JPS5872061A - Multiprober - Google Patents
MultiproberInfo
- Publication number
- JPS5872061A JPS5872061A JP17170581A JP17170581A JPS5872061A JP S5872061 A JPS5872061 A JP S5872061A JP 17170581 A JP17170581 A JP 17170581A JP 17170581 A JP17170581 A JP 17170581A JP S5872061 A JPS5872061 A JP S5872061A
- Authority
- JP
- Japan
- Prior art keywords
- probers
- prober
- insulating
- metal
- probe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
Description
【発明の詳細な説明】
この発明はマルチプローバーの構造及びその製造方法ら
に詳しくは、多数のブロービングを同時に行なうため小
面積内に多数配設さnるプローバーとこのプローバーの
先端に配設さ扛プローバー全2本ごと挿嵌して固定し絶
縁材からなる絶縁チップと、この絶縁チップを多数列べ
て固足し金属のシールド効果によってプローバー相互間
の干渉を除去し被検査体の上部に配設さnる金属台よシ
なるものである。DETAILED DESCRIPTION OF THE INVENTION In detail, the present invention relates to the structure of a multi-prober and its manufacturing method. All two probers are inserted and fixed together, and the insulating chips made of insulating material are placed in a row and fixed, and the interference between the probers is removed by the shielding effect of the metal. It is like a metal stand on which it is placed.
そしに対して従来のプローバーの固定構造を第1図によ
って説明すると、被検査体である水晶発振子群1の接触
部の間隔に合わせて絶縁材2に細孔を設けて、その細孔
にプローバー3が挿入さnるとともに接層剤で固定し、
プローバー3の相互の間には浮遊容量による発振回路間
の干渉防止用の板または線からなるシールド材4を絶縁
材2に挿嵌して固定さnlそしてプローバー3が破損し
た場合に交換を容易にするために絶縁材2に配設さ:r
した細孔にプローバー3を挿入して固定する接層剤は熱
軟化性のものを使用する。On the other hand, the fixing structure of a conventional prober will be explained with reference to FIG. The prober 3 is inserted and fixed with adhesive,
Between the probers 3, a shielding material 4 made of a plate or wire for preventing interference between oscillation circuits due to stray capacitance is inserted into the insulating material 2 and fixed, making it easy to replace if the prober 3 is damaged. Arranged on insulation material 2 to make: r
A heat-softening adhesive is used for inserting and fixing the prober 3 into the pores.
シカシ、プローバーおよびシールド材が密接しているた
めプローバーが破損した場合にはプローバーの交換が必
ずしも容易でなく、シールド材が線である場合には浮遊
容量による発振回路間の干渉を完全に除去できなかった
。Because the shield, prober, and shielding material are in close contact with each other, it is not always easy to replace the prober if it is damaged, and if the shielding material is a wire, it is not possible to completely eliminate interference between the oscillation circuits due to stray capacitance. There wasn't.
そこで、本発明は前述の技術的課題を解決するため多数
同時発振させてブロービングする場合にプローバーが近
接することによるプローバー間の浮遊容量により発振回
路内の相互干渉を防止するとともにプローバーが破損し
た場合のプローバーの交換を容易にするプローバーの固
定構造及びその製造を可能にしたものである。Therefore, in order to solve the above-mentioned technical problem, the present invention prevents mutual interference in the oscillation circuit due to stray capacitance between the probers due to probers being close to each other when probing with multiple simultaneous oscillations, and also prevents damage to the probers. The present invention provides a prober fixing structure that facilitates prober replacement in case of emergency, and enables its manufacture.
以下、本発明の実施例について図面によって説明する。Embodiments of the present invention will be described below with reference to the drawings.
第2図はプローバー10の構造を表わすものであり、タ
ングステン材からなる探針[2は電気通導性を同上させ
るため金メッキがなさ[、その先端に被検査体である水
晶発振子群1の接触部が配設さn1探針12のみでは弾
性強度が弱(支持しにくいので探針[2の接触部を除き
バイブ13で被管し、さらにその外周に絶縁材14たと
えばテフロンを、真空蒸看加工により、コーティングし
、その絶縁材14の外周に金属材料たとえばアルミニウ
ムを真空蒸溜刀ロエによりコーティングし探針I2のシ
ールド材15となす。Figure 2 shows the structure of the prober 10, in which the probe tip 2 is made of tungsten material and is not plated with gold to improve electrical conductivity. Since the contact part is provided only with the n1 probe 12, the elastic strength is weak (it is difficult to support it), so the probe [2] except for the contact part is covered with a vibrator 13, and an insulating material 14 such as Teflon is coated on the outer periphery of the tube by vacuum evaporation. The outer periphery of the insulating material 14 is coated with a metal material such as aluminum using a vacuum distillation knife to form the shield material 15 of the probe I2.
第3図はプローバーを金属台に配設する構造を表わすも
のであシ、水晶発柵子1の上面に金属板21が配設さn
1水晶発振子群1の接触部の上部の位置で接触部の配列
に合わせて金属板21に長孔22が穿設され、この長孔
22にテフロン材からなる絶縁チップ加が密接して多数
配設さ牡、この絶縁チップ30には発揚回路に接続さn
る2本ごとのプローバー10の先端が挿入さn接層剤で
固定さtlこの様にして金属板21に配列さnた絶縁チ
ップ3of:固定するため各2本ごとのプローバー10
の部分部j24を設けることによって全桟板21の上面
に押え板nが配設さnlその場合にプローバー10のシ
ールド材15を有する部分まで金属性の押え板23の中
に挿入することによってプローバー10間の浮遊容量を
除去して相互干渉を排し、シールドを完全になすことが
できる。第3図は絶縁チップの配列状態を表わすもので
あり、金属板21に配設した長孔ηに絶縁チ・ツブ30
ヲ密接して配設し、その上面から発振回路に接続さnる
各2本ごとのプローバー10が配設さnている部分を除
き押え坂路で押圧して絶縁チップ?lJf固定するとと
もにシールド材としての働きをする。FIG. 3 shows a structure in which the prober is arranged on a metal stand, in which a metal plate 21 is arranged on the top surface of the crystal shield 1.
1. A long hole 22 is bored in the metal plate 21 at a position above the contact portion of the crystal oscillator group 1 in accordance with the arrangement of the contact portion, and a large number of insulating chips made of Teflon material are closely attached to the long hole 22. This insulating chip 30 is connected to the launch circuit.
The tips of every two probers 10 are inserted and fixed with a bonding agent.In this way, the tips of every two probers 10 are arranged on the metal plate 21.
By providing the partial portion j24, a holding plate n is disposed on the upper surface of the entire crosspiece plate 21.In that case, by inserting the prober 10 into the metal holding plate 23 up to the part having the shield material 15, the prober It is possible to eliminate stray capacitance between 10 and 10 to eliminate mutual interference and achieve complete shielding. FIG. 3 shows the arrangement of insulating chips.
Two probers 10 each connected to the oscillation circuit are arranged from the upper surface of the insulated chips by pressing them with a presser slope. It fixes lJf and also works as a shielding material.
5−
第4図はプローバーを多数配列したものを表わすもので
あり、被検査体である水晶発振子群1の上面の配設さn
た金属板21ヲ支持体40で支持して発振回路に接続さ
nる各2本ごとのプローバ(−10ヲ放射状に配設して
各発振回路に接続する。5- Figure 4 shows a large number of probers arranged, and the arrangement on the top surface of the crystal oscillator group 1, which is the object to be inspected.
The metal plate 21 is supported by a support 40 and connected to an oscillation circuit.Two probers (-10) are arranged radially and connected to each oscillation circuit.
本発明は以上のように構成したことによって多数同時発
振させてブロービングする場合にプローバーが密接する
ことによる各プローバー間の浮遊容量により発振回路内
の相互干渉を防止できるとともにプローバーが破損した
場合のプローバーの交換を容易にするプローバーの固定
構造を実現した技術的効果の極めて優nた発明である。By configuring the present invention as described above, it is possible to prevent mutual interference in the oscillation circuit due to the stray capacitance between the probers due to the close proximity of the probers when performing probing with multiple simultaneous oscillations. This is an invention with extremely excellent technical effects that realizes a prober fixing structure that facilitates prober replacement.
第1図は従来例の断面図、第2図はプローバーの一部断
面図、第3図は金属台の一部断面図、第4図は金属台の
平面図、第5図はプローバ(−の配列の平面図を表わす
。
[2:探針 13:バイブ
14:絶縁材 15:シールド材6−
10ニブローバー 21:金属板
22:長孔 23=押え板
24:切欠部 30:絶縁チップ40:支持体
以上
出願人 株式会社第二精工舎
代理人 弁理士最上 務
7−Fig. 1 is a sectional view of the conventional example, Fig. 2 is a partial sectional view of the prober, Fig. 3 is a partial sectional view of the metal stand, Fig. 4 is a plan view of the metal stand, and Fig. 5 is the prober (- [2: Probe 13: Vibrator 14: Insulating material 15: Shield material 6-10 Nib Rover 21: Metal plate 22: Long hole 23 = Holding plate 24: Notch 30: Insulating chip 40: Supporter and above Applicant Daini Seikosha Co., Ltd. Agent Mogami Mogami -
Claims (1)
に多数配設さnるプローバーと、このプローバーの先端
に配設さ2Lプローバーを各発振回路に接続さnる2本
ごとに固定するための絶縁材からなる絶縁チップと、こ
の絶縁チップを被検査体に会わせて密接配列して固冗し
金属のシールド効果によってプローバー相互間の干渉を
除去するよう被検査体の上部に配設さlf″した金属台
とからなるマルチプローバー 2、前記プローバーはタングステン材からなる探針と、
との探針の先端の被検査体への接触部を除き弾性を同上
させ支持しやすくするため探針を松管するバイブとから
なり、このパイプの周囲に、真空蒸眉加工によシ絶縁材
をコーティングし、このコーティングさした絶縁材の周
囲に、さらに真空蓋! 7Jl]工により、シールド材
として金属物質を二重にコーティングすることにより、
プローバー相互間の干渉を除去する構成としたことを特
徴とする特許請求の範囲第1項記載のマルチプローバー
〇 3、前記絶縁チップはテフロン材からなることを特徴と
する特許請求の範囲第1項記載のマルチプローバー。 4、前記金属台は絶縁チップを金唄板に挿嵌すると共に
、上面からプローバ一部分を除き金属性の押え板を配設
し、前記絶縁チップを固定する構成よりなることを特徴
とする特許請求の範囲第1項記載のマルチプローバー。[Scope of Claims] A large number of 1° probers are disposed within a small area to perform probing by simultaneously oscillating a large number of probers, and a 2L prober disposed at the tip of the prober is connected to each oscillation circuit. An insulating tip made of an insulating material is used to fix every two probers, and the insulating tips are closely arranged so as to meet the object to be tested, and the probes are covered so that interference between the probers is eliminated by the shielding effect of the redundant metal. A multi-prober 2 consisting of a metal stand arranged above the object to be inspected, the prober having a probe made of tungsten material,
It consists of a vibrator that holds the probe in a pine tube to increase its elasticity and make it easier to support, except for the part where the tip of the probe contacts the object to be inspected. The material is coated with insulation material, and then a vacuum lid is placed around the coated insulation material! 7Jl] technology, by double coating metal material as a shielding material,
A multi-prober according to claim 1, characterized in that the multi-prober is configured to eliminate interference between the probers. 〇3. Claim 1, characterized in that the insulating chip is made of Teflon material. Multiprober mentioned. 4. The metal stand has a configuration in which the insulating chip is inserted into a metal plate, and a metal holding plate is disposed on the top surface except for a portion of the prober to fix the insulating chip. The multi-prober according to item 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17170581A JPS5872061A (en) | 1981-10-27 | 1981-10-27 | Multiprober |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17170581A JPS5872061A (en) | 1981-10-27 | 1981-10-27 | Multiprober |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5872061A true JPS5872061A (en) | 1983-04-28 |
Family
ID=15928144
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17170581A Pending JPS5872061A (en) | 1981-10-27 | 1981-10-27 | Multiprober |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5872061A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62167168U (en) * | 1986-04-14 | 1987-10-23 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS519661B2 (en) * | 1972-11-13 | 1976-03-29 | ||
JPS5347874A (en) * | 1976-09-20 | 1978-04-28 | Seiko Instr & Electronics Ltd | Fixing structure for flow bar |
-
1981
- 1981-10-27 JP JP17170581A patent/JPS5872061A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS519661B2 (en) * | 1972-11-13 | 1976-03-29 | ||
JPS5347874A (en) * | 1976-09-20 | 1978-04-28 | Seiko Instr & Electronics Ltd | Fixing structure for flow bar |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62167168U (en) * | 1986-04-14 | 1987-10-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS62182672A (en) | Testing probe | |
JP2001223247A (en) | Support for conductive contact and contact probe unit | |
JPS6341041A (en) | Semiconductor device | |
JPS5872061A (en) | Multiprober | |
EP0838685A3 (en) | Probe card with needle-like probes resiliently supported by rigid substrate and process for fabricating thereof | |
JP2000121673A (en) | Contactor | |
JPH03209738A (en) | Probe card | |
JPH06230033A (en) | Probe base plate | |
JP3204102B2 (en) | Contact probe | |
JPH0145029B2 (en) | ||
JPS6218036Y2 (en) | ||
JP2559129B2 (en) | Probe card | |
JPS5834935B2 (en) | Semiconductor wafer testing probe | |
JPS60198838A (en) | Probe card | |
JPH06308163A (en) | Probe device | |
JPH0926437A (en) | Probe card and inspection device using it | |
JPS612339A (en) | Probe card | |
JPH03286543A (en) | Probe for test of semiconductor integrated circuit device | |
KR0143962B1 (en) | Probe card having skew probe tip | |
JPS5826530Y2 (en) | probe card | |
JPS6141232Y2 (en) | ||
KR20170008531A (en) | Probe structure and assembly for contracting probe structure | |
JPS5826531Y2 (en) | probe card | |
JPH02290564A (en) | Probe head and its manufacture | |
JPH04186855A (en) | Probing equipment |