JPH0145029B2 - - Google Patents
Info
- Publication number
- JPH0145029B2 JPH0145029B2 JP18869583A JP18869583A JPH0145029B2 JP H0145029 B2 JPH0145029 B2 JP H0145029B2 JP 18869583 A JP18869583 A JP 18869583A JP 18869583 A JP18869583 A JP 18869583A JP H0145029 B2 JPH0145029 B2 JP H0145029B2
- Authority
- JP
- Japan
- Prior art keywords
- probe
- terminal
- needle
- probe needle
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000523 sample Substances 0.000 claims description 36
- 238000012360 testing method Methods 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 238000005259 measurement Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 2
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 241001422033 Thestylus Species 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Description
【発明の詳細な説明】
本発明は、ウエフアなどの集積回路の特性試験
の際にプローブカードに装着して使用されるプロ
ーブニードルに関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a probe needle that is attached to a probe card and used when testing the characteristics of integrated circuits such as wafers.
一般に、プローブカードは大要次のように構成
されている。すなわち、第1図及び第2図に示す
ように、該プローブカード1は基板2と、プロー
ブリング3及びこれの下面に取付けられる多数の
プローブニードル4とを備えている。前記基板2
には集積回路の電気的特性の試験または試験補助
用の回路(以下、周辺回路という)が組込まれ、
その本体部分にプローブリング3を嵌着固定する
リング状の固定部5を有すると共に、基端部にテ
スタ6と接続するコネクタ7を有する。前記固定
部5には周辺回路と電気的に接続されたソケツト
部8が形成されている。一方、プローブリング3
の上面にはプローブニードル4と同数のピン部9
が形成され、該ピン部9はプローブニードル4と
電気的に接続されている。そして、固定部5にプ
ローブリング3を機械的に嵌着すると同時に、ピ
ン部9がソケツト部8に嵌着され、これにより基
板2上の周辺回路とプローブニードル4とが電気
的に接続される。しかるときは、基板2のコネク
タ7にテスタ6を接続し、プローブニードル4を
被試験用の集積回路10の各端子に接触させ、こ
れによつて集積回路10の特性を試験する。 Generally, a probe card is configured as follows. That is, as shown in FIGS. 1 and 2, the probe card 1 includes a substrate 2, a probe ring 3, and a number of probe needles 4 attached to the lower surface of the probe ring 3. Said substrate 2
A circuit (hereinafter referred to as a peripheral circuit) for testing the electrical characteristics of an integrated circuit or for supporting the test is incorporated in the
It has a ring-shaped fixing part 5 for fitting and fixing the probe ring 3 into its main body part, and has a connector 7 connected to a tester 6 at its base end. A socket portion 8 is formed in the fixing portion 5 and is electrically connected to a peripheral circuit. On the other hand, probe ring 3
The top surface has the same number of pin parts 9 as the probe needles 4.
is formed, and the pin portion 9 is electrically connected to the probe needle 4. Then, at the same time as the probe ring 3 is mechanically fitted to the fixed part 5, the pin part 9 is fitted to the socket part 8, thereby electrically connecting the peripheral circuit on the board 2 and the probe needle 4. . In such a case, the tester 6 is connected to the connector 7 of the board 2, and the probe needles 4 are brought into contact with each terminal of the integrated circuit 10 to be tested, thereby testing the characteristics of the integrated circuit 10.
ところで、プローブニードル4はその本体11
の針先部12が被試験用の集積回路10の端子に
確実に接触することが要請される。しかるに、従
来のプローブニードル4は第7図イ,ロに示すよ
うに、針先部12の端子と接触する底面13が部
分球面状(第7図イ)、あるいは、円形平面状
(第7図ロ)に形成されていたため、そのいずれ
の場合においても、端子表面に対して点接触状に
接触することになり、したがつて、接触圧が弱い
ときは接触不良を招き、また接触圧が強いときは
接触部の端子表面にピンホール等の損傷を来たす
など、いずれにしても不安定な接触状態を完全に
回避することができず、十分な測定精度を得難い
という問題があつた。 By the way, the probe needle 4 has its main body 11.
It is required that the needle tip 12 of the stylus reliably contacts the terminal of the integrated circuit 10 under test. However, as shown in FIGS. 7A and 7B, in the conventional probe needle 4, the bottom surface 13 of the needle tip 12 that contacts the terminal is partially spherical (FIG. 7A) or circularly planar (FIG. 7A). (b), so in either case, it will come into point contact with the terminal surface, resulting in poor contact if the contact pressure is weak, or if the contact pressure is strong. In any case, it is impossible to completely avoid unstable contact conditions, such as damage such as pinholes on the terminal surface of the contact portion, and there is a problem in that it is difficult to obtain sufficient measurement accuracy.
本発明は、かかる問題を解決するためになさ
れ、プローブニードル本体の針先部の底面形状を
抜本的に改良することにより、該底面を端子表面
に安定的に線接触させて、測定精度の向上を図る
ことを目的とする。 The present invention was made to solve this problem, and by fundamentally improving the bottom shape of the tip of the probe needle body, the bottom surface can be brought into stable line contact with the terminal surface, thereby improving measurement accuracy. The purpose is to achieve this goal.
以下、本発明の実施例を図面に基き詳細に説明
する。 Embodiments of the present invention will be described in detail below with reference to the drawings.
第3図は本発明に係るプローブニードルの要部
を示し、これのプローブニードル本体11はタン
グステン、パラジウム合金、ベリリウムカツパー
などの材質からなり、断面円形の細線の先端部分
を下方に鈍角状に屈曲させた形状を有する。この
本体11はその基端部がプローブリング4の下面
に取付けられて、プローブカード1の基板2上の
周辺回路に電気的に接続されることは前述した周
知の構成の通りである(第1図及び第2図参照)。 FIG. 3 shows the main part of the probe needle according to the present invention. The probe needle main body 11 is made of a material such as tungsten, palladium alloy, or beryllium copper. It has a bent shape. This main body 11 has its base end attached to the lower surface of the probe ring 4 and is electrically connected to the peripheral circuit on the substrate 2 of the probe card 1, as in the well-known configuration described above (first (See Figure and Figure 2).
第4図において、プローブニードル本体11の
針先部12は先細り状に形成され、その前後面1
4,14は傾斜平面状の截断面に形成されてい
る。さて、この針先部12の底面13は部分円柱
周面からなる彎曲面に形成されており、その彎曲
面の直径はおおよそ0.5mmを越えない程度に設定
されている。 In FIG. 4, the needle tip portion 12 of the probe needle body 11 is formed in a tapered shape, and its front and rear surfaces 1
4 and 14 are formed into inclined planar cut sections. Now, the bottom surface 13 of this needle tip portion 12 is formed into a curved surface consisting of a partially cylindrical peripheral surface, and the diameter of the curved surface is set to an extent not exceeding approximately 0.5 mm.
しかるときは、第5図及び第6図に示すよう
に、針先部12は一定角度をもつて集積回路10
の端子15上に位置設定され、その底面13が端
子15の表面に接触するが、この接触の際、上記
両図からも明らかなように、彎曲底面13は端子
15表面に線接触し、該端子15上に所定の接触
圧を安定して付与することになる。 In such a case, as shown in FIGS. 5 and 6, the needle tip 12 may be attached to the integrated circuit 10 at a certain angle.
The curved bottom surface 13 is placed in line contact with the surface of the terminal 15, and its bottom surface 13 comes into contact with the surface of the terminal 15, as is clear from both figures above. A predetermined contact pressure is stably applied onto the terminal 15.
なお、この針先部12の底面13は、針先部1
2と端子15との接触角度のばらつきや、針先部
12の端子15表面上でのずれ動き等を考慮した
場合、真円柱の周面部分からなる彎曲面に形成す
るのが接触圧の安定保持上望ましいが、このほか
楕円柱や放物線断面を有する柱体の周面部分など
部分円柱周面状の範疇に含まれる彎曲面に形成す
ることも可能である。また、プローブニードル本
体11の断面形状は円形のほか角形等であつても
よい。 Note that the bottom surface 13 of this needle tip portion 12 is
When considering variations in the contact angle between the terminal 15 and the terminal 15, and deviations of the needle tip 12 on the surface of the terminal 15, forming a curved surface made of the peripheral surface of a perfect cylinder will stabilize the contact pressure. Although desirable for retention purposes, it is also possible to form a curved surface included in the category of a partially cylindrical peripheral surface, such as the peripheral surface of a column having an elliptical cylinder or a parabolic cross section. Further, the cross-sectional shape of the probe needle main body 11 may be not only circular but also rectangular or the like.
以上説明したように、本発明によればプローブ
ニードル本体の針先部の底面形状を部分円柱周面
状の彎曲面としたことにより、針先部の彎曲底面
がウエフアなどの被試験物の集積回路の微小な端
子上に線接触状に接触するものとした。したがつ
て、プローブニードルと端子との接触圧が該端子
表面に均等に付与されるため、接触圧の強弱にか
かわらず、安定化が図れる。このため、端子表面
に酸化膜等が自然形成されたものについては、強
い接触圧を付与したうえで針先部底面を端子表面
上でスライドさせることにより、該酸化膜を無理
なく除去することができるので、そのクリーニン
グ効果によりプローブニードルと端子との接触抵
抗が適正値で安定して、測定精度の向上に寄与で
きると共に、端子これ自体にピンホール等の損傷
を及ぼす虞をなくすことができ、これにより被試
験用の特性試験の際における不良品発生率を可及
的に低減し得るため、被試験物の歩留りの向上を
図ることができるなど、ウエフア等の被試験物の
集積回路の電気特性の測定に応用して効果が大で
ある。 As explained above, according to the present invention, the bottom surface of the tip of the probe needle body is formed into a curved surface having a partial cylindrical circumferential surface shape, so that the curved bottom surface of the needle tip can accumulate the test object such as a wafer. It was designed to make a line contact on a minute terminal of the circuit. Therefore, the contact pressure between the probe needle and the terminal is applied evenly to the surface of the terminal, so that stability can be achieved regardless of the strength of the contact pressure. Therefore, if an oxide film or the like is naturally formed on the terminal surface, the oxide film can be easily removed by applying strong contact pressure and sliding the bottom of the needle tip over the terminal surface. As a result, the cleaning effect stabilizes the contact resistance between the probe needle and the terminal at an appropriate value, contributing to improved measurement accuracy, and eliminating the risk of pinholes or other damage to the terminal itself. This makes it possible to reduce the incidence of defective products as much as possible during characteristic tests of the device under test, thereby improving the yield of the device under test. It is highly effective when applied to the measurement of characteristics.
第1図及び第2図は周知のプローブカードを示
し、第1図は平面図、第2図は第1図における
−線に沿う断面図である。第3図乃至第6図は
本発明の実施例をそれぞれ示し、第3図は要部側
面図、第4図は針先部の拡大斜視図、第5図は使
用状態を示す要部拡大正面図、第6図は第5図に
おける矢視図である。第7図イ,ロはそれぞれ
異なる従来例を示す針先部の斜視図である。
1……プローブカード、4……プローブニード
ル、10……集積回路、11……プローブニード
ル本体、12……プローブニードル本体の針先
部、13……針先部の底面、15……集積回路の
端子。
1 and 2 show a well-known probe card, with FIG. 1 being a plan view and FIG. 2 being a sectional view taken along the - line in FIG. 1. Figures 3 to 6 show embodiments of the present invention, with Figure 3 being a side view of the main part, Figure 4 being an enlarged perspective view of the needle tip, and Figure 5 being an enlarged front view of the main part showing the state of use. 6 is a view taken along the arrows in FIG. 5. FIGS. 7A and 7B are perspective views of needle tips showing different conventional examples. DESCRIPTION OF SYMBOLS 1... Probe card, 4... Probe needle, 10... Integrated circuit, 11... Probe needle body, 12... Needle tip of probe needle body, 13... Bottom surface of needle tip, 15... Integrated circuit terminal.
Claims (1)
ードに装備され、該使用時において、プローブニ
ードル本体の針先部の底面が前記集積回路の端子
に接触するようにしたプローブニードルにおい
て、前記プローブニードル本体の針先部の底面が
部分円柱周面状の彎曲面に形成されていることを
特徴とするプローブニードル。1. In a probe needle that is installed in a probe card used for characteristic testing of integrated circuits, and is configured such that the bottom surface of the needle tip of the probe needle body comes into contact with the terminal of the integrated circuit during use, the probe needle body A probe needle characterized in that the bottom surface of the needle tip portion is formed into a curved surface in the shape of a partially cylindrical peripheral surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18869583A JPS6080772A (en) | 1983-10-08 | 1983-10-08 | Probe needle |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18869583A JPS6080772A (en) | 1983-10-08 | 1983-10-08 | Probe needle |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6080772A JPS6080772A (en) | 1985-05-08 |
JPH0145029B2 true JPH0145029B2 (en) | 1989-10-02 |
Family
ID=16228202
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18869583A Granted JPS6080772A (en) | 1983-10-08 | 1983-10-08 | Probe needle |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6080772A (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0331077Y2 (en) * | 1984-12-05 | 1991-07-01 | ||
JPS6361965A (en) * | 1986-09-03 | 1988-03-18 | Ricoh Co Ltd | Method and device for inspecting pattern substrate |
JPS63128264A (en) * | 1986-11-18 | 1988-05-31 | Nec Corp | Probe card |
JPH0611461Y2 (en) * | 1988-06-13 | 1994-03-23 | アンリツ株式会社 | probe |
JPH05102258A (en) * | 1991-10-08 | 1993-04-23 | Nippon Maikuronikusu:Kk | Probe |
-
1983
- 1983-10-08 JP JP18869583A patent/JPS6080772A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6080772A (en) | 1985-05-08 |
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