JPH02265207A - Chip resistor - Google Patents
Chip resistorInfo
- Publication number
- JPH02265207A JPH02265207A JP1086275A JP8627589A JPH02265207A JP H02265207 A JPH02265207 A JP H02265207A JP 1086275 A JP1086275 A JP 1086275A JP 8627589 A JP8627589 A JP 8627589A JP H02265207 A JPH02265207 A JP H02265207A
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- electrode
- gold
- resistor
- silver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000010931 gold Substances 0.000 claims abstract description 16
- 229910052737 gold Inorganic materials 0.000 claims abstract description 16
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 claims abstract description 15
- 230000001681 protective effect Effects 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 238000007747 plating Methods 0.000 abstract description 17
- 239000007772 electrode material Substances 0.000 abstract description 8
- 239000000919 ceramic Substances 0.000 abstract description 6
- 238000005476 soldering Methods 0.000 abstract description 5
- 239000007788 liquid Substances 0.000 abstract 2
- 238000010304 firing Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 244000062175 Fittonia argyroneura Species 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 206010011878 Deafness Diseases 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Landscapes
- Non-Adjustable Resistors (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、電子回路に一般に使用される精密級厚膜角形
チップ抵抗器（以下チップ抵抗器と略す）に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a precision grade thick film square chip resistor (hereinafter abbreviated as a chip resistor) commonly used in electronic circuits.
従来の技術
従来、この種のチップ抵抗器は第３図に示すように銀パ
ラジウム系の電極を使用し、プリコートガラスを施した
後、抵抗体をトリミングし、さらにはんだ付けの信頓性
のためＮｉめつきを施した後、すずめつきあるいははん
だめっきを施した構造になっている。ここで、第３図に
於いて、９は銀パラジウム系上面電極、１０は抵抗体、
１１はプリコートガラス、１２はオーバコートガラス、
１３は側面電極、１４はＮｉめつき、１５はすずめつき
あるいははんだめっき、１６はセラミック基板である。Conventional technology Conventionally, this type of chip resistor uses silver-palladium electrodes as shown in Figure 3, and after applying precoat glass, the resistor is trimmed, and further soldered to ensure reliability. It has a structure in which Ni plating is applied and then tin plating or solder plating is applied. Here, in FIG. 3, 9 is a silver-palladium-based upper surface electrode, 10 is a resistor,
11 is pre-coated glass, 12 is over-coated glass,
13 is a side electrode, 14 is Ni plating, 15 is tin plating or solder plating, and 16 is a ceramic substrate.
発明が解決しようとする課題
最近、ユーザからよシ信頼性の高いチップ抵抗器の要望
が出てきた。しかしながら、上面電極特に抵抗体と接触
している部分が銀パラジウム系では限界がある。それは
、抵抗値変化のメカニズムの主たる原因が、上面電極の
銀が抵抗体中へ移行することによるものであるからであ
る。従って、よシ信頼性を向上させるためには、上面電
極材料を金系に変更することにより可能となる。しかし
ながら、現状の金系材料は／％イブリッドＩＣ用であり
、めっき下地用になっていない。すなわち、導体中のガ
ラスフリットも耐めっき液性を考慮していないし、さら
にそのガラスフリットの量も少なくして、より純金属に
近づけることにより特性を出している。しかしながら、
チップ抵抗器を考えた場合、どうしてもめっきを施して
いないとはんだ付けの信頼性が確保できない。さらに、
金系電極に重ねて一般的に上面電極として使用している
８５０℃焼成用銀系あるいは銀−パラジウム電極材料を
印刷し焼成した場合、金系電極材料と銀糸あるいは銀−
パラジウム系の焼結温度の違いにより境界部にクラック
が入ってしまい断線の可能性が発生してしまうという問
題があった。Problems to be Solved by the Invention Recently, users have requested a highly reliable chip resistor. However, there is a limit when the top electrode, especially the part that contacts the resistor, is made of silver-palladium. This is because the main cause of the resistance change mechanism is the migration of silver from the top electrode into the resistor. Therefore, the reliability can be improved by changing the upper electrode material to a gold-based material. However, the current gold-based materials are used for /% hybrid ICs and are not used for plating bases. That is, the glass frit in the conductor does not take plating solution resistance into consideration, and the amount of glass frit is also reduced to bring it closer to pure metal, thereby achieving characteristics. however,
When considering chip resistors, soldering reliability cannot be ensured unless they are plated. moreover,
When a silver-based or silver-palladium electrode material for firing at 850°C, which is generally used as the top electrode, is printed and fired over a gold-based electrode, the gold-based electrode material and silver thread or silver-palladium electrode material are printed and fired.
There was a problem in that due to the difference in the sintering temperature of the palladium-based materials, cracks appeared at the boundary and the possibility of wire breakage occurred.
本発明は、このような問題を解決するもので現状と同じ
はんだ付けが可能でかつより信頼性の高いチップ抵抗器
を目的としたものである。The present invention solves these problems and aims to provide a chip resistor that can be soldered in the same way as the current method and is more reliable.
課題を解決するための手段
この問題を解決するため本発明は、基板の上面に形成し
た金系からなる一対の第１上面電極と、この第１上面電
（童に一部が重なるように第１上面電原間に形成した抵
抗皮膜と、上記第１上面電極に一部が重なるように基板
の両端部の上面にそれぞれ形成した６００°Ｃ付近の温
度で焼成可能な銀−パラジウム系あるいは銀糸からなる
一対の第２上面電極表、この第２上面電極の基板端部上
の部分を除き上記第２上面電極、抵抗膜および第１上面
電極を覆う保護膜と、上記第２上面電極の外部に露出し
た部分においてそれぞれ接続されかつ基板の端面から底
面にかけて形成したはんだ付け可能な電極部を備えたも
のである。Means for Solving the Problems In order to solve this problem, the present invention provides a pair of first top electrodes formed on the top surface of a substrate and made of a gold-based material; 1. A resistive film formed between the electrodes on the upper surface, and a silver-palladium-based or silver thread that can be fired at a temperature of around 600°C, formed on the upper surface of both ends of the substrate so as to partially overlap the first upper surface electrode. a pair of second top electrode surfaces, a protective film that covers the second top electrode, the resistive film, and the first top electrode except for the portion of the second top electrode on the substrate edge; The board is provided with solderable electrode parts that are connected to the exposed parts of the board and formed from the end face to the bottom face of the board.
作用
この構成によシ、はんだ付けの信頼性を現状チップ抵抗
器と同等に確保ができかつ金系電極材料を上面電極とし
て使用ができるようになシ現状の厚膜精密級チップ抵抗
器に比べより高信頼性のチップ抵抗器を得ることができ
る。Function: This structure ensures soldering reliability equivalent to that of current chip resistors, and allows the use of gold-based electrode material as the top electrode.Compared to current thick-film precision chip resistors. A more reliable chip resistor can be obtained.
実施例
第１図は本発明の一実施例によるチップ抵抗器の断面図
であ夛、第１図において、１は金ペースト焼成による第
１上面電極、２は第１上面電極１と重なりを持つ抵抗膜
、３は第１上面電極１と重なｐを持ちかつ抵抗膜２とは
接触せずさらに６００℃焼成用銀パラジウムペースト焼
成による第２上面電極、４は第１上面電極１および抵抗
膜２さらに第２上面電極３の一部を覆う保護膜、５はプ
リコート、６は第２上面電極３と接触する側面および底
面電極、７ははんだ付けの際の銀くわれ防止用Ｎｉめっ
き膜、８ははんだめっき膜、９はセラミック基板であり
、セラミック基板９上の長手方向の両端に対向する第１
上面電極１および第２上面電極が設けられ、そしてセラ
ミック基板９の第１上面電極１間に抵抗体２が設けられ
、その抵抗体２および第１上面電極１全体さらに第２上
面電極の一部を保護膜４が覆っている。また、第２図は
実施例の工程図である。Embodiment FIG. 1 is a cross-sectional view of a chip resistor according to an embodiment of the present invention. In FIG. 1, 1 is a first top electrode formed by firing gold paste, and 2 overlaps with the first top electrode 1. A resistive film, 3 has a p that overlaps with the first upper electrode 1 and does not contact the resistive film 2, and is a second upper electrode formed by firing a silver palladium paste for firing at 600° C.; 4 is the first upper electrode 1 and the resistive film; 2 further includes a protective film covering a part of the second upper electrode 3; 5 is a precoat; 6 is a side and bottom electrode in contact with the second upper electrode 3; 7 is a Ni plating film for preventing silver creases during soldering; 8 is a solder plating film, 9 is a ceramic substrate, and first
A top electrode 1 and a second top electrode are provided, and a resistor 2 is provided between the first top electrode 1 of the ceramic substrate 9, and the resistor 2, the entire first top electrode 1, and a part of the second top electrode is covered with a protective film 4. Moreover, FIG. 2 is a process diagram of an example.
この場合抵抗体と接触している電極は金電極であり、ま
ためっき液に接触するのは銀パラジウム電極であり、め
っき液による電極への影響は受けない。また、その銀パ
ラジウム電極が６００°Ｃ焼成用であるため、金型ｔｊ
との接触部境界のクラックも発生しない。従って、この
場合金電極による信頼性向上が図かれるとともに、はん
だ付けの信頼性も確保できる。In this case, the electrode in contact with the resistor is a gold electrode, and the electrode in contact with the plating solution is a silver-palladium electrode, so that the electrode is not affected by the plating solution. In addition, since the silver palladium electrode is for 600°C firing, the mold tj
No cracks will occur at the boundary of the contact area. Therefore, in this case, reliability can be improved by using the gold electrode, and reliability of soldering can also be ensured.
発明の効果
以上のように本発明によれば、従来のハイブリッドＩＣ
等に使用している金系電極材料をチップ抵抗器に使用す
ることができ、よシ信頼性の高いチップ抵抗器を得るこ
とができる。また、第２上面電極の銀パラジウムは側面
電極に使用する材料を使用すれば良く特別な材料を開発
することもない。さらに、上面電極は第１上面電極のみ
金系電極材料を使用するため、材料費のアップも少なく
抑えることができる。また、めっき液に接触するのは６
００℃焼成用銀パラジウムで一般用チツブ抵抗器に使用
している材料であり、信頼性も同等得ることができる。Effects of the Invention As described above, according to the present invention, the conventional hybrid IC
It is possible to use the gold-based electrode materials used in the chip resistors, etc., and it is possible to obtain highly reliable chip resistors. Moreover, the silver-palladium of the second top electrode can be made of the same material used for the side electrodes, and there is no need to develop a special material. Furthermore, since only the first upper electrode uses gold-based electrode material for the upper electrode, the increase in material costs can be kept to a minimum. In addition, 6 parts come into contact with the plating solution.
This material is silver palladium for firing at 00°C and is used for general purpose chip resistors, and can provide the same reliability.
第１図は本発明の一実施例によるチップ抵抗器の断面図
、第２図は本発明の一実施例の工程図、第３図は従来の
厚膜精密級チップ抵抗器の断面図である。
１・・・・・第１上面電極、２・・・・・・抵抗膜、３
・・・・・・第２上面電極、４・・・・・・オーバコー
ト、６・・・・・・プリコート、６・・・・・・側面電
極、７・・・・・・Ｎ１めっき、８・・はんだめっき、
９・・・・・・セラミック基板。
代理人の氏名 弁理士 粟 野 重 孝 ほか１名第１
図
１ ′−゛
？−
一−−
８・−
９〜゛
り１ワ； イ よ面マシ聾＝極
抵抗器
窮２よ面覗極
オーバ“−コート
ア°ワコー）
イ貝ｌｉ 面 ９曖−極
Ｎｔめつき
＋！Ａ−ｒ−めっさ
ヤラミソ７基板Fig. 1 is a sectional view of a chip resistor according to an embodiment of the present invention, Fig. 2 is a process diagram of an embodiment of the invention, and Fig. 3 is a sectional view of a conventional thick film precision chip resistor. . 1...First upper surface electrode, 2...Resistive film, 3
...Second top electrode, 4...Overcoat, 6...Precoat, 6...Side electrode, 7...N1 plating, 8...Solder plating,
9... Ceramic substrate. Name of agent: Patent attorney Shigetaka Awano and 1 other person 1st
Figure 1 ′−゛? - 1-- 8・- 9～゛ri1wa; A Yomen Mashi Deaf = Extreme Resistance 2 Yo Side View Pole Over “-Court A° Wako) Ikai Li Face 9 Ambiguous-Koku Nt Eyes +!A -r-Messa Yaramiso 7 board
Claims (1)
と、この第１上面電極に一部が重なるように第１上面電
極間に形成した抵抗膜と、上記第１上面電極に一部が重
なるように基板の両端部の上面にそれぞれ形成した６０
０℃付近の温度で焼成可能な銀−パラジウム系あるいは
銀系からなる一対の第２上面電極と、この第２上面電極
の基板端部上の部分を除き上記第２上面電極、抵抗膜お
よび第１上面電極を覆う保護膜と、上記第２上面電極の
外部に露出した部分においてそれぞれ接続されかつ基板
の端面から底面にかけて形成したはんだ付け可能な電極
部を備えたチップ抵抗器。A pair of first top electrodes formed on the top surface of the substrate made of gold, a resistive film formed between the first top electrodes so as to partially overlap the first top electrodes, and a resistive film formed partially on the first top electrodes. 60 formed on the top surface of both ends of the board so that they overlap.
A pair of second upper electrodes made of silver-palladium or silver-based material that can be fired at a temperature around 0°C, and the second upper electrode, the resistive film, and the A chip resistor comprising: a protective film covering a first top electrode; and a solderable electrode part connected to an externally exposed portion of the second top electrode and formed from an end surface to a bottom surface of a substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1086275A JP2523862B2 (en) | 1989-04-05 | 1989-04-05 | Chip resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1086275A JP2523862B2 (en) | 1989-04-05 | 1989-04-05 | Chip resistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02265207A true JPH02265207A (en) | 1990-10-30 |
| JP2523862B2 JP2523862B2 (en) | 1996-08-14 |
Family
ID=13882275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1086275A Expired - Lifetime JP2523862B2 (en) | 1989-04-05 | 1989-04-05 | Chip resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2523862B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0780850A3 (en) * | 1995-12-21 | 1998-05-27 | Kamaya Electric Co., Ltd. | Chip resistor and method for producing same |
| JP2002064003A (en) * | 2000-08-17 | 2002-02-28 | Taiyosha Denki Kk | Chip resistor and its manufacturing method |
| US6777778B2 (en) * | 2001-06-20 | 2004-08-17 | Alps Electric Co., Ltd. | Thin-film resistor and method for manufacturing the same |
| JP2013258292A (en) * | 2012-06-13 | 2013-12-26 | Panasonic Corp | Chip resistor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5596605U (en) * | 1978-12-27 | 1980-07-04 | ||
| JPS57119501U (en) * | 1981-01-16 | 1982-07-24 |
-
1989
- 1989-04-05 JP JP1086275A patent/JP2523862B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5596605U (en) * | 1978-12-27 | 1980-07-04 | ||
| JPS57119501U (en) * | 1981-01-16 | 1982-07-24 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0780850A3 (en) * | 1995-12-21 | 1998-05-27 | Kamaya Electric Co., Ltd. | Chip resistor and method for producing same |
| JP2002064003A (en) * | 2000-08-17 | 2002-02-28 | Taiyosha Denki Kk | Chip resistor and its manufacturing method |
| US6777778B2 (en) * | 2001-06-20 | 2004-08-17 | Alps Electric Co., Ltd. | Thin-film resistor and method for manufacturing the same |
| JP2013258292A (en) * | 2012-06-13 | 2013-12-26 | Panasonic Corp | Chip resistor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2523862B2 (en) | 1996-08-14 |
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