JPS5840692B2 - External atmosphere detection device - Google Patents
External atmosphere detection deviceInfo
- Publication number
- JPS5840692B2 JPS5840692B2 JP1628976A JP1628976A JPS5840692B2 JP S5840692 B2 JPS5840692 B2 JP S5840692B2 JP 1628976 A JP1628976 A JP 1628976A JP 1628976 A JP1628976 A JP 1628976A JP S5840692 B2 JPS5840692 B2 JP S5840692B2
- Authority
- JP
- Japan
- Prior art keywords
- external atmosphere
- detection device
- heat
- metal
- pair
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
Description
【発明の詳細な説明】
この発明はセラミックのような耐熱性絶縁基体の上面に
ガス、湿度を検知するための金属酸化物半導体層からな
る外部雰囲気検知部を形成した外部雰囲気検知装置に関
するものである。[Detailed Description of the Invention] The present invention relates to an external atmosphere detection device in which an external atmosphere detection section made of a metal oxide semiconductor layer for detecting gas and humidity is formed on the top surface of a heat-resistant insulating substrate such as ceramic. be.
従来、耐熱性絶縁基体上に外部雰囲気検知用の電極とリ
ード線とを接続するための導電パターンが形成され、こ
の導電パターンをタングステンのような比較的酸化され
易い金属で形成していた。Conventionally, a conductive pattern for connecting an electrode for detecting an external atmosphere and a lead wire has been formed on a heat-resistant insulating substrate, and this conductive pattern has been formed of a metal that is relatively easily oxidized, such as tungsten.
この場合、そのパターンが金属酸化物半導体層を形成す
る為の酸化雰囲気中の高温度処理で酸化されたタングス
テン等の層が破壊され外部雰囲気検知用電極間の電気抵
抗値が増大し、素子特性を劣化させる欠点がある。In this case, the layer of oxidized tungsten or the like is destroyed by the high-temperature treatment in an oxidizing atmosphere to form the metal oxide semiconductor layer, increasing the electrical resistance between the external atmosphere sensing electrodes and increasing the device characteristics. It has the disadvantage of causing deterioration.
この発明は上記欠点を改善することを目的とし、以下こ
の発明の実施例を図面にしたがって説明する。The present invention aims to improve the above-mentioned drawbacks, and embodiments of the present invention will be described below with reference to the drawings.
第１図はこの発明に係る外部雰囲気検知装置の一例を一
部切欠して示す斜視図で、セラ□ツク基体のような耐熱
性絶縁基体１上に１対の白金ｐｔ線のような耐酸化性金
属線２，３を主面４に平行に配設して溶接または融着し
、この金属線２，３を覆って基体主面４上にニッケルＮ
ｉ、金Ａｕ、銀Ａｇ、白金ｐｔの少なくとも１種を含む
導体ペーストをスクリーン印刷して電極５，６を形成し
たのち、不活性（還元性）雰囲気中で一体的に焼成され
る。FIG. 1 is a partially cutaway perspective view showing an example of an external atmosphere detection device according to the present invention. Metal wires 2 and 3 are arranged parallel to the main surface 4 and welded or fused, and nickel N is placed on the main surface 4 of the base body, covering the metal wires 2 and 3.
After forming the electrodes 5 and 6 by screen printing a conductive paste containing at least one of gold, gold, Au, silver, and platinum, they are fired integrally in an inert (reducing) atmosphere.
検知用リード線７，８は基体１に穿設された各貫通孔９
を基体１の上方から垂直に貫通して設定さへ金属線２，
３の先端部とともに銀ろうなどのろう付は材１１で電気
的に接続固定される。The detection lead wires 7 and 8 are connected to each through hole 9 bored in the base 1.
The metal wire 2 is set vertically through the base 1 from above.
3 and the tip thereof are electrically connected and fixed with a material 11 using silver solder or the like.
リード線７，８の頭部１２が嵌入され、銀ろう等のろう
付は材１１で固定されたのち、基体１の上面には電極５
，６を覆ってＳ ｎ ０２ ｔ Ｖ２０５ 。After the heads 12 of the lead wires 7 and 8 are inserted and the soldering material 11 such as silver solder is fixed, the electrode 5 is placed on the top surface of the base 1.
, 6 over S n 02 t V205 .
ＺｎＯのような金属酸化物半導体層、すなわち外部雰囲
気検知部１４が厚膜印刷により被着される。A metal oxide semiconductor layer such as ZnO, ie the external atmosphere sensing portion 14, is applied by thick film printing.
いま、ＳｎＯ２の厚膜印刷について説明すれば、平均粒
子径１０μ程度のＳｎＯ２粉をα−チルピノール、β−
チルピノールおよびキシレンによつて十分に練り合せる
。Now, to explain thick film printing of SnO2, SnO2 powder with an average particle size of about 10μ is mixed with α-chilpinol and β-
Thoroughly mix with tilpinol and xylene.
こ工で、α−チルピノール、β−チルピノールおよびキ
シレンはＳｎＯ２粉同志を結合させるための１種のバイ
ンダーとしての役割をもつものである。In this process, α-tilpinol, β-tilpinol, and xylene serve as a type of binder for bonding the SnO2 powders together.
このペースト状の混線物を厚膜印刷機によって絶縁性の
基板１上に印刷する。This paste-like mixed material is printed on an insulating substrate 1 using a thick film printer.
この印刷用スクリーンとしては、１００メツシユ、１６
５メツシユ、２００メツシユのものが使用可能であるけ
れども、目づまりなどを考慮すると、１００メツシユの
ものが望ましい。This printing screen has 100 meshes and 16 meshes.
Although 5 mesh and 200 mesh can be used, 100 mesh is preferable in consideration of clogging.
このスクリーン印刷後、電気炉内において酸化性雰囲気
中で焼成される。After this screen printing, it is fired in an oxidizing atmosphere in an electric furnace.
上記構成から明らかなように、電極５，６とリード線７
，８の間を耐酸化性金属線２，３で接続したから、酸化
性雰囲気中で検知部１４を焼成する場合でも、電極５，
６は検知部１４を形成する半導体層内に被覆することが
できてその酸化を防止することができ、素子特性の劣化
をきたすことがない。As is clear from the above configuration, the electrodes 5 and 6 and the lead wire 7
, 8 are connected by the oxidation-resistant metal wires 2, 3, even when the sensing part 14 is fired in an oxidizing atmosphere, the electrodes 5,
6 can be coated within the semiconductor layer forming the detection part 14 and can prevent its oxidation, thereby preventing deterioration of device characteristics.
また、電極５，６が仮りに酸化されるとしても、タング
ステンＷに比し酸化は大巾にされにくい材料であるとと
もに、酸化による抵抗変化等が非常に小さいので素子特
性の劣化を極力抑制することができる。Furthermore, even if the electrodes 5 and 6 are oxidized, the material is less likely to be oxidized to a large extent than tungsten W, and changes in resistance due to oxidation are extremely small, so deterioration of device characteristics can be suppressed as much as possible. be able to.
また、電極５，６がタングステンＷではなく、ニッケル
Ｎ ｉ 、金Ａｕ、銀Ａｇ、白金ｐｔのような耐酸化性
金属で形成されることによって素子特性の劣化を一層防
止できる。Further, by forming the electrodes 5 and 6 not from tungsten W but from an oxidation-resistant metal such as nickel Ni, gold Au, silver Ag, or platinum PT, deterioration of device characteristics can be further prevented.
第２図はこの発明に係る外部雰囲気検知装置の他の例を
示し、上述した基体１の下面にはセラミックのような耐
熱性絶縁基体１５が配設され、下糸体１５の上面には発
熱抵抗体１６がスクリーン印刷による厚膜手法で形成さ
れる。FIG. 2 shows another example of the external atmosphere detection device according to the present invention, in which a heat-resistant insulating base 15 such as ceramic is disposed on the lower surface of the base 1 described above, and a heat-generating insulating base 15 is disposed on the upper surface of the lower thread body 15. The resistor 16 is formed using a thick film method using screen printing.
下糸体１５の４隅には外部雰囲気検知用リード線７，８
および発熱抵抗体用リード線１７，１８の貫通孔１９が
穿設され、上基体１には各リード線？、８，１７゜１８
の頭部１２が埋入される透孔２０が穿設されている（第
３図、第４図参照）。Lead wires 7 and 8 for external atmosphere detection are provided at the four corners of the bobbin thread body 15.
Through-holes 19 for heat generating resistor lead wires 17 and 18 are bored in the upper base 1, and each lead wire ? , 8,17°18
A through hole 20 is bored into which the head 12 of the head 12 is inserted (see FIGS. 3 and 4).
下糸体１５の上面にはリード線貫通孔１９の上方を残し
て生セラミック粉の混練物からなる耐熱性絶縁層２１が
スクリーン印刷による厚膜手法で被着され、これら下糸
体１５、発熱抵抗体１６および耐熱性絶縁層２１が不活
性（還元性）雰囲気中で一体的に焼成される。A heat-resistant insulating layer 21 made of a kneaded material of raw ceramic powder is applied to the upper surface of the lower thread body 15 by a thick film method using screen printing, leaving the area above the lead wire through hole 19. The resistor 16 and the heat-resistant insulating layer 21 are integrally fired in an inert (reducing) atmosphere.
ただし、耐熱性絶縁層２１は必らず必要なものではなく
、発熱抵抗体１６が下糸体１５に埋設される場合には不
要である。However, the heat-resistant insulating layer 21 is not necessarily necessary, and is unnecessary when the heating resistor 16 is embedded in the bobbin thread body 15.
発熱抵抗体１６を形成するためのペーストとしては、セ
ラ□ツク生シートの焼結条件に照して最適な、たとえば
タングステンＷ、モリブデンＭｏ、モリブデン−マンガ
ン合金Ｍｏ−Ｍｎのような組成を含む抵抗体インキある
いはセラミックとの接着性を良好にするためのガラスパ
ウダを含むものが用いられ、このペーストをセラ□ツク
生シートの焼結時に適宜の温度で同時に焼成することに
より、下糸体１５と耐熱性絶縁層２１との間に発熱抵抗
体１６が内設される。The paste for forming the heating resistor 16 may be a resistor containing a composition such as tungsten W, molybdenum Mo, or molybdenum-manganese alloy Mo-Mn, which is optimal in view of the sintering conditions of the ceramic raw sheet. An ink containing glass powder is used to improve the adhesion with the body ink or the ceramic, and this paste is simultaneously fired at an appropriate temperature during the sintering of the ceramic raw sheet, thereby forming the paste with the bobbin body 15. A heating resistor 16 is internally provided between the heat-resistant insulating layer 21 and the heat-resistant insulating layer 21 .
他方、上基体１、金属線２，３、電極５，６および検知
部１４は前述した第１図における手段で下糸体１５とは
別途の製造工程で一体的に形成され、この場合、リード
線７，８および１７，１８は上下いずれの基体１，１５
にも設定されていない。On the other hand, the upper base body 1, the metal wires 2, 3, the electrodes 5, 6, and the detection part 14 are integrally formed in a separate manufacturing process from the lower thread body 15 by the means shown in FIG. Lines 7, 8 and 17, 18 indicate whether the upper or lower substrate 1, 15
It is not set either.
上下基体１，１５は互に重ね合さ机上基体１の透孔２０
と下糸体１５０貫通孔１９とのセンタ合せが行なわれた
のち、各貫通孔１９にリード線？、８，１７，１Ｂが上
方から挿通され、頭部１２が透孔２０に埋入されたのち
、銀ろうなどのろう付げ材１１が透孔２０内に充填され
て、金属線２，３の先端部はリード線７，８に、発熱抵
抗体１６０両端部はリード線１７，１８にそれぞれ電気
的に接続固定されると同時に、上下基体１゜１５０重ね
合せ固定が達成される。The upper and lower bases 1 and 15 are stacked on top of each other, and the through hole 20 of the desk base 1
After centering the through holes 19 of the lower thread body 150, insert the lead wires into each through hole 19. , 8, 17, 1B are inserted from above, and the head 12 is embedded in the through hole 20. Then, a brazing material 11 such as silver solder is filled in the through hole 20, and the metal wires 2, 3 are inserted. The distal ends of the heating resistor 160 are electrically connected and fixed to the lead wires 7 and 8, and both ends of the heating resistor 160 are electrically connected and fixed to the lead wires 17 and 18, respectively, and at the same time, the upper and lower bases are fixed and overlapped at 1.degree. 150 degrees.
この重ね合せ固定が強度的に弱い場合、第５図に示すよ
うに上下基体１，１５０端側面に金属層２２．２３を形
成しておき、これら両金属層２２゜２３にまたがってろ
う付は材２４を付着すれば上下基体１，１５０固定が堅
固に行なわれる。If this overlapping fixation is weak in strength, metal layers 22 and 23 are formed on the side surfaces of the upper and lower bases 1 and 150, as shown in FIG. By attaching the material 24, the upper and lower base bodies 1,150 are firmly fixed.
上述から明らかなように、上基体１の下面に発熱抵抗体
１６を設定する場合、この抵抗体１６をタングステンＷ
のような酸化され易い金属で生成しても、この生成は不
活性（還元性）雰囲気中で行なうことができるから、こ
の抵抗体１６の酸化を防止することができる。As is clear from the above, when the heating resistor 16 is set on the lower surface of the upper substrate 1, this resistor 16 is made of tungsten W.
Even if the resistor 16 is made of a metal that is easily oxidized, the resistor 16 can be prevented from being oxidized because it can be produced in an inert (reducing) atmosphere.
この発明は上述したように、検知部の焼成時における酸
化雰囲気によって電極等が酸化さべ抵抗値が増大して素
子特性を劣化させるおそれのない外部雰囲気検知装置を
提供することができる。As described above, the present invention can provide an external atmosphere detection device in which there is no risk of deterioration of device characteristics due to an increase in resistance due to oxidation of electrodes and the like due to the oxidation atmosphere during firing of the detection portion.
第１図はこの発明に係る検知装置の一例を一部切欠して
示す斜視図、第２図は検知装置の他の例を一部切欠して
示す斜視図、第３図、第４図は第２図のＩＩＩ−ｍ線お
よび■−■線に沿う各断面図、第５図は第２図の一部変
形構造を示す要部断面図である。
１・・・耐撚性絶縁基体（上基体）、２，３・・・耐酸
化性金属線、４・・・基体主面、５，６・・・電極、Ｉ
。
８・・・検知用リード線、９，１９・・・貫通孔、１４
・・・金属酸化物半導体層（検知部）、１５・・・下基
体、１６・・発熱抵抗体、１７．１８・・発熱抵抗体用
リード線、２２，２３・・・固定用金属層、ＩＬ２４・
・・ろう付は材。FIG. 1 is a partially cutaway perspective view of an example of a detection device according to the present invention, FIG. 2 is a partially cutaway perspective view of another example of the detection device, and FIGS. 3 and 4 are 2, and FIG. 5 is a sectional view of a main part showing a partially modified structure of FIG. 2. DESCRIPTION OF SYMBOLS 1... Twisting-resistant insulating substrate (upper substrate), 2, 3... Oxidation-resistant metal wire, 4... Main surface of substrate, 5, 6... Electrode, I
. 8... Detection lead wire, 9, 19... Through hole, 14
. . . Metal oxide semiconductor layer (sensing part), 15 . . . Lower base, 16 . IL24・
...Brazing is a material.
Claims (1)
平行に固着し、この各金属線を被覆して上記基体上に１
対の電極を被着し、両電極を被包して上記基体上に金属
酸化物半導体層を塗布焼付し、上記基体に上方から貫通
固定された１対の検知用リード線の頭部に上記金属線の
端部を電気的に接続、したことを特徴とする外部雰囲気
検知装置。 ２ 耐熱性絶縁基体がセラ□ツク基体、金属線が白金線
であり、かつ電極がＮｉｔ Ａｕ ｔ Ａ ｏ 。 ｐｔの少なくとも一種を含む導体ペーストをスクリーン
印刷して形成されている特許請求の範囲第１項記載の外
部雰囲気検知装置。[Claims] 1. A pair of oxidation-resistant metal wires is fixed on a heat-resistant insulating substrate in parallel to the main surface, each metal wire is covered, and a pair of oxidation-resistant metal wires is fixed on a heat-resistant insulating substrate in parallel to the main surface.
A pair of electrodes is attached, a metal oxide semiconductor layer is coated and baked on the base body, covering both electrodes, and the head of a pair of detection lead wires is fixed to the base body from above. An external atmosphere detection device characterized by electrically connecting the ends of metal wires. 2. The heat-resistant insulating substrate is a ceramic substrate, the metal wire is a platinum wire, and the electrode is Nit Aut A o. The external atmosphere detection device according to claim 1, which is formed by screen printing a conductive paste containing at least one type of PT.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1628976A JPS5840692B2 (en) | 1976-02-16 | 1976-02-16 | External atmosphere detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1628976A JPS5840692B2 (en) | 1976-02-16 | 1976-02-16 | External atmosphere detection device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5299892A JPS5299892A (en) | 1977-08-22 |
| JPS5840692B2 true JPS5840692B2 (en) | 1983-09-07 |
Family
ID=11912378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1628976A Expired JPS5840692B2 (en) | 1976-02-16 | 1976-02-16 | External atmosphere detection device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5840692B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58182152U (en) * | 1982-05-31 | 1983-12-05 | 株式会社フジクラ | Solid electrolyte oxygen meter lead wire fixing structure |
-
1976
- 1976-02-16 JP JP1628976A patent/JPS5840692B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5299892A (en) | 1977-08-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0714105B2 (en) | Hybrid integrated circuit board and manufacturing method thereof | |
| JPWO2009069579A1 (en) | Ceramic heater and oxygen sensor and hair iron provided with the ceramic heater | |
| KR100426939B1 (en) | Gas sensor | |
| US4660017A (en) | Chip-type varistor | |
| WO2020045048A1 (en) | Particulate-matter detecting sensor element | |
| JPH1196871A (en) | Resistance-temperature fuse and its manufacture | |
| JPS5840692B2 (en) | External atmosphere detection device | |
| JPH02124456A (en) | Connecting structure of solid-state electrolyte element | |
| WO2020045049A1 (en) | Particulate-matter detecting sensor element | |
| JPS5856111B2 (en) | Manufacturing method of external atmosphere detection device | |
| JPH08148260A (en) | Ceramic heater | |
| JPS5856110B2 (en) | Gaibufunikikenchisouchi | |
| JP3740410B2 (en) | Detection element | |
| US5186809A (en) | Structure for joining a wire to a solid electrolytic element | |
| JP2009059755A (en) | Electrode for ntc thermistor | |
| JPH07105719A (en) | Conductive paste and resistor element | |
| JPS6333282B2 (en) | ||
| JPH02265207A (en) | Chip resistor | |
| JPH0743988Y2 (en) | Ceramic heater | |
| JPH0744056B2 (en) | Ceramic Heater | |
| JPS6158296A (en) | Ceramic multilayer circuit board | |
| JPH0314001Y2 (en) | ||
| JPH0346961B2 (en) | ||
| JPS6345760Y2 (en) | ||
| JPH07176402A (en) | Square chip fixed resistor |