JPS5895640U - semiconductor equipment - Google Patents

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案に係る筐体を使用した半導体装置の要部
縦断面図、第２図は他の実施例に係る筐体を使用した半
導体装置の要部縦断面図である。 １・・・・・・筐体、２・・・・・・開口部、３・・・
・・・放熱フィン、４・・・・・・孔、４ａ・・・・・
・ガイド壁、５・・・・・・取付用孔、６・・・・・・
放熱板、７・・・・・・混成集積回路、８・・・・・・
外部接続端子、９・・・・・・ねじ、１０・・・・・・
栓、１１・・・・・・樹脂。FIG. 1 is a longitudinal cross-sectional view of a main part of a semiconductor device using a casing according to the present invention, and FIG. 2 is a longitudinal sectional view of a main part of a semiconductor device using a casing according to another embodiment. 1... Housing, 2... Opening, 3...
...radiating fin, 4...hole, 4a...
・Guide wall, 5...Mounting hole, 6...
Heat sink, 7... Hybrid integrated circuit, 8...
External connection terminal, 9... Screw, 10...
Plug, 11...Resin.

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）半導体素子を含む混成集積回路を塔載し且つ外部
接続端子を有する金属放電板が収納固定される半導体装
置用筐体において、前記外部接続端子が突出する開口部
を有し、該開口部に対して前記金属放熱板が垂直状態に
なるように位讃させ、該金属放熱板をねじ止めするため
のねじ止め用の孔を前記開口部に対して横切る方向に設
けたことを特徴とする半導体装置用筐体。(1) A housing for a semiconductor device in which a hybrid integrated circuit including a semiconductor element is mounted and a metal discharge plate having an external connection terminal is housed and fixed, the housing having an opening from which the external connection terminal projects; The metal heat sink is placed in a vertical position with respect to the opening, and screw holes for screwing the metal heat sink are provided in a direction transverse to the opening. Housing for semiconductor devices. （２）前記ねじ止め用の孔の内側エツジに沿ってガイド
壁を起立させて一体的に形成したことを特徴とする前記
第（１）項記載の半導体装置用筐体。(2) The casing for a semiconductor device according to item (1), characterized in that a guide wall is integrally formed in an upright manner along an inner edge of the screw hole.