JPS60169850U - 光モジユ−ル - Google Patents

光モジユ−ル

Info

Publication number
JPS60169850U
JPS60169850U JP1984056693U JP5669384U JPS60169850U JP S60169850 U JPS60169850 U JP S60169850U JP 1984056693 U JP1984056693 U JP 1984056693U JP 5669384 U JP5669384 U JP 5669384U JP S60169850 U JPS60169850 U JP S60169850U
Authority
JP
Japan
Prior art keywords
main surface
ceramic substrate
semiconductor element
optical semiconductor
upper lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984056693U
Other languages
English (en)
Inventor
成之 佐倉
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP1984056693U priority Critical patent/JPS60169850U/ja
Publication of JPS60169850U publication Critical patent/JPS60169850U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の光モジュールの一例を示す断面図、第２
図は本考案の一実施例を示す断面図、第３図から第５図
までは本考案の他の実施例を示す断面図である。 １０・・・セラミック基板、１１・・・光半導体素子、
１２・・・電気回路素子、１３・・・第１の上ぶた、１
６・・・第２の上ぶた、１９・・・電気配線部。

Claims (2)

    【実用新案登録請求の範囲】
  1. （１）　　第１の主面とこの反対側にある第２の主面と
    を有するセラミック基板と、前記第１の主面上に設けら
    れた光半導体素子と、前記第２の主面上に設けられた電
    気回路素子と、前記光半導体素子を覆うように前記セラ
    ミック基板に設けられた透光部を有する第１の上ぶたと
    、前記電気回路素子を覆うように前記セラミック基板に
    設けられた第２の上ぶたと、前記セラミック基板を介し
    て前記光半導体素子と前記電気回路素子とを接続する電
    気配線部とを備えたことを特徴とする光モジュール。
  2. （２）　　前記光半導体素子が受光素子であり、前記セ
    ラミックス基板は、第１及び第２のセラミック基板とこ
    れらにはさまれている導電層とからなることを特徴とす
    る実用新案登録請求の範囲第１項記載の光モジュール。
JP1984056693U 1984-04-19 1984-04-19 光モジユ−ル Pending JPS60169850U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984056693U JPS60169850U (ja) 1984-04-19 1984-04-19 光モジユ−ル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984056693U JPS60169850U (ja) 1984-04-19 1984-04-19 光モジユ−ル

Publications (1)

Publication Number Publication Date
JPS60169850U true JPS60169850U (ja) 1985-11-11

Family

ID=30580534

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984056693U Pending JPS60169850U (ja) 1984-04-19 1984-04-19 光モジユ−ル

Country Status (1)

Country Link
JP (1) JPS60169850U (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61281559A (ja) * 1985-06-07 1986-12-11 Nippon Kogaku Kk <Nikon> 光検出装置
WO2010098277A1 (ja) * 2009-02-25 2010-09-02 住友電気工業株式会社 光半導体装置
JP2019204890A (ja) * 2018-05-24 2019-11-28 日本ルメンタム株式会社 光サブアセンブリ

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61281559A (ja) * 1985-06-07 1986-12-11 Nippon Kogaku Kk <Nikon> 光検出装置
WO2010098277A1 (ja) * 2009-02-25 2010-09-02 住友電気工業株式会社 光半導体装置
JP2010199302A (ja) * 2009-02-25 2010-09-09 Sumitomo Electric Ind Ltd 光半導体装置
JP2019204890A (ja) * 2018-05-24 2019-11-28 日本ルメンタム株式会社 光サブアセンブリ

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