JPS5876835A - Manufacture of patterned curable resin film having resist property - Google Patents

Abstract

PURPOSE:To obtain a precisely worked pattern and sufficient resist property, by performing stages up to printing of working pattern on a resist film with opaque printing ink continuously. CONSTITUTION:After paint 3 which has a resist property and is curable by ultraviolet rays (UV) is coated on a long sized base material 1 with 8-15mum thickness, the material is passed through the inside of a primary UV irradiating device 4 to cure said paint film preliminarily. Thereafter, prescribed working patterns are printed thereon by using a rotary letter-press machine, or lithographic offset press 5 and sheet letterpress or lithographic ink contg. 15-20wt% carbon black. This material is passed through the inside of a secondary UV irradiating device 6 to allow the paint film in the areas other than the printed area to cure thoroughly. A developing soln. 9 is injected from nozzles 8 in a developing device 7 to elute or strip away the printed ink films and the preliminarily cured paint film under said films, whereby the working patterns are developed.

Description

【発明の詳細な説明】 本発明はパターン形成されたレジスト性硬化樹脂膜の作
製方法に関し、更に詳細に言えば、梢巧な加エバターン
の形成された硬化樹脂膜を基材表面上に作製する方法に
関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for producing a patterned resist cured resin film, and more specifically, the present invention relates to a method for producing a resist cured resin film having a pattern formed thereon. Regarding the method.

近年、ＩＣ’ｐＬ８Ｉが大量生産されるようになり、こ
れらの電子素子を装着しその端子を接続配線するための
ｙ−ド・フレームＪＰフィルム・キャリアの需要が増大
している。In recent years, IC'pL8I have been mass-produced, and the demand for y-de-frame JP film carriers for mounting these electronic elements and connecting and wiring their terminals has increased.

又、各極の電子部品や電子機器には様々な形状のコネク
ターや接続−子が必要であり、これらが大賞に生産され
ている。In addition, various shapes of connectors and connectors are required for each pole of electronic parts and electronic equipment, and these are produced in large quantities.

リードフレームやコネクターなどの基材はリン青銅、ペ
リリューム鋼、洋白、ステンレス製などで、素子端子の
接続ｓＪＰコンタクト部分の完全な電気接触と長期耐久
性の保証のために、金、嫁、その他の貴金属のメッキが
不可欠であるＯ 従来、これら基材はあらかじめ基材全面に貴金属メッキ
が施され、素子装着や製造の工程で適当な形状にパンチ
ングされた後、不必要な部分のメッキ貴金属を回収する
ζいう方法が採られてきた。しかし、省資源と工程合理
化のためＫは、ボンディング又はコンタクトすべき各電
子部品類の特定の小面積部分にだけパターンメッキされ
て基材が部品の生産に提供されるのか望ましい。The base materials for lead frames and connectors are made of phosphor bronze, perylium steel, nickel silver, stainless steel, etc., and in order to guarantee complete electrical contact and long-term durability of the connection parts of the element terminals, we use gold, copper, etc. Conventionally, these base materials are plated with precious metal on the entire surface of the base material in advance, punched into an appropriate shape during the element mounting and manufacturing process, and then the unnecessary portions of the plated precious metal are removed. A method called ζ has been adopted. However, in order to save resources and streamline the process, it is desirable that pattern plating be applied only to a specific small area of each electronic component to be bonded or contacted so that the base material can be used to produce the component.

さらに、これら基材は従来金属帯片として樋工根に供給
さ汰不連続な生産処理が行われてきたが、効率の商い大
量生産処理のためには長巻の金輌帯又はフープの形で連
続生産工種に提供されるべきである。Furthermore, these base materials have traditionally been supplied to gutter roots as metal strips for discontinuous production processing, but for efficiency and mass production processing, they are now available in the form of long metal strips or hoops. should be provided for serial production types.

このよ５なｌＩ望に応えるために、本発明は考案さｔｌ
、％暮々検討の結果適切な手沢な提供するに至った。The present invention was devised in order to meet these five demands.
As a result of careful consideration, we have arrived at an appropriate provision.

パターンメッキされた長春金ｍ帝又はパターンメッキ７
−グを作製するためＫは、パターンメッキすべき部分の
みを残し【表層全面をメツキレシスト塗膜でマスキング
した長巷金ｊ１４蛍又はフープの基材が作製されなけれ
ばならない。Pattern plated Changchun Jinm Di or pattern plated 7
- In order to produce a hoop, a base material of long strip metal J14 or hoop must be prepared with the entire surface layer masked with a metal resist coating, leaving only the part to be pattern plated.

このようなメッキパターンを残して連続したレジスト膜
な形成する方法としては、連続メッキパターン部をマス
キングするマスク材を所定のマスキング部分に貼合し、
その後全面をレジストａ料でコートする方法が考えられ
る。しかし、この方法では所定の形状の単位マスキング
パターンを所定のピッチ間隔で連続的にマスク材を貼合
、配置することが必貴であり、この生産工程には多大の
設備又は人力と時間が不ロＩ欠となる。As a method of forming a continuous resist film leaving such a plating pattern, a masking material for masking the continuous plating pattern is pasted on a predetermined masking part.
A method may be considered in which the entire surface is then coated with resist a material. However, in this method, it is necessary to continuously bond and arrange the masking material in a unit masking pattern of a predetermined shape at a predetermined pitch interval, and this production process requires a large amount of equipment, manpower, and time. ro I will be missing.

また、パターン部を残して全面にレジストＩｌｌ科をコ
ートする方式として印刷方式が考えられる。しかし、通
常の印刷方式ではレジスト膜厚が薄くならざるを傅ず、
充分なレジスト性ｔａ１保することが崩御である。ある
いはスクリーン印刷方式によれはレジストＫＭは充分な
る厚さとなるが、精巧なパターンの形成は無理である。Furthermore, a printing method can be considered as a method of coating the entire surface with resist Ill, leaving the pattern portion. However, with normal printing methods, the resist film thickness is inevitably thin.
The key is to maintain sufficient resistivity ta1. Alternatively, depending on the screen printing method, the resist KM can have a sufficient thickness, but it is impossible to form an elaborate pattern.

銃士の如き各問題は、電子部品の製造の際のメッキパタ
ーンの形成に限られるものではなく、プリント配線基板
の加工や金属、グラスチック、セラミック、ガラス、木
材等の各種基材表面をメッキ、エツチング、ホーニング
、着色、変質等の各ｍ物理的、化学的手段で加工する際
、加工部が梢巧なパターンを形成する必要があるときは
共通して生ずる間麺である。Musketeer-like problems are not limited to forming plating patterns when manufacturing electronic parts, but also include processing of printed wiring boards and plating the surfaces of various base materials such as metal, plastic, ceramic, glass, and wood. When processing by physical or chemical means such as etching, honing, coloring, alteration, etc., this is a common occurrence when the processed part needs to form a fine pattern.

従って、本発明の目的Ｌ　精巧な加エバターンを有し、
且つ充分なるレジスト性を有する硬化樹脂膜な各種晶材
上に作製する方法を提供することにある。Therefore, the object L of the present invention is to have an elaborately processed evaporation turn,
Another object of the present invention is to provide a method for producing a cured resin film on various crystal materials having sufficient resistivity.

即ち、本発明は、基材の表面にレジスト性を有する紫外
線硬化性塗料を塗装する第１工程と、その盆狭に紫外線
を照射して予備硬化せしめる第２工程と、この塗膜に所
定の加エバターンを非感光性の不透明印刷インキで印刷
する第６エ程と、この印刷された塗膜に紫外総を即射ｌ
−て印刷部以外の１ｍ換を完全硬化せしめると共に印刷
部の塗膜を前記予備硬化状態に維持する第４工程と、こ
の予備硬化状態に維持した印刷部のｍｌ膜を溶出又は剥
離して加エバターン部を形成する第５工程とから成るパ
ターン形成されたレジスト性硬化’ｔｌＨ’ｄ禮の作製
方法な提供するものである。That is, the present invention comprises a first step of coating the surface of a base material with an ultraviolet curable paint having resist properties, a second step of pre-curing the coating by irradiating it with ultraviolet rays, and applying a predetermined coating to this coating film. The sixth step is to print the modified Evaturn with a non-photosensitive opaque printing ink, and the printed coating film is immediately exposed to ultraviolet light.
- a fourth step of completely curing the 1 m film other than the printed part and maintaining the coating film of the printed part in the pre-cured state, and elution or peeling of the ml film of the printed part maintained in this pre-cured state and processing. A fifth step of forming an evaturn portion is provided.

以下、本発明方法の各工程につぎ詳細に説明する。Each step of the method of the present invention will be explained in detail below.

Ｍ１工相 第１図において、（１）は金属、グラスチック等の素材
より７ｊるシート、フィルム等の基材であって、この基
材（１）は長巻状とされて連続槓ラインの始端部に配置
され、連続的に繰り出されてラインに供給される。（２
）は這装装置であって、このｇｋ置（２）によって基材
（１）の表良悶面にレジスト性を有する紫外線硬化性塗
料（３ンを塗装する。図示の実施例では改漬ｍ装装厘を
使用して基材ｉ１）の六層μσ即に菫装してぃるが、基
材（１１への遊装な片面塗装とするか、両面塗装とする
かは、パターンの使用目的に応じて適宜決定すればよく
、従って、本発＃！Ａにおいては装置（２）はこれに＠
足されるものでなく両面又は片肉ｍ装可能なロールコー
タ−、ナイフコーター、スプレーコーター等の各種装置
を使用し得る。また、図示の実施例では、基材１１）と
して連続体を使用しているが、基材（１）の形状は板状
、シート状等の不連続体であってもよく、またその素材
は上記素材のほかガラス、セラミック等の木材でもよい
。不連続体な使用する場合、遊装装置、搬送ａｔ勢の一
部ラインの一部を不連続体の基体に退会するように設計
変更すればよい。紫外−硬化性道科（３）としては、メ
ツキレシスト性、ソルダーレジスト性、エツチングレジ
スト性等の６柚レジろト性を有するものが使用され、こ
れは公知の各槍紫外１１１Ｍ！硬化性原料及び助剤ｍｖ
便用して配付、作製することができ、例えば紫外鰍直合
性不胞和二重結合特に好ましくは（メタ）アクリル系２
型結合を１分子中に少なくとも２個以上有するアクリル
、ポリエステル、ポリフレタン、ポリアミド、エボキク
系等の各植ポリマー又はプレポリマーを紫外線重合性七
ツマー籍に好ましくは多価アルコール１分子に少なくと
も２分子以上の（メタ）アクリル酸な反応せしめたポリ
オールポリアクリレートで檜釈し、これに周知の増感剤
史に必ＪＲＫ応じて着色調料、体質顔料、各種助剤等を
添加して適正粘度に調製した遊科を作製することができ
る。In Fig. 1 of the M1 construction phase, (1) is a base material such as a sheet or film made of materials such as metal or glass. It is placed at the starting end and is continuously unwound and supplied to the line. (2
) is a coating device, and this gk device (2) coats the surface of the substrate (1) with an ultraviolet curable paint (3) having resist properties. The six layers μσ of the base material i1) are immediately matted using a plating tool, but the use of a pattern determines whether the base material (11) should be painted on one side or on both sides. It may be determined as appropriate depending on the purpose. Therefore, in this #!A, the device (2) is @
Various devices such as a roll coater, a knife coater, a spray coater, etc., which can coat both sides or one side of the coating, can be used. Further, in the illustrated embodiment, a continuous body is used as the base material 11), but the shape of the base material (1) may be a discontinuous body such as a plate shape or a sheet shape, and the material thereof may be In addition to the above-mentioned materials, wood such as glass and ceramic may also be used. When using a discontinuous body, the design may be changed so that a part of the line of the amusement device and the transport at-train is connected to the base of the discontinuous body. As the ultraviolet-curing material (3), those having 6 yuzu resist properties such as metsukiresist property, solder resist property, and etching resist property are used, and this is the same as each known spear ultraviolet 111M! Curable raw materials and auxiliary agents mv
It can be conveniently distributed and produced, for example, ultraviolet orthogonal unsulfated double bond, particularly preferably (meth)acrylic type 2
UV-polymerizable polymers or prepolymers such as acrylics, polyesters, polyurethanes, polyamides, and polyesters having at least two type bonds in one molecule, preferably at least two molecules per polyhydric alcohol molecule. (Meth) acrylic acid reacted polyol polyacrylate, and added coloring agents, extender pigments, various auxiliaries, etc. according to the well-known history of sensitizers, and adjusted to an appropriate viscosity. A game can be created.

このような迩料を塗装する際、通常、２０〜５０ｍ／分
のラインスピードでレジスト膜として必要な８〜１５μ
軍誤厚の塗装を行なう。When coating such a resist film, the line speed of 20 to 50 m/min is usually applied to form a resist film of 8 to 15 μm.
Painted to a military-grade thickness.

第２工程 （４ンは第１次紫外！！照射装置であり、該装置（４）
内に第１工根で塗装された基材ｉｌｌを導入してその血
装面に紫外線な照射し、該塗膜な予備硬化せしめる。そ
の際、塗膜の硬化程度が重要であり、後記する第３工程
の印刷ができ且つ第４工程の印刷部のｍ膜の溶出又は剥
離除去ができる一定軛囲内の軽度の硬化ＥｉｌＪ御する
ことが必要である。紫外１射強度、塗膜厚さ、塗料の硬
化性、ラインスピード等を考慮して照射条件′４ｒ：Ｗ
ｉ定すれば、必要な硬化塗膜に制御することは容易であ
る。2nd step (4n is the first ultraviolet!! irradiation device, this device (4)
The base material coated with the first root is introduced into the interior, and the coated surface is irradiated with ultraviolet rays to pre-cure the coating film. At that time, the degree of curing of the coating film is important, and mild curing within a certain range that allows printing in the third step (described later) and elution or peeling of the m film in the printed area in the fourth step is necessary. is necessary. The irradiation conditions '4r:W were determined by considering the UV radiation intensity, coating film thickness, paint curing properties, line speed, etc.
If the temperature is determined, it is easy to control the cured coating film to the required value.

第３工程 （５）は印刷機であり、該印刷機により、第２工程で予
備蒙化せしめたＪＩＩＪｌａＫ紫外線遮蔽性を有する非
感光注即刷インキで所定の加エバターンを印刷する。そ
の際の印刷方式としては例えば輪転式凸版印刷又は平版
オフセット印刷方式が望ましく、印刷インキとしては一
般的にカーボンブラックを１５〜２０３１ｉ１％含有す
る枚葉凸版インキ又は枚業士版インキが望ましい。The third step (5) is a printing machine, and the printing machine prints a predetermined modified evaporation pattern using the JIIJlaK non-photosensitive instant printing ink having ultraviolet shielding properties that has been preliminarily treated in the second step. The preferred printing method in this case is, for example, rotary letterpress printing or lithographic offset printing, and the printing ink is generally sheet-fed letterpress ink or sheet-fed printing ink containing 15 to 2031i1% of carbon black.

印刷方式としてはそのほかに凹版印刷又はグラビア印刷
も考えられるが、毎ロットごと異る形状の加エバターン
の製版をするには製版コストが高価で経済性に難点があ
る。Intaglio printing or gravure printing may also be considered as other printing methods, but the plate-making costs are high to make plates with different shapes for each lot, making it difficult to be economical.

従って本発明の方式においては凸版印刷又は平版印刷が
適当であり、その印刷版には感光性樹脂凸版、感光性７
レキソ販や平版２８版、ベーパーマスター又は、湿し水
不要平版など市販の一般版材が利用できる。Therefore, in the method of the present invention, letterpress printing or planographic printing is suitable, and the printing plates include photosensitive resin letterpress, photosensitive 7
Commercially available general plate materials such as Lexo, lithographic 28 plate, vapor master, or lithographic plate that does not require dampening water can be used.

基材がシート状又はブロック状の印刷の場合は、所定の
加エバターンに従ってネガ又はポジｍ桶を作製し、これ
を上記版材に密Ｎｌｔ光・現像して印刷版としこれを一
般の平版・凸版印刷の手職に従って印刷機に装置、印刷
することができる。When printing on a sheet-like or block-like base material, a negative or positive m-tube is prepared according to a predetermined processing pattern, and this is developed on the above-mentioned plate material with dense Nlt light to form a printing plate. According to the craft of letterpress printing equipment, you can print on the printing machine.

しかし、＊＊状又はコイル状の基材の印刷では、一般に
パターンが連続的に印刷できることが盪ましく、この場
合はパターン・ピッチと版の径は次の式に示す関係が正
−に保たれる必要がある。However, when printing on **-shaped or coil-shaped substrates, it is generally troublesome that patterns can be printed continuously, and in this case, the relationship between the pattern pitch and the diameter of the plate is maintained as shown in the following equation. I need to hang out.

１ π ここで、Ｒ：必要な版及びゴム網のシリンダー径ａ：パ
ターン・ピッチ １１：版−回転で得られるパダーン数 この場合の製版は所定の加エバターン形状及びピッチを
有してこの画像が連続的に印刷できるように版胴径に通
合するパターンの配列と寸法な有するネガ又はポジＪＪ
７Ａ摘な未塵光版に重ねて菖光・穏家し、加エバターン
のポジｍ像を形成させ、凸版又は平版の刷版とする。1 π Here, R: Required cylinder diameter of the plate and rubber mesh a: Pattern pitch 11: Number of patterns obtained by plate rotation Negative or positive JJ with a pattern arrangement and dimensions that match the diameter of the plate cylinder so that it can be printed continuously
It is overlaid on a 7A pristine light plate and subjected to irises and heat to form a positive m image of the modified pattern, and is used as a letterpress or lithographic printing plate.

本発明者らの実験により、市販の液状又は固体感光樹脂
版を用い、これを平面上で電光・現像し、この版を両面
接着チーブによって印刷機の版胴に正確に巻きつけ、版
の先端と末端をａ５■以内のスキマとなるように注、を
深くつなぎ合せることにより、２０〜５０ｍ／分の印刷
速度の範囲でダイレクト凸版印刷で満足すべき連続パタ
ーンの印刷が可能であることを＃＆耐した。Through experiments conducted by the present inventors, we used a commercially available liquid or solid photoresin plate, developed it with electricity on a flat surface, and then wrapped the plate accurately around the plate cylinder of a printing press using a double-sided adhesive tube, and then the tip of the plate. By deeply joining the ends with a gap of less than a5 mm, it is possible to print a satisfactory continuous pattern with direct letterpress printing at a printing speed of 20 to 50 m/min. & endured.

この場合、指定のパターン・ピッチでＰＪｒ足のパター
ンカ連続的に印刷されなければならないので、版胴径Ｒ
はパターン−ピッチ１とＲ＝−＊の対応でＥＪ変でなけ
ればならなπ い。In this case, since the PJr pattern must be printed continuously at the specified pattern pitch, the plate cylinder diameter R
must be EJ odd due to the correspondence between pattern-pitch 1 and R=-*.

第４工程 （６）は第２次紫外ｉ！照射装置であり、該装置（６）
内に第６エ程で印刷した基材（１）を尋人してその全面
に紫外−を照射し、凱旋を完全硬化せしめるが、その際
印刷部の塗膜は印刷皮層による震外蕨の３ＡｙＩＨｌに
より光硬化反応を起さず依然として第２工程での予備硬
化状態を維持する。The fourth step (6) is the second ultraviolet i! An irradiation device, the device (6)
The base material (1) printed in the 6th step is irradiated with ultraviolet light over the entire surface of the base material (1) to completely cure the triumphal coating. 3AyIHl does not cause a photocuring reaction and still maintains the precured state in the second step.

第５工程 （７）は挽曽装置であって噴射ノズ〃（８）を有する。Fifth step (7) is a grinding device and has an injection nozzle (8).

第４工程で紫外縁照射された基材（１１をｆｊｉ像装置
（７）内に導入し、ノズル（８）から現像液（９）を該
基材に噴射することにより、その印刷部即ち印刷インキ
族と該膜下の予備硬化状態を溶出又は剥離除去して、〃
ｕエバターンを現像する。図示の実施では噴射型現像装
ｆ１ｔを使用しているが、本発明はこれに限戻されず、
現像榴を備えた浸ｔｌＬ盤現像装置等各撞のものを使用
し得る。３ＪｉａＲ［（９）としては基材（１）の印刷
部を斜解又は別層可能であり、同時に、レジスト膜とな
る前記印刷部以外の完全硬化塗膜を浸さない適当な有機
溶剤例えば酢酸エチルとトリクロルエタンの混合溶剤又
はトリクロルエチレンなどを使用し得る。In the fourth step, the substrate (11) irradiated with ultraviolet edge is introduced into the FJI imager (7), and the printing part, that is, printing The ink group and the pre-cured state under the film are eluted or peeled off, and
u Develop the Everturn. Although the illustrated embodiment uses an injection type developing device f1t, the present invention is not limited to this.
Various kinds of devices such as an immersion TIL plate developing device equipped with a developing device can be used. 3JiaR [(9) is an appropriate organic solvent, such as ethyl acetate, which can obliquely dissolve or separate the printed part of the base material (1), and at the same time does not soak the completely cured coating other than the printed part, which will become a resist film. A mixed solvent of and trichloroethane or trichlorethylene may be used.

第５工程の現像終了後、基材（１）の加エバターンをト
リクレーンその他の有１ａ浴剤からなる洗浄剤ＱＱで充
分況浄し、乾燥してパターン形成されたレジストｍ！膜
を有する基材を得る。軸は洗浄槽、稙１＆文洗浄用回転
ブラシ、Ｉは乾諌滲を表わす。After completing the development in the fifth step, the treated evaporation of the substrate (1) is thoroughly cleaned with a cleaning agent QQ made of Tricrane or other 1A bath agent, and dried to form a patterned resist m! A substrate with a membrane is obtained. The axis represents the cleaning tank, the rotary brush for cleaning the base 1 and the rotary brush, and the letter I represents the dry water.

叙上の如く、本発明方法は、長巻状又はシート状の基材
の表向に、加エバターンの形成され起レジスト塗膜を連
続生産ラインで一貫形成することを可能とするものであ
り、同時に、加エバターンを紫外線硬化によるレジス）
Ｍの部分的な溶鱗性乃至は耐溶剤性の程度差を利用して
形成するものであるため、健めて高い実用性とれ陽性を
もつものである。As described above, the method of the present invention makes it possible to consistently form a resist coating film formed by an evaporated pattern on the surface of a long roll-shaped or sheet-shaped base material in a continuous production line, At the same time, the resist is cured by ultraviolet rays)
Since it is formed by utilizing the differences in the degree of partial melt scale or solvent resistance of M, it has a high degree of practicality and positive results.

次に、実施例により本発明を具体的に説明する。各実施
例で使用したｓｇ１次及び第２次紫外巌照射装筺は下記
の構成を有する。Next, the present invention will be specifically explained with reference to Examples. The sg primary and secondary ultraviolet irradiation equipment used in each example had the following configuration.

第１次紫外紐雇射装置 所定逮腿で搬送される塗装物の上下１４ｃｍの位置に夫
々４本の紫外線ランプが配置され、各ランプは互に１０
１の間隔を置いてランプ長軸がコンベアの搬送方向と直
角になるように配置される。各ランプの出力は２ｋｌ、
［効うング長は１５０蘭である。1st ultraviolet cord irradiation device Four ultraviolet lamps are placed at 14 cm above and below the painted object, which is transported by a predetermined restraint.
The lamps are arranged at an interval of 1.5 mm so that the long axes of the lamps are perpendicular to the conveying direction of the conveyor. The output of each lamp is 2kl,
[Effective length is 150 lans.

第２次紫外線照射装置 所定速度で搬送される塗装物の上下１０１の位置に夫々
５本の紫外線ランプが配置され、各ランプは互に１０１
の間隔を置いてランプ＊軸力七ンペアの搬送方向と直角
になるように配置される。各ランプの出力は２．ｏｋＷ
、４’幼ランプ長は１５０■である。Secondary ultraviolet irradiation device Five ultraviolet lamps are arranged at the top and bottom 101 positions of the painted object being transported at a predetermined speed, and each lamp is placed at 101
The lamps are spaced apart from each other and are arranged perpendicular to the conveying direction of the lamp*axial force of 7 amperes. The output of each lamp is 2. OKW
, 4' young ramp length is 150 .

実施例１ 第１図に示した製造ラインを用いて以下の例を実施した
。Example 1 The following example was carried out using the production line shown in FIG.

ラインスピードは２０ｔ／分に設定した。リン青銅製金
属帯（三菱電機製ＰＢＲＩＨ）゛にメツキレシスト性を
有する紫外線硬化性塗料（大日本インキ化学工業製ダイ
キュアＰＲ）を１５μの厚さで表層両面の全ｒｋｉＫ塗
装した後、第１次紫外線照射装置の中を通してｍ換を予
備硬化させた。The line speed was set at 20t/min. A phosphor bronze metal strip (PBRIH manufactured by Mitsubishi Electric) was coated with UV curable paint (Daicure PR manufactured by Dainippon Ink and Chemicals) having a 15 μm thickness on both surfaces of the surface, and then subjected to primary ultraviolet rays. The mixture was precured by passing it through an irradiation device.

次いで、輪転式凸版印刷機（版胴に感光性樹脂（大日本
インキ化学工業製Ｖ１０ＤＩＣＵ−８２）で作製した凸
版印刷版を絢面接着テープを用いて巻きつけ、版継目部
をエポキシ接層剤でシールしである。）と＋版印刷用蟲
インキ（大日本インキ化学工業製ニューチャンピオンア
ペックス墨）を用いて金に４帝の１１１１面に所定のパ
ターンを印刷した。次いで金属帯を第２次紫外−照射装
置の中を２０ｔｎ１分の速度で通して墨インキで印刷さ
れた以外の部分のａｍを十分に硬化させた。次いで、溶
剤噴射ノズルとナイロン製ブラッシングロールを内蔵し
たステンレスｉ浴剤視像装置と、現像液としてトリクロ
ルエチレンを使ってパターンを現像した。現像によって
、印刷パターン部の塗膜が除去さゎ〜印刷パターンに忠
実な金Ｊｆ４帝表面が携われた。現像した金属帯を旋酸
ソーダ及び第６リン酸ソーダを含むｐＨ１１のアルカｖ
ｔｇｇ中に７０℃で６０秒間浸漬し、水洗してから炭酸
ソーダ及び第６リン酸ソーダを含むｐＨ１１のアルカリ
溶液中で５０℃電圧５ｖ、電流密度４Ａ／ｄがの条件で
６０秒間電解洗浄した。酸洗いの後、銀ストライク浴中
で２５℃、　電ｆＩｔ密涙２Ａ／ｄＢ”の条件で６秒間
銀ストライクメツキした後、続いてシアン飯浴中で２５
℃、電ｔｌｔ密度４Ａ／ｄ、！の条件で６０秒間嫁メッ
キした。Next, a rotary letterpress printing machine (a letterpress printing plate made of photosensitive resin (V10DICU-82, manufactured by Dainippon Ink and Chemicals) was wrapped around the plate cylinder using azure adhesive tape, and the plate joints were coated with an epoxy adhesive. A predetermined pattern was printed on the 1111th side of the 4 emperors on gold using + version printing insect ink (New Champion Apex Sumi, manufactured by Dainippon Ink & Chemicals). Next, the metal strip was passed through a second ultraviolet irradiation device at a speed of 20 tons per minute to sufficiently harden the am on the portions other than those printed with black ink. Next, the pattern was developed using a stainless steel i-bath visualization device equipped with a solvent injection nozzle and a nylon brushing roll, and trichlorethylene as a developer. By development, the coating film on the printed pattern area was removed and a gold JF4 surface faithful to the printed pattern was created. The developed metal strip was treated with an alkali solution containing sodium trichlorate and sodium phosphate VI at pH 11.
It was immersed in TGG for 60 seconds at 70°C, washed with water, and then electrolytically cleaned for 60 seconds at 50°C in a pH 11 alkaline solution containing sodium carbonate and hexaphosphate at a voltage of 5V and a current density of 4A/d. . After pickling, silver strike plating was carried out for 6 seconds at 25°C in a silver strike bath and an electric flux of 2 A/dB, followed by 25 seconds in a cyan rice bath.
℃, electric tlt density 4A/d,! Wire plating was carried out for 60 seconds under these conditions.

硬化した塗膜は上記洗浄、メッキ操作に対し【十分なる
レジスト性を有し、塗膜の＃離は全くなかった。メッキ
の後、ジクロルメタンでレジスト塗層を剥離して水洗し
、蝋でパターンメッキされた金属帯を得た。The cured coating film had sufficient resistivity against the above-mentioned cleaning and plating operations, and there was no peeling of the coating film. After plating, the resist coating layer was peeled off with dichloromethane and washed with water to obtain a metal strip pattern-plated with wax.

実施例２ ０−ルコーターで厚さ０．６閣、大きさ５００　Ｘ４０
０ｓＩｊのアルミ板上に実施例１で用シ・た紫外線硬化
性塗料を１０μの厚さで表面に全面ｊ１！布し、この板
を１８１次紫外ｍ射装置の中を２０ｍ／分の速度で通し
て塗膜を予備硬化させた後、平版オフセット印刷機と実
施例１で用いた平版墨インキを用いて所定のパターンを
印刷した。次いでこの板を第２次紫外線照射装置の中を
２０ｍ／分の速にで通して塗膜を十分に蝶化させｔ−後
実施例１と同様の現像装置と現像液な使用してパターン
を現像した。次いで１％苛性ソーダのアルカリ溶液中で
２５℃で５０秒ｔ口］電解況浄した。水洗後シュウば２
チを含む寛鱗浴の中で陰徐に黒鉛、陽極に上記アルミ板
を椴付け、電流ｆｆＩｊ度Ｉ　Ａ　／　ａｍ２、温度２
５℃の条件で１０分間交流％Ｌ流にて陽極酸化し、仄い
で電流密度０．５Ａ／ｄｍ”ｍ度２５℃で６０分間直流
奄訛で陽極酸化した後水洗し、蒸留水の中で２０分間蕉
沸した。煮沸後、ジクロルメタンでレジストｆｉを剥離
して水洗し、パターン状に黄色に耐色したアルミ板を得
た。Example 2 Thickness 0.6 mm with 0-le coater, size 500 x 40
On the aluminum plate of 0sIj, apply the ultraviolet curable paint used in Example 1 to a thickness of 10μ over the entire surface. The plate was passed through a 181st ultraviolet irradiation device at a speed of 20 m/min to pre-cure the coating film, and then printed using a lithographic offset printing machine and the lithographic black ink used in Example 1. pattern was printed. Next, this plate was passed through a secondary ultraviolet irradiation device at a speed of 20 m/min to fully form the coating film, and after that, a pattern was formed using the same developing device and developer as in Example 1. Developed. Then, it was electrolytically cleaned in an alkaline solution of 1% caustic soda at 25° C. for 50 seconds. Shuba 2 after washing
Graphite was gradually placed on the anode in a mild bath containing water, the current was set to IA/am2, and the temperature was set to 2.
Anodize with AC %L flow for 10 minutes at 5°C, then anodize with DC current for 60 minutes at 25°C with a current density of 0.5A/d"m, wash with water, and place in distilled water. It was boiled for 20 minutes. After boiling, the resist fi was peeled off with dichloromethane and washed with water to obtain a patterned aluminum plate with a yellow color fastness.

実施例６ ０−ルコーターで片面銅張積層板の＠箭表面に夾施例１
で用いた紫外Ｉｉ＃ｊｉ！＆化性塗料を１０μの厚さで
全面連装し、この板を第１次京外線照射装置の中を２０
　ｍ１分の速度で通して塗Ｈな予備硬化させた後、平版
オフセット印刷機と実施例１で用した平＆墨インキを用
い【所定の回路用パターンを印刷した。次いで、この板
を第２次京外線照射装置の中を２０ｍ／分の速度で通し
てｍ膜を十分に硬化させた後、酢酸エチルと１．１．１
−トリクロルエタンの等菫混合溶液を現像液とし実施例
１と同様の＃Ｌ像装置を使用してパターンを現像した。Example 6 Applying coating on the surface of a single-sided copper-clad laminate using a 0-layer coater Example 1
The ultraviolet Ii#ji used in The entire surface was coated with a 10 μm thick chemical paint, and this board was placed inside the first Kyoto external beam irradiation equipment for 20 minutes.
After coating and precuring at a speed of 1 minute, a predetermined circuit pattern was printed using a lithographic offset printer and the plain and black ink used in Example 1. Next, this plate was passed through the second Kyoto external radiation irradiation device at a speed of 20 m/min to fully cure the m film, and then treated with ethyl acetate and 1.1.1
The pattern was developed using a #L imager similar to that in Example 1 using an equi-violet mixed solution of -trichloroethane as a developer.

この板を２０チの塩化第二鋼及び１５チのａＩＩ繊鈑を
言ひエツチング成牛に５６℃で１０分関＆ｆｆしてパタ
ーン部をエツチングし、水洗後二塩化エチレンでレジ’
ｘト慮ｇを剥離してｍ陥が回路状に残った積層板を得た
。銅消回路間の解像性は２０μ相でエツチングレジスト
インキを用いたスクリーン印刷法にて得られた解雪性よ
りも良好である。This plate was etched using 20-inch chlorinated steel and 15-inch aII steel plate. The pattern was etched by heating at 56°C for 10 minutes, and after washing with water, it was washed with ethylene dichloride.
A laminate with m defects remaining in the form of a circuit was obtained by peeling off x and g. The resolution between the copper dissipators is better than that obtained by screen printing with a 20μ phase etching resist ink.

実施例４ ０−ルコーターで厚さ６鵡大きさ５０Ｘ１００ｍのガラ
ス板上に実施例１で用いた紫外巌硬化性塗料を１５ｊ１
の厚さで全耐塗装し、この板を第１次京外線照射装置の
中を２０１！Ｌ／分の速度で通し、塗膜を予備硬化させ
た後、凸版オフセット印刷Ｉａ（版胴に感光性衛脂（大
日本インキ化学工業製ＶＩＯＤＩＣＵ−８２）で作製し
た凸版印刷版を装着しである。）と実施例１で用いた平
版蟲インキを用いて所定のパターンを印刷し、実施例３
と同様にして塗膜の第２次紫外線照射と現像を行いレジ
ストパターンを有するガラス板を得た。この板の表向に
粒度６０の金剛砂を５鴫Ａ−の圧力で吠きつけた彼、水
洗し、次いでジクロルメタンでレジスト塗膜を剥離した
後再び水洗してパターン部が粗面化された装飾ガラス板
を得た０Example 4 The ultraviolet curable paint used in Example 1 was coated on a glass plate with a thickness of 6 cm and a size of 50 x 100 m using a 0-layer coater.
Fully paint-resistant with a thickness of 201! After pre-curing the coating film at a speed of L/min, a letterpress printing plate made of photosensitive sanitary resin (VIODICU-82, manufactured by Dainippon Ink and Chemicals) was attached to the plate cylinder. ) and the lithographic ink used in Example 1 to print a predetermined pattern.
The coating film was subjected to secondary ultraviolet irradiation and development in the same manner as described above to obtain a glass plate having a resist pattern. He applied diamond sand with a particle size of 60 to the surface of this board at a pressure of 5 A-, washed it with water, then peeled off the resist coating with dichloromethane, and washed it again with water to roughen the pattern area of the decorative glass. Got a board 0

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本発明の実施例を示す工程図である。 （１）・・・・・・・・・基材、（２）・・・・・・・
・・遊装装置、（３）、・・・・・・・・・紫外梅蒙化
性塗料、（４・・・・・・・・・第１次紫外線照射装置
、俤）・・・・・・・・・印刷機、（６）・・・・・・
・・・第２次紫外りｌｌ照射装置、（７）・・・・・・
・・・現像装置、（８）・・・・・・・・・噴射ノズル
、（９）・・・・・・・・・現像液、ａ曖・・・・・・
・・・洗浄液、ロト・・・・・・・洗浄情、ａか・・・
・・・・・洗浄用回転ブラシ、Ｉ・・・・・・・・・乾
燥器The drawings are process diagrams showing embodiments of the present invention. (1)・・・・・・・・・Base material, (2)・・・・・・・
...Amusement equipment, (3), .....Ultraviolet irradiation paint, (4......Primary ultraviolet irradiation device, 俤)...・・・・・・Printing machine, (6)・・・・・・
...Second ultraviolet irradiation device, (7)...
...developing device, (8)... injection nozzle, (9)... developer, a vague...
...Cleaning liquid, Roto...Cleaning emotion, a...
...Rotating brush for cleaning, I...Dryer

Claims (1)

【特許請求の範囲】[Claims] 基材の表面にレジスト性を有する紫外巌硬化性ｍ料を遊
装する第１工程と、その塗膜に紫外線を照射して該塗膜
を予＊硬化せしめる第２工程と、このａｍに所定のパタ
ーンを非感光性の不透明印刷インキで印刷する第５工根
と、この印刷された塗膜に紫外線を照射して印刷部以外
の道換を完全硬化せしめると共に印刷部の塗膜を前記予
備硬化状態に維持する第４工程と、この予備硬化状態に
維持した印刷部の塗膜を溶出又は剥離してパターン部を
形成する第５工程とから成ることを特徴としたパターン
形成されたレジスト性硬化樹脂膜の作製方法。A first step in which an ultraviolet curable m material having resist properties is applied to the surface of the base material, a second step in which the coating film is irradiated with ultraviolet rays to pre-cure the coating film, and a predetermined method for this am. The fifth step is to print the pattern with non-photosensitive opaque printing ink, and the printed coating film is irradiated with ultraviolet rays to completely cure the other parts of the coating, and the coating film of the printed part is cured as described above. A patterned resist characterized by comprising a fourth step of maintaining the cured state, and a fifth step of eluating or peeling off the coating film of the printed area maintained in this pre-cured state to form a pattern area. Method for producing a cured resin film.