallel to the lid surface, and at least two or more semiconductor elements are attached to a common cooling body with an insulator between the printed board attached to the inner surface and the lid inner surface. A semiconductor conversion device characterized in that a semiconductor stack for circuit power supply is interposed with its common cooling body fixed to the inner surface of the lid, and a cutout hole is provided in the lid surface in contact with the common cooling body of the semiconductor stack for control circuit power supply. .