JPS5836447A - Heat-resisting coating structure - Google Patents

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 本発明は金属表面に粉体ｍｔａｖｃより構成される耐熱
性被覆構造に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a heat-resistant coating structure composed of powder mtavc on a metal surface.

本発明者らは、先にシリ；ン樹１１、エポキシ樹ｆｉ！
、低融点ガラス粉末及び高融点無機物微粉末からなる複
合物体を金義表面に塗布し加熱処理した場合に常温から
塗膜の樹脂成分の分解前は勿論、同樹脂成分の分解後で
も無機成分のセラｉック化によって優れたセラ建ツク絶
縁皮膜層を形成するよう１に１［体物体塗料を開発した
。The present inventors first developed a silicone tree 11 and an epoxy tree fi!
When a composite object consisting of a low-melting point glass powder and a high-melting point inorganic fine powder is applied to a metal surface and heat-treated, the inorganic components of the coating film will be dissolved at room temperature, not only before the resin component decomposes, but also after the resin component decomposes. We have developed a 1 to 1 body paint that forms an excellent ceramic insulation film layer by changing to ceramic.

ζＯ耐熱性粉体塗料は樹脂成分と無機質成分更に詳細に
はシリコン樹脂、エポキシ樹脂、低融点ガラＸ粉末及び
高融点無機−微粉末からなるｔ。The ζO heat-resistant powder coating consists of a resin component and an inorganic component, more specifically a silicone resin, an epoxy resin, a low melting point glass powder, and a high melting point inorganic fine powder.

で、複合物体の製造は、粉体ブレンド法、混練粉砕法、
転勤流動法及びスプレードライ法など各種Ｏ方ｆＭＫよ
って行なわれる。このようにして製造された豪体物体拡
基材に一層ＩＩ！！ｉＩシ穴場合、粉体塗料中に無機物
が多いと耐熱性は向上するが塗膜はｌ１ｉＩｉとなｐ平
滑性を欠くうら与があった。The production of composite objects includes powder blending, kneading and grinding,
It is carried out by various methods such as transfer flow method and spray dry method. The Australian body object expansion base material manufactured in this way is even more II! ! In the case of iI holes, heat resistance is improved if there are many inorganic substances in the powder coating, but the coating film is l1iIi and lacks p-smoothness.

本発明は上述のような欠Ａｖｒ解消し、しか４１１合粉
体物よる麹換の優れた耐熱性を低下させないような被覆
構造を粉体塗装によル解決したものである。The present invention solves the above-mentioned lack of Avr by using powder coating to create a coating structure that does not reduce the excellent heat resistance of the 411 mixed powder.

即ち、本跪＃４は前述のようにシリコン樹脂、工／命シ
Ｉ１１脂、低融点ガラス粉末及び高融点ガラス微粉末か
もな４１１［会粉体ＯＳＳの上に樹脂のみからなる粉体
の塗装被膜を設けた耐熱性被覆構造であり、又、前記覆
合粉体がシリコン樹脂５〜ｓ。That is, as mentioned above, Honke #4 is a coating of powder consisting only of resin on silicone resin, Ko/Meishi I11 resin, low-melting point glass powder, and high-melting point glass fine powder 411 [meeting powder OSS]. It has a heat-resistant coating structure provided with a film, and the covering powder is silicone resin 5-s.

重量％、エポキシ樹脂５〜５０重量５Ｘ％低融点ガラス
粉末２０〜８０１貢％、高融点無機物微粉末０．２〜１
５重量％からなる複合粉体で、この複合粉体の塗［１内
層とし、その上に通常の樹脂粉体重ａｔ外層として設け
た耐熱性被覆構造に係るｔのである。Weight%, epoxy resin 5-50% by weight, low melting point glass powder 20-801%, high melting point inorganic fine powder 0.2-1%
A composite powder consisting of 5% by weight is used to form a heat-resistant coating structure in which the composite powder is coated as an inner layer and an outer layer is provided with a normal resin powder.

次に本発明の被覆構造を形成する置台粉体の各組成につ
いて説明すれば、シリコン１１脂及びエポキシ樹脂は通
常の粉体！！！科の焼付ｉ！変領領域流動し平滑な塗装
面を得るための流動剤としての動電樹脂は塗膜に耐熱性
を温存してｆＩＡ寝上昇時に拡倫膜の脆化を防止し、か
つ塗膜熱分解１１［１以上の高温に曖され九ときには、
その熱分解により生成する１カ富が低融点ガラスと反応
して高融点のセラミック物質となシ、耐熱性に優れた絶
縁皮膜を形成する。Next, the composition of the base powder forming the coating structure of the present invention will be explained. Silicone 11 resin and epoxy resin are ordinary powders! ! ! School burning i! The electrokinetic resin, which is used as a flow agent to flow in the transformation region and obtain a smooth painted surface, preserves the heat resistance of the coating film, prevents the expansion film from becoming brittle when the fIA rises, and prevents coating film thermal decomposition. [At 9:00 a.m. due to a high temperature of 1 or more,
The carbon dioxide produced by the thermal decomposition reacts with the low melting point glass to form a high melting point ceramic material, forming an insulating film with excellent heat resistance.

本記合に於てシリコン樹脂が５重量％より少ない場合に
はＳ［上昇ＫＩＩＬ、Ｉ！！膜の脆化を防止する効果が
不充分となシ、逆に５０重童％より多ければ、高ＩＩＫ
より生成したセラ建ツク絶縁皮膜にクラックが尭生し、
皮ｔｓｏｖｉ着性が低下するおそれがある。In this description, if the silicone resin is less than 5% by weight, S[rise KIIL, I! ! The effect of preventing membrane embrittlement is insufficient, and conversely, if the amount is more than 50%, it is a high IIK.
Cracks grow in the ceramic insulation film formed by
There is a risk that the adhesion to the skin will decrease.

このシリコン樹脂にはメチル系シリコン樹脂。This silicone resin is a methyl silicone resin.

メチルフェニル系シリコン樹脂の単独又は屋舎−１その
外、アルキッド樹脂変性シリコン樹脂、エポキシ変性シ
リコン樹脂、フェノール樹脂変性シリコン樹脂、メラ建
ン樹脂変性シリコン樹脂等及びそれと変性しないシリコ
ン樹脂との共重合物或はシリコン樹脂とメチルメタクリ
レート、フクリロエトリル等０１舎性モノマーとの共重
合物も使用することかで１＆ｉ、その場合シリコン樹脂
成分の含量は少くも３０％以上あることが！ｉ！ましい
。Methylphenyl silicone resin alone or copolymerization with unmodified silicone resin, alkyd resin-modified silicone resin, epoxy-modified silicone resin, phenol resin-modified silicone resin, meladen resin-modified silicone resin, etc. It is also possible to use a copolymer of a silicone resin and a monomer such as methyl methacrylate or fucryloethryl, in which case the content of the silicone resin component must be at least 30%! i! Delicious.

更＃Ｃは８−と”　ｅ　Ｂ　＊　ＬＩＩｍ　Ｐ　ｍ　Ｇ
ａ　＃Ａｓ　、　８ｂ等Ｏ元ｊｌｔ１種以上と酸素とを
骨格に持つもの、戚Ｈｓｔトｔｔ　、Ｂ　、ｊｕ、Ｐ、
Ｇａ　、Ａｓ　、８ｂ等の元素ｔＸＳ以上とｓＩ素と炭
素とｔ骨格に持つ構造のｔのなど使用可能である。Change #C is 8-” e B * LIIm P m G
a #As, 8b, etc. having one or more O elements and oxygen in their skeleton, related Hstttt, B, ju, P,
Elements tXS or higher such as Ga, As, 8b, sI element, carbon, and t having a structure in the t skeleton can be used.

エポキシ樹脂は異常高温等で樹脂の分解ｓＷで分解し消
失するが、５重量％より少ない場合は最初の塗膜の平滑
性及び密着性が不充分であシ％関重童％を越えた場合に
は異常高温によジェポキシ樹脂が分解し次場合に皮膜に
急激な鰍化を来たし。Epoxy resin decomposes and disappears due to resin decomposition sW at abnormally high temperatures, etc., but if it is less than 5% by weight, the smoothness and adhesion of the initial coating film are insufficient. In the next case, the jepoxy resin decomposes due to abnormally high temperatures, and the film suddenly becomes brittle.

基材から皮膜が剥離するおそれがある。There is a risk that the film may peel off from the base material.

とのエポキシ樹脂としては、ヘテロ環、ベンゼン環を含
み基材との密着性に優れた耐熱性樹脂を添加することが
できる。As the epoxy resin, a heat-resistant resin containing a hetero ring and a benzene ring and having excellent adhesion to the base material can be added.

低融点ガラス微粉末（ガラス７リツト）は、エポキシ樹
脂およびシリコーン系樹脂が分解する４００℃程閥のｓ
度で軟化流動して基材との密着性を保持し、かつ前述の
シリコーン系樹脂の分解生成物（ｓｌｏ、　）と反応し
て高融点セライック皮膜を形成するものである。この低
融点ガラスとしては、融点が３００〜６００℃Ｐ４度の
ホウケイ１１２ガラス、含量ガラスまたはリン酸類ガラ
ス郷が用いられる。ｉた高ＩＩＫおける金属基材との密
着性ｔさシＶ【向上させる友め、低融点ガラスＫ　Ｏｏ
　、Ｎｔ。Low-melting glass fine powder (glass 7 liters) is heated at temperatures around 400°C, where epoxy resins and silicone resins decompose.
It softens and flows at a certain temperature to maintain adhesion to the base material, and reacts with the decomposition products (slo, ) of the silicone resin described above to form a high melting point celiac film. As this low melting point glass, borosilicate 112 glass, high content glass or phosphate glass having a melting point of 300 to 600 degrees Celsius P4 degrees is used. Adhesion to metal substrates at high IIK (low melting point glass)
, Nt.

Ｐ　、　Ｍａ　、　Ｔ４　、　Ｚｒ　＠　Ｏｓ　、　Ｍ
ｏ　　等の金属の酸化物や化合物、あるいはホウ酸塩、
さらにはこれらの元嵩を含む１合酸化物やその他の化合
物°等を１種または２種以上型ｍ／１合したｔｏｔ用い
ることが１ｉｌｔシー。なシ、ここで用いられる低融点
ガラス微粉末としては２種以上のガラスを併せて用いる
ことかでＩＩｉる。低融点ガラスは異常１１１１上昇に
より樹脂が分解した際に強固なセライック皮＠【生成す
る上で重要な役割を果すので、２０〜ｓｏｎ量％が好ま
しく、２０重量％より少ない場合には塗膜の耐熱性が愚
〈８０重量％を越えると皮膜の平滑性、１１着性等が愚
くなる。高融点無機質微粉末は　＊脂成分が分解するに
至る昇温過程に於て塗Ｉ！Ｏ収纏による亀ｌ！尭生で基
材からの剥離曳象を素たす０ｔｖｊ止し１強固なセライ
ック皮ａを形成するために６畳なもので０．２〜１５重
量にが好壕しｖｋｌＩｓでＴｏｈ、その添加量が１５重
量％よ）多過ぎればセラ電ツタ皮膜の強［が低下し〜０
．２重量％よ〉少な・−場７合には昇温時に大きな亀＊
１−発生し易−０ 又、この高融点無機物微粉末はエポキシ樹脂、シリコン
樹脂、低融点ガラス微粉末の間に介在して相互の反応を
抑制し、塗膜の平滑性を良くする作用も果たす。P, Ma, T4, Zr@Os, M
Metal oxides and compounds such as o, or borates,
Furthermore, it is possible to use one or more types of m/1 combined oxides and other compounds containing these basic bulks. However, as the low melting point glass fine powder used here, two or more types of glasses may be used in combination. Low melting point glass plays an important role in forming a strong Ceracic skin when the resin decomposes due to an abnormal 1111 rise, so the amount is preferably 20 to 20% by weight, and if it is less than 20% by weight, it will cause damage to the coating film. If the heat resistance exceeds 80% by weight, the smoothness, adhesion, etc. of the film will deteriorate. High-melting point inorganic fine powder is applied during the heating process that leads to the decomposition of fat components! Turtle by O collection! In order to prevent peeling from the base material and to form a strong ceramic skin, it is preferable to use a 6-tatami material with a weight of 0.2 to 15%. If the amount is too high (15% by weight), the strength of the ceraden ivy film will decrease to ~0.
．． If the amount is as low as 2% by weight, a large turtle will appear when the temperature is raised.
1-Easy to occur-0 In addition, this high melting point inorganic fine powder interposes between the epoxy resin, silicone resin, and low melting point glass fine powder to suppress mutual reactions and improve the smoothness of the coating film. Fulfill.

高融点無機物微粉末としては、少くも低融点ガラス微粉
末より高い融点のもので、通常６００’Ｃ以上好ましく
は８００℃以上の融点のものが用いられる。Ａ体的１ｃ
　ｉｊ　７　ｓ、　ｉす（ＩＶ＃ｌＯ＠　　）、シリカ
（８１０１）　、ペリリア（Ｂａ０７．シルコニ了（Ｚ
ｒＯ＊）。The high melting point inorganic fine powder has a melting point at least higher than that of the low melting point glass fine powder, and usually has a melting point of 600° C. or higher, preferably 800° C. or higher. A body 1c
ij 7 s, isu (IV#lO@), silica (8101), perilia (Ba07.
rO*).

マグネシア（ＭｇＯ）　’、酸化チタン（Ｔｉ０１　）
　、　ｆｌｌｌ鉄化鉄ＦｅＯ＊　Ｆｅ鵞Ｏｓ　）　％チ
タン瞭バリウム（ＢｓｔＴｌＯｓ）。Magnesia (MgO)', titanium oxide (Ti01)
, full iron ferrite FeO*FeOs) % barium titanium oxide (BstTlOs).

チタン酸カルシウム（０ｓＴＩＯｓ　）、ブタン酸鉛＜
　ＰｂＴｉＯｓ　）　、　　ジルコンＣＺｒ３ｉ０ｉ　
）　、　　ジルコン酸バリウム（ＢｓＺｒＯｓ　）、ス
テアタイト（Ｍｇ８１０ｍ　）、メルク、クレー、モン
モリロナイト、ベントナイト、カオリン、マイカ、ボロ
ンナイトライド（ＢＮ）、Ｑ化ケイ素、その他のセライ
ック系耐熱着色ｔａ料等が使用される。なお、これらの
無機微粉末は、ビニル番、エボ中シ基、フル中ルア゛擢
ノ基、アルコキシ基、ア七ト中シ基、ハロゲン原子など
を有するシラン系処理網やシリルパーオキサイドなどの
変性シラン或いはプルキルチタネートなどの有機チタン
系物質更にはりン酸エステル。Calcium titanate (0sTIOs), lead butanoate <
PbTiOs), Zircon CZr3i0i
), barium zirconate (BsZrOs), steatite (Mg810m), Merck, clay, montmorillonite, bentonite, kaolin, mica, boron nitride (BN), silicon chloride, and other celiac heat-resistant coloring agents are used. Ru. In addition, these inorganic fine powders are treated with silane-based treated networks and silyl peroxide, which have vinyl numbers, polycarbonate groups, fluorine-containing groups, alkoxy groups, acetate-neutral groups, halogen atoms, etc. Organic titanium-based substances such as modified silanes or purkytitanates, and phosphoric acid esters.

亜リン酸エステル等の有機リン化合物などの処理１ＩＳ
Ｋよってシリコン系樹脂と親和性％Ｌ、（は反応性の状
ｌＩＫなるよう表面処理しておいても良い。Treatment of organic phosphorus compounds such as phosphites 1IS
Therefore, the surface may be subjected to surface treatment so as to have a reactive state of affinity %L with the silicone resin.

即ちこのような表面処理は粉体塗装時の加熱によって流
動性が棗好となシ塗膜を平滑化し易（、かつ無機物粉末
とシリコン系樹脂との密着性が嵐好とな９強−な塗膜が
得られるものである。In other words, this kind of surface treatment makes it easy to smooth the paint film by giving it a smooth fluidity due to heating during powder coating (and smoothing the coating film with a smooth coating between the inorganic powder and the silicone resin). A coating film is obtained.

本発明では上記の如き複合粉体の塗膜の上にエポキシ樹
ｍ、ポリエステル樹脂、シリコン樹脂、ポリイミド樹脂
、ポリ了＜ｙ樹脂、アクリル樹脂。In the present invention, an epoxy resin, a polyester resin, a silicone resin, a polyimide resin, a polyester resin, or an acrylic resin is applied on the coating film of the composite powder as described above.

もしくは７エシール樹脂等の樹脂粉末の１種又は２種以
上の混合物の粉体像ＩＩ？！膜を設け、更に必９に応じ
てその上にワックス塗装して、内層の複合粉体０ＩＩＩ
ｌｌＩの耐熱性を何等阻害することなく。Or powder image II of one type or a mixture of two or more types of resin powder such as 7-Essile resin? ! A film is provided, and if necessary, wax is applied on top of the film to coat the inner layer of composite powder 0III.
without inhibiting the heat resistance of llI in any way.

表關の平滑＊１ｓ脂粉体の塗膜による外層によって与え
るものであゐ。It is provided by an outer layer made of a coating film of smooth*1s fat powder on the surface.

本発−は、複合粉体のＷ１躾（内層）と樹脂粉体の塗膜
（外層）の二層構成によって、基材と内層。This product has a two-layer structure consisting of a composite powder W1 layer (inner layer) and a resin powder coating (outer layer) to create a base material and an inner layer.

内層と外層間の密着性がよく、一体の被覆構造を構成し
ておシ、通常の使用ｉｉｔは勿論内層がセランツク化す
る際にも、外層の分解でこれｔ妨げることはない。The inner layer and the outer layer have good adhesion and constitute an integral coating structure, and the decomposition of the outer layer will not interfere with normal use or even when the inner layer becomes selenium.

複合粉体による内層の耐熱性塗膜の厚さは２０〜７００
μｍ姓ましくは１００〜４００βｍが高温時の電気絶縁
性その他の点で良いと考えられる。The thickness of the inner layer heat-resistant coating film made of composite powder is 20 to 700 mm.
It is considered that μm is preferably 100 to 400βm in terms of electrical insulation properties at high temperatures and other aspects.

塗膜の厚さが薄過ぎれは高温時の電気絶縁性の低下が著
るしく、逆に厚過ぎれば樹脂成分の分解ガスが脱気しに
〈（な９膨化発泡等が生じ、機械的特性及び電気的特性
ｔ−損うおそれがある。If the thickness of the coating film is too thin, the electrical insulation properties at high temperatures will be significantly reduced.On the other hand, if the coating film is too thick, the decomposed gas of the resin component will degas, causing swelling and foaming, which will deteriorate the mechanical properties. and electrical characteristics may be impaired.

外層（保護皮膜）ｔ−設けることは塗膜の平滑性を良く
すみことが目的である。しかし外層を總すと湯−変上昇
時に内層の耐熱性皮膜の分解ガスが抜は難くなシ皮膜が
剥離するおそれがある。そζで内層の耐熱性塗膜を多孔
質にして分解ガスが脱気し易くした耐熱性塗膜（内層）
上に更に保護皮膜（外層）として分解性の嵐い樹脂を用
いるか又は分解性の患い樹脂では無機物【多量に添加し
て分解ガスを脱気し易いようにしたものでないと、Ｓ１
上昇時に内層の耐熱性皮膜がｌ１Ｍ１ｌ！するおそれが
ある。The purpose of providing the outer layer (protective film) is to improve the smoothness of the coating film. However, if the outer layer is removed, it will be difficult to remove the decomposition gas from the heat-resistant coating on the inner layer when the temperature rises, and there is a risk that the coating will peel off. The heat-resistant coating film (inner layer) is made porous so that decomposition gas can easily degas.
If a decomposable resin is not used as a protective film (outer layer) on top of the protective coating (outer layer), or if a decomposable resin is not added with inorganic substances (inorganic substances in large quantities to facilitate degassing of decomposed gas), S1
The heat-resistant film on the inner layer increases to 11M1L when rising! There is a risk of

保護皮膜の樹脂としては平滑性が良く、機械的にも耐摩
耗性が良（、内層との密着性に優れたものが望ましい。The resin for the protective film is preferably one that has good smoothness, good mechanical abrasion resistance (and excellent adhesion to the inner layer).

父、樹脂等には無機物微粉末を０．２〜５０重量ＫＩｉ
＆添加しても曳く無機物は１種又は２種以上の混合物で
もよい。無機物微粉末と−しては炭酸カルシウム、酸化
チタン、アルミ九ベンガラ、シリカ、ガラス７リツト等
を適用することかでき易。For resin, etc., add inorganic fine powder of 0.2 to 50 weight KIi.
&The inorganic substances that can be added may be one type or a mixture of two or more types. Calcium carbonate, titanium oxide, aluminum oxide, silica, glass oxide, etc. can be easily used as the inorganic fine powder.

通常の使用時には基材と内層の耐熱性皮膜が強固に！！
着し、更に外層の保護皮膜が内層の耐熱性皮１１１１に
密着し、滑らかな塗膜を形成しておや、過負荷時に於て
温暖が上昇し、保護皮膜が分解消失した後でも内層の耐
熱性皮膜が基材と強固に密着したセラ擢ツク層に変化す
る。The heat-resistant film on the base material and inner layer remains strong during normal use! !
Furthermore, the protective film on the outer layer adheres to the heat-resistant skin 1111 on the inner layer, forming a smooth coating film. The heat-resistant film transforms into a ceramic layer that firmly adheres to the base material.

一方樹脂粉体による外層の樹脂塗膜の厚さは１０〜３０
０　βｍ好＊しくｕ８０ｆｉ　〜２００．ａｌｌが通常
のＩｌｆでの塗膜の平滑性に寄与するとともに内層のセ
ライック化に際して分解ガスの脱気を妨害せず、セラミ
ック皮ｓｔ−基材に強固に接着するのに効果があり、薄
過ぎれば通常の温変で充分な塗膜の平滑性が得られず、
厚過ぎれば樹脂の分解：Ｉｍ程で内層から生成する分解
ガスが脱気しに〈〈なり内層の耐熱性？！！膜が基材か
ら剥離するおそれがある。内層の耐熱性塗膜に用いられ
る複合粉体の塗装に当ってＩｆｉ１塗膜の焼付温１は１
２０ｔ〜２５０ｔＫ加熱すれは良＜、ｍ膜は厳密な意味
で一層でも多数層でもよい、又−１４０℃観で基材に塗
装して執着後２００′Ｃ程度で後加熱を行なっても良い
。On the other hand, the thickness of the outer resin coating film made of resin powder is 10 to 30
0 βm preferably u80fi ~200. All contributes to the smoothness of the coating film in normal Ilf, does not interfere with the degassing of decomposed gas when the inner layer is made into ceramic, and is effective in firmly adhering to the ceramic coating ST-substrate, and is effective in preventing too thin coating. If the coating film is not sufficiently smooth due to normal temperature changes,
If it is too thick, the resin will decompose: At about Im, the decomposed gas generated from the inner layer will degas. ! ! There is a risk that the film may peel off from the base material. When coating the composite powder used for the heat-resistant coating film of the inner layer, the baking temperature 1 of the Ifi1 coating film is 1.
The film can be heated to 20 to 250 tK. Strictly speaking, the film may have a single layer or multiple layers, or it may be coated on a substrate at -140°C and then heated at about 200'C after adhesion.

！ｆ以下のｔのが塗装並びに皮膜形成その他の点で好ま
しく、かくてこれらの複合粉体及び樹脂粉体【基材上に
ｍ次塗装した後には１２０〜２５０℃で加熱処理、樹脂
成分の流動性によシ充分均一な皮ａｔ形成することがで
きる。! It is preferable that t is less than f in terms of coating, film formation, and other aspects, and thus these composite powders and resin powders [after m-th coating on the base material, heat treatment at 120 to 250°C to prevent the flow of the resin component] It is possible to form a sufficiently uniform skin regardless of gender.

次に本発明の実施例について述べる。Next, embodiments of the present invention will be described.

実権例Ｌ　基材上にメチル７エエル系シリコン樹脂（東
芝シリコン社製ＹＲ３１６８）の粒径１（’）０メツシ
エ以下の粉末２０重量％と、工Ｉ°キシ樹脂（チパガイ
ー’ｕｍｒｏｏ４）□の粒径１００メツシエ以下の粉末
１０重量％と１粒径８０メツシュ以下、融点４５０ｔＣ
）低融点ガラス粉末（鉛系）６７重量％と、平均粒径１
μのベンガラ３重量％とｌ／−ルミルで均−ｖｃａ合し
て粉体組成物を得た。その粉体組成物ｔ２００℃に予熱
した一板上にスプレー塗装して融着させ、厚さ３００μ
ｍの＊Ｓｔｔ形成した。次に外層として１００メツシユ
以下のエポキシ樹脂粉体（大日本塗料社製Ｖ　−ＰＩＴ
１１３４０Ｈ）ｔ−用いて前記の内層を被覆されている
基材ｔ２００℃に予熱１、スプレー法で塗装して融着さ
せ厚さ１５０μｍの塗ａｔ形成し九。Practical example L: 20% by weight of powder of methyl 7EL silicone resin (YR3168 manufactured by Toshiba Silicon Co., Ltd.) with a particle size of 1(')0 or less and particles of methyl 7EL silicone resin (YR3168 manufactured by Toshiba Silicone Co., Ltd.) with a particle size of 1(')0 meshier or less and 1° xylic resin (Chipagai'umroo4) □ on a base material. 10% by weight of powder with a diameter of 100 mesh or less, 1 particle size of 80 mesh or less, melting point 450 tC
) Low melting point glass powder (lead-based) 67% by weight and average particle size 1
A powder composition was obtained by homogeneously combining 3% by weight of red red sardine with 1/-vca in a l/-rumyl. The powder composition was spray-painted onto a plate preheated to 200°C and fused to a thickness of 300 μm.
*Stt of m was formed. Next, as an outer layer, epoxy resin powder of 100 mesh or less (V-PIT manufactured by Dainippon Toyo Co., Ltd.
11340H) The substrate coated with the inner layer was preheated to 200° C. by spraying and fused to form a coating with a thickness of 150 μm.

夷總ガ２　内層ＫＮＩと同じ複合粉体を同じ方法で同じ
厚さに塗装したｖｋ１外層としてシリコン樹１１（東芝
シ響コン社１１ＹＲ３３７０）に炭酸カルシラ１３５重
量％ｔａ合した１００メツシユ以下の粉体を用いて、内
層を被覆されている基材を２００℃に予熱し、スプレー
法で塗装し融着させ、厚さ１５０μｍの塗膜を形成させ
友。Yoshiga 2 The same composite powder as the inner layer KNI was applied to the same thickness using the same method.VK1 The outer layer was a powder of 100 mesh or less, which was a combination of Silicon Tree 11 (Toshiba Sikyocon Co., Ltd. 11YR3370) and Calcilla carbonate 135% by weight. The substrate coated with the inner layer was preheated to 200°C using a spray method and fused to form a coating film with a thickness of 150 μm.

実権例１　メチル系シリコン樹脂（東芝シリコン社製Ｙ
Ｒ−３３７０）の粒径２０メツシユ以下の粉末３６重量
％と、エポキシ樹脂（チノ々ガイギー社製ＧＴ−７００
４）の粒径２０メツシエ以下の粉末１７重量％と、融点
４００℃の低重量％とからなる粉体ｔＶＭＩｉ＜キサ−
で均一に混合したｌｌｅ、６０℃に温習コントロールし
た熱ロールで７分間均−Ｋａｌｌｌｌｉシた。ついでこ
の屡練物ｔハンマー建ルで８０メツシユ以下に粉砕し、
耐熱性の粉体ｔ１！ｉ科を得た。この粉体組成−１−２
３０℃に予熱した鋼板上にスプレー塗装して融着させ、
厚さ３００　Ｊｉｍの懺膜を形成して内層を構成した。Actual example 1 Methyl silicone resin (Y made by Toshiba Silicon Co., Ltd.)
R-3370) powder with a particle size of 20 mesh or less, and epoxy resin (GT-700 manufactured by Chino Geigy)
4) Powder tVMIi<Kisa-
The mixture was homogeneously mixed and rolled for 7 minutes using a heated roll controlled at 60°C. Next, crush it to 80 mesh or less with this T-hammer construction,
Heat resistant powder t1! I got the i department. This powder composition-1-2
Spray paint and fuse on a steel plate preheated to 30℃,
A 300 Jim thick outer layer was formed to constitute the inner layer.

この上に外層として１００メツシユ以下のエポキシ樹脂
粉体（大日本塗料社製Ｖ−Ｐ　Ｍ　Ｔ＄　１３４０　）
　’に用イーＣ，内Ｍの耐熱性塗膜を形成した基材ｔ−
２３０℃に予熱して後。On top of this, as an outer layer, epoxy resin powder of 100 mesh or less (V-P M T$ 1340, manufactured by Dainippon Toyo Co., Ltd.)
Base material t- on which a heat-resistant coating film of E-C and inner-M was formed.
After preheating to 230℃.

スプレー法で！！！装して融着させ、厚さ１５０μｍの
ｔｍｍｔ−形成した。With the spray method! ! ! It was then fused and bonded to form a 150 μm thick tmmt.

比較例　メチルフェニル系シリコン樹ＢｔｌＣ１１芝シ
リコン社製ＹＫ３１６８）の粒径１００メツシエ以下の
粉末２０重量％と、エポキシ樹脂（チバガイギー社Ｉｆ
！７００４）の粒径１００メツシエ以下の粉末１０１量
％と、粒径８０メツシユ以下、融点４５０℃のガラス粉
床（鉛系）６７重量％と。Comparative Example: 20% by weight of powder of methylphenyl silicone BtlC11 (YK3168 manufactured by Shiba Silicon Co., Ltd.) with a particle size of 100 mesh or less and epoxy resin (If
! 7004) with a particle size of 100 mesh or less, and 67 weight % of a glass powder bed (lead-based) with a particle size of 80 mesh or less and a melting point of 450°C.

平均粒径１μｍのベンガラ３重量％とを、メールミルで
均一に混合して粉体組成物を得九、その粉体組成物を２
００℃に予熱した鋼板上にスプレー塗装して融着させ厚
さ３００μｍの塗８１１！を形成し九。A powder composition was obtained by uniformly mixing 3% by weight of red red iron with an average particle size of 1 μm in a mail mill.
Coating 811 to a thickness of 300μm by spray painting and fusing onto a steel plate preheated to 00℃! form nine.

次に上記の実繍偶及び比較例につめて比較試―をした結
果を示せば次の通９である。Next, the results of a comparative trial on the above-mentioned embroidered figures and comparative examples are as follows.

■罎　　０＆　　　４手通 以上の如く本尭明によるときは耐熱特性絶縁性Ｆｉ従来
と変らず平滑性を向上することができる。■As shown in the above example, heat resistance characteristics and insulation properties can improve the smoothness of the insulating film as described above.

代壕人軸士竹内　守Mamoru Takeuchi, Daikin Axis Officer

Claims (2)

【特許請求の範囲】[Claims] （１）　　シリコン樹脂、ニブキシ樹脂、低融点ガラス
粉末及び高融点無機物微粉末からなゐ複合粉体の塗膜の
上に樹脂粉体の１！！！膜を設けたことｔ峙徹とする耐
熱性絶縁被覆構造(1) A layer of resin powder is applied onto a coating film of composite powder consisting of silicone resin, niboxy resin, low-melting point glass powder, and high-melting point inorganic fine powder. ! ! Heat-resistant insulating coating structure with no film provided. （２）　　シリコン樹脂５〜５０重量％、エポ々シ樹脂
５〜５０重量％、低融点ガラス粉禾２０〜８０重量Ｘ１
高融点無機物黴粉宋０．２〜１ｓ重量％からなる組成の
複合粉体のｍ！ｌＩ上に樹脂粉体の塗膜を設けたことｑ
！ｆ像とする耐熱性被覆構造(2) Silicone resin 5-50% by weight, epoxy resin 5-50% by weight, low melting point glass powder 20-80% by weight
m of a composite powder with a composition consisting of 0.2 to 1 s weight % of high melting point inorganic mold powder Song! A coating film of resin powder was provided on lIq
! Heat-resistant coating structure for f-image