JPS5835647Y2 - Base holder for vapor deposition - Google Patents

Description

【考案の詳細な説明】 本考案は、真空蒸着、スパッタ蒸着、イオンプレーテイ
ンダ等において真空容器内で基盤上に薄膜を形成する際
に、多数個の直方体状の基盤部材を保持する保持具に関
し、多数個の基盤を、蒸着源に対し等位置に再現性良く
かつ高能率に配置保持することを可能ならしめることを
目的とする。[Detailed description of the invention] The present invention is a holder that holds a large number of rectangular parallelepiped base members when forming a thin film on a base in a vacuum container in vacuum evaporation, sputter evaporation, ion plate tinder, etc. The present invention aims to make it possible to arrange and hold a large number of substrates at the same position with respect to a vapor deposition source with good reproducibility and high efficiency.

従来、真空容器内で薄膜を形威しよととする基盤の個数
が少ない場合には個々の基盤をバネで挟持したり、また
蒸着源に対して膜付着位置が下方にある場合には基盤台
に基盤を単に載置するなど薄膜形成の状況に応じそれな
りの工夫がなされている。Conventionally, when the number of substrates on which a thin film is to be formed in a vacuum container is small, each substrate is held between springs, and when the film deposition position is below the evaporation source, the substrates are Various measures have been taken depending on the thin film formation situation, such as simply placing the substrate on a stand.

しかしながら、前者の場合、均一な膜付着が可能な面積
に対して、実際の基盤の膜付着面の占める割合（以下こ
とを基盤面積効率と呼ぶ）を大きくすることは、バネ部
材の固定部の存在のために限界があり、後者の場合には
この基盤面積効率は稼ぐことができるが、基盤の膜付着
面が上方を向いているため塵埃による基盤面の汚染を生
じやすい欠点があった。However, in the former case, increasing the ratio of the actual base film adhesion surface to the area where uniform film adhesion is possible (hereinafter referred to as base area efficiency) means that the fixed part of the spring member In the latter case, although the substrate surface area efficiency can be increased, the surface of the substrate on which the film is attached faces upward, which has the disadvantage that the substrate surface is easily contaminated by dust.

第１図は、基盤面の汚染を避けるため蒸発源を基盤の下
方に置いて基盤面を下方に向ける場合の従来の保持具の
例を示すもので、ａの如く基盤の姿勢保持用に基盤外形
より大きめに開けた窓１を多数設けた枠部材２に、ｂの
如く、枠部材２の窓より小さく基盤面より小さい窓３を
該当位置に設けた薄板部材４を、Ｃの如く取付穴５部分
で枠部材２に取り付は基盤６をこれらの窓部に装着する
ようにしている。Figure 1 shows an example of a conventional holder when the evaporation source is placed below the base and the base face is directed downward to avoid contamination of the base. A thin plate member 4 with windows 3 smaller than the windows of the frame member 2 and smaller than the base surface at the corresponding positions as shown in b is attached to a frame member 2 with a number of windows 1 opened larger than the outer shape, as shown in C. The five parts are attached to the frame member 2, and the base 6 is attached to these window parts.

この従来例でも、枠部材の存在のため基盤面積効率を下
げており、また基盤６を支持しているところは枠２と薄
板３で囲んだそのすみにあたるところでそこにはごみが
たまりやすく、しかも基盤一つ一つを枠で囲むようにな
っているので、基盤数が多くなるとそれに応じてすみに
あたるところも多くなり掃除がしにくかった。In this conventional example as well, the presence of the frame member lowers the board area efficiency, and the part that supports the board 6 is the corner surrounded by the frame 2 and the thin plate 3, and dirt tends to accumulate there. Since each base is surrounded by a frame, the more bases there are, the more corners there are, making cleaning difficult.

また上述のような保持具では基盤を装着する場所により
蒸発源との相対位置がまちまちであるため蒸着の再現性
に乏しいなど、多くの欠点があつた。Furthermore, the above-described holder has many drawbacks, such as poor reproducibility of evaporation because the relative position with the evaporation source varies depending on where the substrate is attached.

本考案は上述のような従来における欠点を除こうとする
もので、以下に図面を用いてその実施例を説明する。The present invention aims to eliminate the above-mentioned drawbacks of the conventional art, and embodiments thereof will be described below with reference to the drawings.

第２図ａ、ｂ、Ｃ１第３図は本考案の第１の実施例であ
る蒸着用基盤保持具をその組立て順に従って示す。FIGS. 2a, b, and C1 and FIG. 3 show a deposition substrate holder according to the first embodiment of the present invention in the order of its assembly.

この保持具は、特に高周波スパッタ蒸着装置で、蒸発源
たるターゲット部材を配置する陰極部を真空容器内に下
部に設けた、スパッタアップ様式のものにおいて、多数
の基盤をそのターゲット部材の上方を取り囲む円周上に
保持するのに用いられる。This holder surrounds a number of bases above the target member, especially in a high-frequency sputter evaporation device, which is a sputter-up type device in which a cathode section for arranging a target member serving as an evaporation source is provided at the bottom in a vacuum container. Used to hold on the circumference.

なおこの保持具は基本的には円筒を複数個に分割したも
のからできており、以下においては分割された一つ一つ
を円筒分割型ホルダと呼ぶことにする。Note that this holder is basically made of a cylinder divided into a plurality of parts, and each of the divided parts will be referred to as a cylindrical split type holder below.

さてこの円筒分割ホルダは第２図ａに示すように円筒を
分割して得られる円筒基台７に、基盤配置のための周方
向に沿った溝８および板ばね（後に説明する）を操作す
るための逃げ溝９を設けてあり、またこれら溝の両端側
には板ばね挾持用部材１０をねじ１１で円筒基台７に取
り付けである。Now, this cylindrical divided holder is made by manipulating a groove 8 along the circumferential direction for arranging the base and a leaf spring (described later) on the cylindrical base 7 obtained by dividing the cylinder as shown in FIG. 2a. Relief grooves 9 are provided at both ends of these grooves, and leaf spring holding members 10 are attached to the cylindrical base 7 with screws 11.

板ばね挾持用部材１０の逃げ溝９に面する側には板ばね
の両路端部をはめ込むための小スリット１２を設けてあ
り、ここに板ばねを挾持する形で使用に供する。A small slit 12 is provided on the side of the leaf spring holding member 10 facing the relief groove 9 for fitting both ends of the leaf spring, and the leaf spring is used by being held therein.

円筒基台７上面には取手１３をねじ１４で取り付けてあ
り作業に便ならしめている。A handle 13 is attached to the upper surface of the cylindrical base 7 with screws 14 to facilitate the work.

第２図すは同ａ図に示した部材に板ばね１５を取り付け
た状態を示す。Figure 2 shows a state in which the leaf spring 15 is attached to the member shown in Figure 2A.

この時点では板ばね１５はその中央部が基台７から浮き
あがった状態になるように反っている。At this point, the leaf spring 15 is warped such that its central portion is lifted off the base 7.

この状態にしだ後第２図Ｃに示すように基盤部材１６を
溝１８に密にならべ、次いでばね１５の反りを反転させ
て基盤部材１６のエツジ部をばね１５で押えつけ、基盤
を保持せしめる。After this state is established, the base member 16 is closely aligned with the groove 18 as shown in FIG. .

第３図はこの円筒分割ホルダが蒸着装置のターゲット部
材上方に円周をなすように配置された状態の断面を示し
、円筒基台７を、別に設けた円筒１７の内壁面に崇接せ
しめかつ下端部のところで円筒１７の下部に取り付けた
支えリング１８にはめ込んで複数個の円筒分割ホルダを
円筒をなすように配置している。FIG. 3 shows a cross section of this cylindrical divided holder arranged in a circumferential manner above the target member of the vapor deposition apparatus, and the cylindrical base 7 is brought into contact with the inner wall surface of a separately provided cylinder 17. A plurality of cylindrical split holders are arranged to form a cylinder by fitting into a support ring 18 attached to the lower part of the cylinder 17 at the lower end.

円筒分割ホルダが配置されたその下方に位置する陰極１
９上に配置した円板状のターゲット２０の周囲には、シ
ールドリング２１を配置しである。Cathode 1 located below the cylindrical split holder
A shield ring 21 is placed around a disc-shaped target 20 placed on top of the target 9 .

一方真空容器底フランジ２２上に取り付けられ、回転ボ
ールベアリング溝２３を有する下基台２４の上には、タ
ーゲット２０を中心にして回転可能な如くに主基台２５
が設けられ、この上に、前述のように内壁面上に複数個
の円筒分割ホルダが配置された円筒１７が配設されてい
る。On the other hand, a main base 25 is mounted on a lower base 24 that is attached to the bottom flange 22 of the vacuum container and has a rotating ball bearing groove 23 so as to be rotatable about the target 20.
A cylinder 17 is provided on the cylinder 17 on which a plurality of cylindrical divided holders are arranged on the inner wall surface as described above.

主基台２５も下基台２４の溝２３に対向する位置に溝２
３′を有し、双方の溝２３．２３’にかかるようにして
嵌まっているボール４１の作用により、主基台２５の下
基台２４上での回転が可能になっている。The main base 25 also has a groove 2 at a position opposite to the groove 23 of the lower base 24.
Rotation of the main base 25 on the lower base 24 is made possible by the action of the ball 41 which has a groove 3' and is fitted so as to span both grooves 23 and 23'.

主基台２５に取り付けたかさ歯車（大歯車）２６をかさ
歯車（小歯車）２７で駆動することにより、主基台２５
は等速でターゲットのまわりを回転し、一方下基台２４
に取り付けたマスク支持用の支柱２８に取り付けたマス
ク２９により、回転中にターゲット２０と基盤１６の間
に定期間にマスキングが行なわれて基盤面の膜厚の均一
化を計ることができる。By driving the bevel gear (large gear) 26 attached to the main base 25 with the bevel gear (small gear) 27, the main base 25
rotates around the target at a constant speed, while the lower base 24
During rotation, masking is performed periodically between the target 20 and the substrate 16 by a mask 29 attached to a mask support column 28 attached to the substrate 16, thereby making it possible to uniformize the film thickness on the substrate surface.

本考案による基盤保持具は以上の説明で明らかなように
、基盤を円周に沿って互いに隙間なく密に並べることが
できるため基盤面積効率が高く、かつ蒸発源を中心にし
た円周に沿って保持具を配置することにより多数個の基
盤を蒸発源に対し等位置に再現性良く配置することがで
きる。As is clear from the above explanation, the base holder according to the present invention has high base area efficiency because the bases can be closely arranged along the circumference without any gaps, and the base holders can be arranged closely along the circumference around the evaporation source. By arranging the holder, a large number of substrates can be placed at the same position with respect to the evaporation source with good reproducibility.

さらに基盤端部での押圧保持を反り反転か１在なように
設けられた板ばねにより行なうため、基盤装着の際には
その押圧用板ばねをその中央部が基台がら浮き上った状
態になるように反らせておくことができ、したがって基
盤の移動が容易で作業性が良い。Furthermore, since the pressure and retention at the end of the base is performed by a leaf spring installed in a warped and inverted manner, when the base is installed, the center part of the pressing leaf spring is lifted up from the base. Therefore, the base can be easily moved and workability is good.

また板ばねは簡単に取りはずし可能で常に洗浄を行なう
ことができるため清浄でごみポケットを生じることもな
い。In addition, the leaf springs are easily removable and can be constantly cleaned, so they are clean and free of dust pockets.

また基盤はターゲットを中心とする円周に沿って配置さ
れるようになっているため、その配置位置の再現性が良
く、シかもその基盤が基台の内壁面上に押付けられるよ
うにして配置されているため、熱の伝達効率も良くした
がって冷却効果にも優れている。In addition, since the base is arranged along the circumference around the target, the reproducibility of its placement position is good, and it is also possible to place the base so that it is pressed against the inner wall of the base. Because of this, the heat transfer efficiency is good and the cooling effect is also excellent.

なお本考案による基盤保持具は、基盤形状が、短冊形状
の場合に特に有効である。The base holder according to the present invention is particularly effective when the base has a rectangular shape.

すなわち多数個の短冊状基盤を作業能率良く基盤保持具
にセットすることができる。That is, a large number of strip-shaped substrates can be set on the substrate holder with good work efficiency.

前記の実施例の説明に補充すると、高透磁率磁性体より
なる、２５ｍｍＸ２．７ｍｍＸ１．５ｍｍの短冊状基盤
に磁気ヘッドのギャップ部材を蒸着したが、基盤が短冊
状であるため、基盤保持具には多数個の基盤を上述のよ
うに作業能率良くセットできたことはいうまでもない。To supplement the explanation of the above example, the gap member of the magnetic head was deposited on a rectangular base of 25 mm x 2.7 mm x 1.5 mm made of a high magnetic permeability magnetic material. Needless to say, it was possible to set up a large number of bases with high efficiency as described above.

次に第４図、第５図を用い本考案の第２の実施例につい
て説明する。Next, a second embodiment of the present invention will be described using FIGS. 4 and 5.

第４図は、第１の実施例において説明した如く、円筒状
ホルダを分割するのでなく、円筒に、直接基盤溝および
基盤押圧用板ばねを設けたものを示す。FIG. 4 shows a cylindrical holder in which a base groove and a plate spring for pressing the base are directly provided on the cylinder, instead of dividing the cylindrical holder as described in the first embodiment.

図において、円筒３０の内壁部に周方向に沿って設けた
基盤用溝８が形成され、さらに内壁部には板ばね１５を
その両端で挟持するためのさらねじ３３が適当な間隔を
置いて設けられている。In the figure, a base groove 8 is formed along the circumferential direction on the inner wall of the cylinder 30, and countersunk screws 33 for holding the leaf spring 15 at both ends are spaced at appropriate intervals on the inner wall. It is provided.

構造の詳細については第１の実施例における場合とほぼ
同じであるのでその説明は省略する。Since the details of the structure are almost the same as those in the first embodiment, their explanation will be omitted.

第５図はこの円筒型保持具を、第１の実施例における場
合と同一の回転基台上に装着した状態での断面を示す。FIG. 5 shows a cross section of this cylindrical holder mounted on the same rotating base as in the first embodiment.

本実施例の場合にも、第１の実施例について述べた効果
と同一の効果を有することはいうまづでもなく、さらに
その他の効果として、円筒部分が一体構造になっている
ため、小型化が容易であり、したがって特に真空容器の
容積が小さな小型の蒸着装置に用いる場合に適している
。It goes without saying that this embodiment also has the same effects as those described for the first embodiment, and as an additional effect, the cylindrical part has an integral structure, so miniaturization is possible. It is easy to use, and is therefore particularly suitable for use in small-sized vapor deposition apparatuses in which the volume of the vacuum container is small.

なお実施例における各図面とも共通する要素については
同一符号を付し、重複するものについてはその説明を省
略した。Note that elements common to each drawing in the embodiment are given the same reference numerals, and descriptions of overlapping elements are omitted.

なお、また上述した２つの実施例では基盤蒸着用溝を円
筒内壁に一条だけ設けた場合について述べたが、基盤の
大きさに応じて、あるいは、マスキング作用による基盤
内の膜厚分布の均一化が得られる範囲において、この基
盤溝を多数個設けても良いことは勿論である。In addition, in the above two embodiments, only one groove for substrate deposition was provided on the inner wall of the cylinder, but depending on the size of the substrate, or by making the film thickness distribution within the substrate uniform by a masking effect. It goes without saying that a large number of these base grooves may be provided as long as this can be obtained.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａおよびｂはそれぞれ従来の蒸着用基盤保持具の
一部の斜視図、同Ｃは同基盤保持具に基盤を保持せしめ
た状態を示す断面図、第２図ａおよびｂは本考案の第１
の実施例である蒸着用基盤保持具の組立状態を示す斜視
図、同Ｃは同基盤保持具に基盤を保持せしめた状態を示
す斜視図、第３図は同基盤保持具を蒸着装置に組み込ん
だ状態を示す一部正面図、第４図は本考案の第２の実施
例である蒸着用基盤保持具の平面図、第５図は同基盤保
持具を蒸着装置に組み込んだ状態を示す断面図である。 ６．１６・・・・・・基盤、７・・・・・・円筒基台、
８・・・・・・基盤配置用溝、１５・・・・・・板ばね
、１７．３０・・・・・・円筒、２０・・・・・・ター
ゲット、２４・・・・・・下基台、２５・・・・・・上
基台。1A and 1B are perspective views of a part of a conventional substrate holder for vapor deposition, FIG. the first of
Fig. 3 is a perspective view showing the assembled state of the substrate holder for vapor deposition, which is an example of the present invention; FIG. 4 is a plan view of the substrate holder for vapor deposition according to the second embodiment of the present invention, and FIG. 5 is a cross-sectional view showing the substrate holder installed in a vapor deposition apparatus. It is a diagram. 6.16...Base, 7...Cylindrical base,
8... Groove for base placement, 15... Leaf spring, 17.30... Cylinder, 20... Target, 24... Bottom Base, 25...Top base.

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）円筒状の支持体の内壁面に筒軸方向と直交する方
向に前記内壁面に沿って環状の蒸着用基盤装填用溝を設
け、その装填用溝の上端部および下端部に沿ってそれぞ
れ両端部を前記内壁面に固定して複数個の板ばねを環状
に設け、その板ばねが前記内壁面に沿う方向に変形され
た第１の安定状態で前記装填用溝に装填された蒸着用基
盤の上端部を前記板ばねにより前記内壁に押圧保持し、
前記板ばねが前記内壁面に沿う方向と反対方向に変形し
た第２の安定状態で、前記板ばねは前記装填用溝に装填
された前記蒸着用基板と離反するよう構成したことを特
徴とする蒸着用基盤保持具。(1) An annular deposition substrate loading groove is provided along the inner wall surface of the cylindrical support in a direction perpendicular to the cylinder axis direction, and a groove is provided along the upper and lower ends of the loading groove. A plurality of plate springs are provided in an annular shape with both ends thereof fixed to the inner wall surface, and the plate springs are loaded into the loading groove in a first stable state in which the plate springs are deformed in a direction along the inner wall surface. The upper end of the base is pressed and held against the inner wall by the leaf spring,
In a second stable state in which the leaf spring is deformed in a direction opposite to the direction along the inner wall surface, the leaf spring is configured to separate from the deposition substrate loaded in the loading groove. Base holder for vapor deposition. （２）支持体が筒軸方向に分割された複数個の円筒分割
体からなり、それぞれの円筒分割体にそれぞれ装填用溝
と板ばねとを設けるとともに保持手段により前記円筒分
割体を円筒状に保持した実用新案登録請求の範囲第１項
記載の蒸着用基盤保持具。(2) The support body is composed of a plurality of cylindrical segments divided in the direction of the cylinder axis, and each cylindrical segment is provided with a loading groove and a leaf spring, and the cylindrical segment is held in a cylindrical shape by a holding means. A substrate holder for vapor deposition according to claim 1 of the claimed utility model registration claim.