JPS5834870A - Composite powder composition - Google Patents
Composite powder compositionInfo
- Publication number
- JPS5834870A JPS5834870A JP13253981A JP13253981A JPS5834870A JP S5834870 A JPS5834870 A JP S5834870A JP 13253981 A JP13253981 A JP 13253981A JP 13253981 A JP13253981 A JP 13253981A JP S5834870 A JPS5834870 A JP S5834870A
- Authority
- JP
- Japan
- Prior art keywords
- powder
- melting point
- coating film
- epoxy resin
- silicone resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000843 powder Substances 0.000 title claims abstract description 57
- 239000002131 composite material Substances 0.000 title claims abstract description 10
- 239000000203 mixture Substances 0.000 title claims description 11
- 238000002844 melting Methods 0.000 claims abstract description 40
- 230000008018 melting Effects 0.000 claims abstract description 32
- 239000011521 glass Substances 0.000 claims abstract description 24
- 229920002050 silicone resin Polymers 0.000 claims abstract description 19
- 239000003822 epoxy resin Substances 0.000 claims abstract description 17
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 17
- 238000000576 coating method Methods 0.000 abstract description 33
- 239000011248 coating agent Substances 0.000 abstract description 31
- 239000002245 particle Substances 0.000 abstract description 20
- 239000000919 ceramic Substances 0.000 abstract description 8
- 230000002159 abnormal effect Effects 0.000 abstract description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 2
- 239000005388 borosilicate glass Substances 0.000 abstract description 2
- 239000000126 substance Substances 0.000 abstract 2
- 230000001464 adherent effect Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 abstract 1
- 230000001681 protective effect Effects 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- 238000009413 insulation Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- -1 and sb Inorganic materials 0.000 description 4
- 238000000354 decomposition reaction Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 125000003668 acetyloxy group Chemical group [H]C([H])([H])C(=O)O[*] 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000003282 alkyl amino group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910021523 barium zirconate Inorganic materials 0.000 description 1
- DQBAOWPVHRWLJC-UHFFFAOYSA-N barium(2+);dioxido(oxo)zirconium Chemical compound [Ba+2].[O-][Zr]([O-])=O DQBAOWPVHRWLJC-UHFFFAOYSA-N 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001642 boronic acid derivatives Chemical class 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005524 ceramic coating Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000010436 fluorite Substances 0.000 description 1
- 239000000156 glass melt Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 238000009863 impact test Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- LAQFLZHBVPULPL-UHFFFAOYSA-N methyl(phenyl)silicon Chemical compound C[Si]C1=CC=CC=C1 LAQFLZHBVPULPL-UHFFFAOYSA-N 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 125000003261 o-tolyl group Chemical group [H]C1=C([H])C(*)=C(C([H])=C1[H])C([H])([H])[H] 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- DCVWZWOEQMSMLR-UHFFFAOYSA-N silylperoxysilane Chemical compound [SiH3]OO[SiH3] DCVWZWOEQMSMLR-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000001694 spray drying Methods 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 230000002747 voluntary effect Effects 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Glass Compositions (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
Abstract
Description
【発明の詳細な説明】
この発明は各種電気機器の保曖塗装あるいは絶縁塗装に
使用される耐熱性を有する粉体組成物に関し、通常の使
用温度では比較的低温で、過負荷等によシ急速に温度上
昇するような用途に好適に対応できるような塗膜を与え
る粉体組成物に係るものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a heat-resistant powder composition used for insulation coating or insulation coating of various electrical equipment, which is relatively low at normal usage temperature and is resistant to overload etc. The present invention relates to a powder composition that provides a coating film that can be suitably used in applications where the temperature rises rapidly.
粉体塗料は溶剤を使用しない無公害塗料として最近大い
に注目されているが塗膜の強度、接着性、耐熱性、作業
性などを配慮した塗料の出現が待望されている。Powder coatings have recently attracted a lot of attention as non-polluting paints that do not use solvents, but the emergence of paints that take into account film strength, adhesion, heat resistance, workability, etc. is eagerly awaited.
本発明者らはこのような事情に基づき鋭意研究の結果比
較的低温の状態で高い塗膜の密着性を有し、長時間連続
して使用することができ、かつ異常状態で激しい温度上
昇に曝された場合に強固なセラミック皮膜に変化し、高
い耐熱特性、絶縁特性を与える粉本組成物として、シリ
コン樹脂、エポキシ樹脂、低融点ガ→ス及び耐熱性無機
物からなる複合粉本を開発した。Based on these circumstances, the inventors of the present invention have conducted intensive research and found that the coating film has high adhesion at relatively low temperatures, can be used continuously for a long time, and can withstand severe temperature rises under abnormal conditions. We have developed a composite powder composition consisting of silicone resin, epoxy resin, low-melting gas, and heat-resistant inorganic material, which transforms into a strong ceramic film when exposed to heat and provides high heat resistance and insulation properties. .
このような複合粉体はシリコン樹脂及びエポキシ樹脂が
常態では基材への密着性と必要な樹脂絶縁皮膜を与・え
るとともに、６００〜７００℃という異常高温で樹脂が
分解したときは、低融点ガラスが熔融して基材と密着す
るとと本に、シリコン樹脂の熱分解により生成された８
１０３等の酸化物がガラスと反応して高融点のセラミッ
ク層を形成し耐熱絶縁皮膜を形成するものである。In such a composite powder, silicone resin and epoxy resin normally provide adhesion to the substrate and the necessary resin insulation film, but when the resin decomposes at an abnormally high temperature of 600 to 700°C, it has a low melting point. When the glass melts and comes into close contact with the base material, 8.
An oxide such as 103 reacts with glass to form a high melting point ceramic layer, thereby forming a heat-resistant insulating film.
本発明者らは更にこの粉体組成物について追求の結果粉
体組成物中低融点ガラスの粒径を８０メツシユ以下にす
ることが塗膜の平滑性と耐熱性を向転勤流動法もしくは
スプレードライ法等で製造しているが、従来は塗膜の平
滑性及び高温時の耐熱性を高めるためには低融点ガラス
の粒径を微細化する方が好ましいのではないかと考えて
複合粉体を製造していたが、低融点ガラス粉体の粒径は
大きい方が塗膜の平滑性を高め、耐熱性もよくなること
を見い出した。The present inventors further investigated this powder composition and found that the particle size of the low melting point glass in the powder composition should be 80 mesh or less to improve the smoothness and heat resistance of the coating film using the transfer flow method or spray drying method. However, in order to improve the smoothness of the coating film and the heat resistance at high temperatures, we thought that it would be better to make the particle size of low-melting point glass finer, so we developed composite powder. However, it was discovered that the larger the particle size of the low-melting point glass powder, the smoother the coating film and the better the heat resistance.
アクリロニトリル等の重合性モノマーとの共重合物も使
用することができ、その場合シリコン樹脂成分の含量は
少くも３０嘔以上あることが望ましい。A copolymer with a polymerizable monomer such as acrylonitrile can also be used, and in that case, it is desirable that the content of the silicone resin component is at least 30 mm.
更にはｓｌとＴｉ 、 Ｂ 、 Ａ／、 Ｐ、 Ｇｏ、
Ａｓ、 ８ｂ等の元素を１種以上と酸素とを骨格に持
つもの、或はＳｌとＴｉ、Ｂ。Furthermore, sl and Ti, B, A/, P, Go,
Those having one or more elements such as As and 8b and oxygen in the skeleton, or Sl, Ti, and B.
）Ｊ 、 Ｐ 、 Ｇｏ、 Ａｓ、 ｓｂ 等の元素を
１種以上と酸素と炭素とを骨格に持つ構造のものなど使
用可能である。) Those having a structure having one or more elements such as J, P, Go, As, and sb, oxygen, and carbon in their skeletons can be used.
エポキシ樹脂は異常高温等で樹脂の分解温度で分解し消
失するが、５重量％より少ない場合は最初の塗膜の平滑
性及び密着性が不充分であり、（資）重量嗟を越えた場
合には異常高温によりエポキシ樹脂が分解した場合に皮
膜に急激な脆化を来たし。Epoxy resin decomposes and disappears at the decomposition temperature of the resin at abnormally high temperatures, etc., but if it is less than 5% by weight, the smoothness and adhesion of the initial coating film are insufficient, and if it exceeds the weight When the epoxy resin decomposes due to abnormally high temperatures, the coating suddenly becomes brittle.
基材から皮膜が剥離するおそれがある。There is a risk that the film may peel off from the base material.
このエポキシ樹脂としては、ヘテロ環、ベンゼン環を含
み基材との密着性に優れた耐熱性樹脂を添加することが
できる。As this epoxy resin, a heat-resistant resin containing a hetero ring and a benzene ring and having excellent adhesion to the base material can be added.
低融点フリットは温度上昇によりシリコン樹脂、エポキ
シ樹脂が熱分解した際に約４００℃以上の温度で軟化流
動して基材との密着性を保持しながら、前述のシリコン
樹脂の分解生成物である８１０ ｍと反応して高融点セ
ラミック皮膜を形成する亀ので、通常、融点が３００〜
６００℃のホウケイ酸ガラス又は含鉛ガラス誹ん酸ガラ
ス等が用いられ、また高温における金属基材との密着性
を更に向上させるためには低融点ガ゛ラスにＣｏ、ＭＬ
、 Ｐ、 Ｍｎ、Ｔｉ、 Ｚｒ、 Ｇｑ ＩＪｏ等の金
属の酸化物や化合物或はホウ酸塩更Ｋａこれらの元素を
含む複合酸化物やその他の化合物等を１種又は２種以上
添加混合したものを用いることが望ましい。Low melting point frit is a decomposition product of the aforementioned silicone resin that softens and flows at a temperature of about 400°C or higher when silicone resin or epoxy resin thermally decomposes due to temperature rise, maintaining adhesion to the base material. Since it reacts with 810 m to form a high melting point ceramic film, it usually has a melting point of 300 to 300 m.
Borosilicate glass, lead-containing glass, silicate glass, etc. at 600°C are used, and in order to further improve the adhesion to the metal substrate at high temperatures, Co, ML, etc. are added to the low melting point glass.
, P, Mn, Ti, Zr, Gq, metal oxides or compounds such as IJo, or borates, complex oxides or other compounds containing these elements, etc., added and mixed one or more. It is desirable to use
低融点ガラスは異常温度上昇により、樹脂が分解した際
に強固表セラミック皮膜を生成する上で重要な役割を果
すが、この低融点ガラスの粒子を８０メツシエ以下とし
た場合には２０− ｍｏ型重量が好ましく２０重量％よ
シ少ない場合には塗膜の耐熱性が悪く、８０重量％を越
えると塗膜の平滑性が悪゛くまり、接着性等が悪くなる
。Low melting point glass plays an important role in forming a strong surface ceramic film when the resin decomposes due to abnormal temperature rise, but if the particles of this low melting point glass are 80 meshier or less, the 20-mo type If the weight is preferably less than 20% by weight, the heat resistance of the coating film will be poor, and if it exceeds 80% by weight, the smoothness of the coating film will be poor and the adhesion properties will be poor.
高融点無機質微粉末は、樹、脂成分が分解するに至る昇
温過程に於て塗膜の収縮による亀裂発生で基材からの剥
離現象を来たすのを防止し、強固カセラミック皮膜を形
成するために必要なもので、０．２〜１５重量−が好ま
しい範囲である。その添加量が１５重量％よシ多過ぎれ
ばセラミック皮膜の密着力が低下し、０２重量係より少
ない場合にけ昇温時に大きな亀裂を発生し易い。The high melting point inorganic fine powder prevents peeling from the base material due to cracks caused by shrinkage of the coating film during the heating process that leads to the decomposition of resin and resin components, and forms a strong ceramic coating. The preferred range is 0.2 to 15% by weight. If the amount added is too large, such as 15% by weight, the adhesion of the ceramic film will decrease, and if it is less than 0.2% by weight, large cracks will easily occur when the temperature is increased.
又、この高融点無機物微粉末はエポキシ樹脂、シリコン
樹脂、低融点ガラス微粉末の間に介在して相互の反応を
抑制し、塗膜の平滑性を良くする作用も果たす。Further, the high melting point inorganic fine powder is interposed between the epoxy resin, the silicone resin, and the low melting point glass fine powder to suppress mutual reactions and improve the smoothness of the coating film.
高融点無機質微粉末としては、少くも低融点ガラス微粉
末より高い融点のもので、通常６００ ℃以上好ましく
は８００℃以上の融点のもの、が用いられる。具体的に
はアルミナ（４１１０ｍ） 、シリカ（８１（ｈ）、ベ
リリア（Ｂｅｄ）、ジルコニア（ＺｒＯｍ） ｓマグネ
シア（Ｍ、ｆｏｌ、酸化チタン（ＴｉＯ＊）、酸゛化鉄
（Ｆｅｄ、 Ｆｅｗ Ｏｎ）、チタン酸バリウム（Ｂａ
ＴｉＯｓ） ＊チタン酸カルシウム（０ａＴｉ Ｏｓ
）、チタン酸鉛（ＰｂＴｉ Ｏ，ｓ ）、ジルコン（Ｚ
ｒＳｉＯ４）、ジルコン酸バリウム（Ｂａｉｒｎｓ）、
ステアタイト（ｕｔｓｉｏｓ）、タルク、フレ１１モン
皐すロナイト、ベントナイが使用される。なお、これら
の無機微粉末は、ビニル基、エポキシ基、アルキルアミ
ノ基、アルコキシ基、アセトキシ基、ハロゲン原子外ど
を有するシラン系処理剤やシリルパーオキサイド々どの
変性シラン或はアルキルチタネートなどの有機チタン系
物質更にはリン酸エステル、亜すン酸エステル轡の有機
リン化合物などの処理剤によってシリコン系樹脂と親和
性もしくは反応性の状態になるよう表面処理しておいて
も良い。即ちこのような表面処理は粉体塗装時の加熱に
よって流動性が良好となシ塗膜を平滑化し易く、かつ無
機物粉末とシリコン系樹脂との密着性が良好となり強１
東な塗膜が得られるものである。The high melting point inorganic fine powder has a melting point at least higher than that of the low melting point glass fine powder, and usually has a melting point of 600° C. or higher, preferably 800° C. or higher. Specifically, alumina (4110m), silica (81 (h), beryllia (Bed), zirconia (ZrOm), magnesia (M, fol), titanium oxide (TiO*), iron oxide (Fed, Few On), Barium titanate (Ba
TiOs) *Calcium titanate (0aTiOs)
), lead titanate (PbTiO,s), zircon (Z
rSiO4), barium zirconate (Bairns),
Steatite (utsios), talc, fluorite, and bentonite are used. These inorganic fine powders may be treated with silane-based treatment agents having vinyl groups, epoxy groups, alkylamino groups, alkoxy groups, acetoxy groups, halogen atoms, etc., modified silanes such as silyl peroxide, or organic compounds such as alkyl titanates. The surface may be treated with a titanium-based material or a treatment agent such as an organic phosphorus compound such as a phosphoric acid ester or a sulfuric acid ester to make it compatible with or reactive with the silicon-based resin. In other words, this type of surface treatment provides good fluidity when heated during powder coating, making it easy to smooth the coating film, and also improves the adhesion between the inorganic powder and silicone resin, resulting in a strong
This will give you a beautiful coating film.
又、無機物微粉末はあらかじめその粒子表面にエポキシ
樹脂、シリコン樹脂或はこれらの樹脂と相容性の良い樹
脂を被覆した複合粉体としても良く、この場合にも塗膜
の平滑性が改善され、基材への密着性屯改善される。In addition, the inorganic fine powder may be a composite powder whose particle surface is coated with epoxy resin, silicone resin, or a resin that is compatible with these resins, and in this case also, the smoothness of the coating film is improved. , the adhesion to the substrate is improved.
本発明ではこのような粉体組成物中特に低融点ガラスの
粒径を８０メツシユ以下という比較的大きい吃のとする
ことにより、塗膜の平滑性と耐熱性を向上するものであ
る。In the present invention, the smoothness and heat resistance of the coating film are improved by making the particle size of the low melting point glass in the powder composition relatively large, 80 mesh or less.
即ち、低融点ガラスの粒径は小さい程シリコン樹脂およ
びエポキシ樹脂との反応が大きく、塗膜形成に際して流
動性を阻害し、平滑性が悪いが、粒径が大きくなるに従
いシリコン樹脂およびエポキシ樹脂との反応は少なくな
り、粒径が大きいことは表面積が小さくなることを意味
するのでこの点からも流動性がよくなり、塗膜が平滑化
されるのである。又、樹脂の熱分解する高温では、樹脂
の分解ガスの脱気状態を考えると低融点ガラスの粒径の
大きい程、粒子間隔も広く、その数屯少ないので、分解
ガスが塗膜め表面に脱出し易くなりこれによって分解ガ
スを皮膜中に内臓した場合に生成し勝ちなふくれやとび
が無く、耐熱性を良くすることができ、粉体塗料として
の塗装性その他を考え併せた結果低融点ガラスは８０メ
ツシユ以下が最も好ましいものであることを見出した。In other words, the smaller the particle size of low-melting point glass, the greater the reaction with silicone resin and epoxy resin, inhibiting fluidity and poor smoothness during coating film formation, but as the particle size increases, the reaction with silicone resin and epoxy resin increases. Since the particle size is large, the surface area is small, and from this point of view as well, fluidity is improved and the coating film is smoothed. In addition, at high temperatures where the resin thermally decomposes, considering the degassing state of the decomposed gas of the resin, the larger the particle size of the low melting point glass, the wider the particle spacing, and the smaller the number of particles, so the decomposed gas does not reach the coating surface. It becomes easier to escape, and as a result, there is no blistering or spattering that can occur when decomposition gas is incorporated into the film, and it has good heat resistance.As a result of considering paintability as a powder coating, etc., it has a low melting point. It has been found that the most preferable glass is 80 meshes or less.
次に本発明の実施例について述べる。Next, embodiments of the present invention will be described.
メチルフェニル系シリコン樹脂（東芝シリコン社製ＹＲ
３１６８）の粒径２０メツシユ以下の粉末２６重量俤、
エポキシ樹脂（チバガイギー社製７００４）の粒径２０
メツシユ以下の粉末１４重量％、８０メツシユ以下の低
融点ガラス粉末（鉛系）５７重量％、平均粒径１μ以下
のベンガラ３重量％をＶ型ミキサーで均一に混合した後
６０℃で加熱ロールで混練し、ついでハンマーミル粉砕
機で８０メツシ為以下に粉砕して耐熱性粉体とした。Methylphenyl silicone resin (YR manufactured by Toshiba Silicon Co., Ltd.)
3168) powder with a particle size of 20 mesh or less,
Particle size of epoxy resin (Ciba Geigy 7004): 20
14% by weight of a powder with a mesh size or less, 57% by weight of a low melting point glass powder (lead-based) with a mesh size or less, and 3% by weight of red iron glass with an average particle size of 1μ or less were mixed uniformly in a V-type mixer, and then heated at 60°C with a heating roll. The mixture was kneaded and then ground to a size of 80 mesh or less using a hammer mill to obtain a heat-resistant powder.
これを２００℃に予熱した鋼板上にスプレー塗装して融
着させ、厚さ２５０ ＃ｎの塗膜を形成した。This was spray-painted and fused onto a steel plate preheated to 200°C to form a coating film with a thickness of 250 #n.
実施例２
メチルフェニル系シリコン［脂（東芝シリコン社製ＹＲ
３３７０）の粒径２０メツシユ以下の粉末３６重量％、
エポキシ樹脂（チバガイギー社製ＧＴ ７００４）の粒
径２０メツシユ以下の粉末１７重量％、低融点ガラス粉
末（融点４００℃リン酸系）８０メツシユ以下、４４重
量−１平均粒径ｌμ以下のベンガラ３重量％をＶ型ミキ
サーで均一に混合した後６０℃で加熱ロールで混練し、
ついぞｑ−ミル粉砕機で８０メクシー以下に粉砕して耐
熱性粉体とした。Example 2 Methylphenyl silicone [fat (YR manufactured by Toshiba Silicon Co., Ltd.)]
3370) powder with a particle size of 20 mesh or less, 36% by weight,
17% by weight of powder of epoxy resin (GT 7004 manufactured by Ciba Geigy) with particle size of 20 mesh or less, low melting point glass powder (phosphoric acid type with melting point of 400°C) of 80 mesh or less, 44 weight - 3 weight of red iron with average particle size of 1 μ or less % were mixed uniformly with a V-type mixer, then kneaded with heated rolls at 60°C,
The powder was then ground to a size of 80 Mexie or less using a Q-mill grinder to obtain a heat-resistant powder.
これを２３０℃に予熱した鋼板上にスプレー塗装して融
着させ厚さ３００μｍの塗膜を形成した。This was spray-painted and fused onto a steel plate preheated to 230° C. to form a coating film with a thickness of 300 μm.
比較例
低融点ガラス粉末を２００メツシユ以下及び３２５メツ
シ為以下とし、その他は実施例４と全く同一とした複合
粉体により同じ方法で２５０μｍの塗膜を形成し九。Comparative Example A coating film of 250 μm was formed in the same manner using the same composite powder as in Example 4 except that the low melting point glass powder was 200 mesh or less and 325 mesh or less.
実施例及び比較例の塗膜の平滑性・密着性及び５００℃
に於ける耐熱性を比較試験した結果は次表のとおりであ
る。Smoothness and adhesion of coating films of Examples and Comparative Examples and 500°C
The results of a comparative heat resistance test are shown in the table below.
（注） ◎優 Ｏ良゛ Δ可
試験方法 平滑性 表面粗さ針（小板研究所）密着性
デエポン式（衝撃試験法）３０（！ＩＩ特許出願人
藤倉電曽株式会社
代理人 １士竹 内 守
手続補正書（自発）
昭和５６年９月３０日
特許庁長官 島 １）春 樹 殿
１、事件の表示
昭和５６年特許願第１３２＾号
２、発明の名称
３、補正をする者
事件との関係 特許出願人
住 所 東京都江東区木場−丁目５番１号名 称
（５１８）藤倉電線株式会社代表者河村勝夫
４、代理人
居 所 郵便番号１０１
東京都千代田区内神田二丁目１５番１３号南 部
ビ ル
を挿入する。(Note) ◎Excellent O Good Δ Acceptable Test method Smoothness Surface roughness Needle (Koita Research Institute) Adhesion Depon method (Impact test method) 30 (!II patent applicant
Fujikura Denso Co., Ltd. Agent 1 Shitake Uchi Procedural Amendment (Voluntary) September 30, 1980 Director General of the Patent Office Shima 1) Haruki Tono1, Indication of Case Patent Application No. 132^2 of 1982, Title of the invention 3, relationship with the case of the person making the amendment Patent applicant address 5-1 Kiba-chome, Koto-ku, Tokyo Name
(518) Fujikura Electric Cable Co., Ltd. Representative Katsuo Kawamura 4, Agent Address: 101 South, 2-15-13 Uchikanda, Chiyoda-ku, Tokyo
Insert Bill.
よ如詳細に説明すれば、前記し九本発明のオ夏舎粉体の
組成物中シリコン樹脂はエポキシ樹脂同様に通常の粉体
塗料の焼付温度領域で流動し平滑な塗装面を得る為の流
動剤としての働きＡ点フリット粉末および高融点無機物
粉末に対するバインダーとしての働きを持って居り、か
つ塗膜が熱分解温度以上の高温に曝されたときには、熱
分解により生成される８１０ｍが低融点フリットと反応
して高融点のセラミックー質となシ、耐熱性に優れた絶
縁皮膜を形成するものである。そのためシリコン樹脂を
５重量％より少くした場合には温度上昇時の塗膜の脆化
が充分に防止できず又、低融点フリットと反応して高温
特性に優れたセラミック絶縁皮膜を形成するための８１
０１が不足する。逆にシリコン樹脂を５０重量−よシ多
くした場合は高温で分解して生成する５１０８が過剰と
なシ、生成するセラミック絶縁皮膜にクラックを生じ易
くかつその皮膜の密着性も低下するので、前述のように
シリコン樹脂は５重量Ｓ〜５０重量−が好ましい。To explain in more detail, the silicone resin in the Onatsusha powder composition of the present invention flows in the baking temperature range of ordinary powder coatings, similar to epoxy resin, and has the ability to obtain a smooth painted surface. Function as a flow agent: It functions as a binder for the A-point frit powder and the high melting point inorganic powder, and when the coating film is exposed to a high temperature above the thermal decomposition temperature, the 810M produced by thermal decomposition has a low melting point. It reacts with the frit to form a ceramic material with a high melting point and an insulating film with excellent heat resistance. Therefore, if the silicone resin content is less than 5% by weight, it will not be possible to sufficiently prevent the coating film from becoming brittle when the temperature rises, and it will react with the low melting point frit to form a ceramic insulation film with excellent high temperature properties. 81
01 is insufficient. On the other hand, if the amount of silicone resin is increased by 50% by weight, the amount of 5108 that is decomposed and produced at high temperatures will be excessive, which will easily cause cracks in the resulting ceramic insulation film and reduce the adhesion of the film. As shown in the figure, the silicone resin preferably has a weight of 5 to 50 weight.
Claims (2)
ラス粉体及び耐熱性無機物粉体からなる複合粉体にして
、低融点ガラスを８０メツシユ以下の粉体としたことを
特徴とする複合粉体組成物。(1) A composite powder consisting of silicone resin powder, epoxy resin powder, low melting point glass powder, and heat-resistant inorganic powder, and the low melting point glass is made into a powder with a mesh size of 80 mesh or less. Powder composition.
粉体５〜５０重量％、低融点ガラス粉体２０〜８０重量
嘔、高融点無機物粉体０，２〜１５重量嗟重量外る複合
粉体にして、低融点ガラスを８０メツシユ以下の粉体と
し九ことを特徴とする複合粉体組成物。(2) A composite containing 5-50% by weight of silicone resin powder, 5-50% by weight of epoxy resin powder, 20-80% by weight of low-melting point glass powder, and 0.2-15% by weight of high-melting point inorganic powder. A composite powder composition characterized in that the powder has a low melting point glass of 80 mesh or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13253981A JPS5834870A (en) | 1981-08-24 | 1981-08-24 | Composite powder composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13253981A JPS5834870A (en) | 1981-08-24 | 1981-08-24 | Composite powder composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5834870A true JPS5834870A (en) | 1983-03-01 |
Family
ID=15083638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13253981A Pending JPS5834870A (en) | 1981-08-24 | 1981-08-24 | Composite powder composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5834870A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01152169A (en) * | 1987-12-09 | 1989-06-14 | Sumitomo Bakelite Co Ltd | Epoxy resin powder coating composition |
| JPH01185320A (en) * | 1988-01-18 | 1989-07-24 | Matsushita Electric Works Ltd | Epoxy resin molding material |
| DE19507400A1 (en) * | 1995-03-03 | 1996-09-12 | Kulmbacher Klimageraete | Thermal insulation material |
| WO2006033775A1 (en) * | 2004-09-17 | 2006-03-30 | Dow Corning Corporation | Siloxane composition, agglomerate, and method of preparing agglomerate |
| CN104962169A (en) * | 2015-06-25 | 2015-10-07 | 安徽华辉塑业科技有限公司 | High-temperature-resistant epoxy resin powder coating |
| CN112334545A (en) * | 2018-06-27 | 2021-02-05 | 日东电工株式会社 | Flame-retardant material |
-
1981
- 1981-08-24 JP JP13253981A patent/JPS5834870A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01152169A (en) * | 1987-12-09 | 1989-06-14 | Sumitomo Bakelite Co Ltd | Epoxy resin powder coating composition |
| JPH01185320A (en) * | 1988-01-18 | 1989-07-24 | Matsushita Electric Works Ltd | Epoxy resin molding material |
| DE19507400A1 (en) * | 1995-03-03 | 1996-09-12 | Kulmbacher Klimageraete | Thermal insulation material |
| DE19507400C2 (en) * | 1995-03-03 | 1998-04-09 | Kulmbacher Klimageraete | Thermal insulation material and process for its manufacture |
| WO2006033775A1 (en) * | 2004-09-17 | 2006-03-30 | Dow Corning Corporation | Siloxane composition, agglomerate, and method of preparing agglomerate |
| JP2008513572A (en) * | 2004-09-17 | 2008-05-01 | ダウ・コーニング・コーポレイション | Siloxane composition, aggregate, and method for producing aggregate |
| US7737082B2 (en) | 2004-09-17 | 2010-06-15 | James Alan Rabe | Siloxane composition, agglomerate, and method of preparing |
| JP2012092353A (en) * | 2004-09-17 | 2012-05-17 | Dow Corning Corp | Siloxane composition, agglomerate, and method of preparing the agglomerate |
| CN104962169A (en) * | 2015-06-25 | 2015-10-07 | 安徽华辉塑业科技有限公司 | High-temperature-resistant epoxy resin powder coating |
| CN112334545A (en) * | 2018-06-27 | 2021-02-05 | 日东电工株式会社 | Flame-retardant material |
| CN112352022A (en) * | 2018-06-27 | 2021-02-09 | 日东电工株式会社 | Flame-retardant coating film |
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