JPS6127341U - Semiconductor device envelope - Google Patents
Semiconductor device envelopeInfo
- Publication number
- JPS6127341U JPS6127341U JP11279784U JP11279784U JPS6127341U JP S6127341 U JPS6127341 U JP S6127341U JP 11279784 U JP11279784 U JP 11279784U JP 11279784 U JP11279784 U JP 11279784U JP S6127341 U JPS6127341 U JP S6127341U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- envelope
- conductive layer
- utility
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
図は本考案にかかる半導体装置の外囲器の一実施例を示
す構成図である。
１・・・樹脂封止体、２・・・外部リード、３・・・導
電性層、３ａ・・・接続部。The figure is a configuration diagram showing an embodiment of an envelope of a semiconductor device according to the present invention. DESCRIPTION OF SYMBOLS 1... Resin sealing body, 2... External lead, 3... Conductive layer, 3a... Connection part.
Claims (1)
続用の外部リードとを備え、前記絶縁体の少なくとも上
面に導電性層を形成してなる半導体装置の外囲器。 ２ 導電性層が外部リードの一部と接続されたものであ
る実用新案登録請求の範四第１項記載の半導体装置の外
囲器。 ３ 導電性層が導電性樹脂である実用新案登録請求の範
囲第１項または第２項記戴の半導体装置の外囲器。 ４ 導電性層が金属箔である実用新案登録請求の範囲第
１項または第２項記敦の半導体装置の外囲器。 ５ 導電性層が金属蒸着膜である実用新案登録請求の範
囲第１項または第２項記戚の半導体装置の外囲器。 ６ 導電性層が封止樹脂の炭化層である実用新案登録請
求の範囲第１項または第２項記載の半導体装置の外囲器
。[Claims for Utility Model Registration] -1 An external semiconductor device comprising an insulator on which a semiconductor chip is mounted and encapsulated, and an external lead for external connection, and a conductive layer is formed on at least the upper surface of the insulator. Surroundings. 2. The envelope for a semiconductor device according to claim 4, item 1, wherein the conductive layer is connected to a part of the external lead. 3. The envelope of a semiconductor device as claimed in claim 1 or 2 of the utility model registration, wherein the conductive layer is a conductive resin. 4. An envelope for a semiconductor device according to claim 1 or 2, wherein the conductive layer is a metal foil. 5. An envelope for a semiconductor device according to claim 1 or 2 of the utility model registration, wherein the conductive layer is a metal vapor deposited film. 6. The envelope for a semiconductor device according to claim 1 or 2, wherein the conductive layer is a carbonized layer of sealing resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11279784U JPS6127341U (en) | 1984-07-25 | 1984-07-25 | Semiconductor device envelope |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11279784U JPS6127341U (en) | 1984-07-25 | 1984-07-25 | Semiconductor device envelope |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6127341U true JPS6127341U (en) | 1986-02-18 |
Family
ID=30671832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11279784U Pending JPS6127341U (en) | 1984-07-25 | 1984-07-25 | Semiconductor device envelope |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6127341U (en) |
-
1984
- 1984-07-25 JP JP11279784U patent/JPS6127341U/en active Pending
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