JPS5821053Y2 - Takairotasetsuten Switch - Google Patents

Takairotasetsuten Switch

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Publication number
JPS5821053Y2
JPS5821053Y2 JP1975155377U JP15537775U JPS5821053Y2 JP S5821053 Y2 JPS5821053 Y2 JP S5821053Y2 JP 1975155377 U JP1975155377 U JP 1975155377U JP 15537775 U JP15537775 U JP 15537775U JP S5821053 Y2 JPS5821053 Y2 JP S5821053Y2
Authority
JP
Japan
Prior art keywords
contact
insulating layer
patterns
switch
resin coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1975155377U
Other languages
Japanese (ja)
Other versions
JPS5267977U (en
Inventor
高橋邦夫
八木信行
Original Assignee
テイコクツウシンコウギヨウ カブシキガイシヤ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by テイコクツウシンコウギヨウ カブシキガイシヤ filed Critical テイコクツウシンコウギヨウ カブシキガイシヤ
Priority to JP1975155377U priority Critical patent/JPS5821053Y2/en
Publication of JPS5267977U publication Critical patent/JPS5267977U/ja
Application granted granted Critical
Publication of JPS5821053Y2 publication Critical patent/JPS5821053Y2/en
Expired legal-status Critical Current

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Description

【考案の詳細な説明】 本考案は印刷技術を用いた多回路多接点スイッチに関す
る。
[Detailed Description of the Invention] The present invention relates to a multi-circuit multi-contact switch using printing technology.

従来印刷回路技術によって構成したスイッチはロータリ
ー型でも直行型でも、一般の印刷回路と同様に、接点要
部から端子IC至る寸でを同一平面上にパターンとして
形成している。
Switches constructed using conventional printed circuit technology, whether rotary type or direct type, are formed as a pattern on the same plane from the main part of the contact point to the terminal IC, like a general printed circuit.

従って設計上接触片又はブラシが基板上を摺動するとき
、必要な場合以外は端子より接点に至る1での途中に他
の接点のパターンが存在しないように配慮するか、又は
スルーホールによって接点1での導体を基板の裏面に設
ける必要がある。
Therefore, when the contact piece or brush slides on the board, care should be taken to ensure that there are no other contact patterns on the way from the terminal to the contact point unless necessary, or by using a through hole to connect the contact point. It is necessary to provide the conductor No. 1 on the back side of the board.

このため一基板に多回路多接点を設けることが困難にな
る等、設計上の自由度が種々制限されていた。
For this reason, the degree of freedom in design has been restricted in various ways, such as making it difficult to provide multiple circuits and multiple contacts on one board.

またブラシが摺動するとき接点のエツジによって双方が
傷つきやすく、且つ操作のフィーリングが悪くなる等の
欠点があった。
Furthermore, when the brush slides, the edges of the contacts tend to damage both sides, and the feeling of operation is poor.

即ちこの種の基板は従来例として第5図及び第6図に示
すように、銅張り積層板の不要部分をエツチングして接
点パターン14 、14’14’およびブラシの回転範
囲外にある端子部10゜10’、10”tでの接続パタ
ーン11 、11’、11”等を形成しているので、摺
動するブラシとこの接続パターンとの不要の接触を避け
るために、接点ステップ数の制限を受け、あるいは前述
の如くスルーホール15.15’、15”を用いて基板
1′の裏面に接続パターン16.16’、16”を形成
することになって高価なものとなるほか、パターンのエ
ツジが例えば第5図に示すように鋭いので摺動時に摺動
ブラシおよびパターン双方の損傷を起しやすく、操作の
フィーリングを悪くしていた。
That is, as shown in FIGS. 5 and 6 as a conventional example, this type of board is made by etching the unnecessary parts of the copper-clad laminate to remove the contact patterns 14, 14'14' and the terminal portions outside the rotation range of the brush. Since connection patterns 11, 11', 11" etc. are formed at 10° 10', 10"t, the number of contact steps is limited in order to avoid unnecessary contact between the sliding brush and this connection pattern. The connection patterns 16, 16', 16'' are formed on the back surface of the substrate 1' using the through holes 15, 15', 15'' as described above, which is expensive and requires a large amount of pattern. Since the edges are sharp, as shown in FIG. 5, for example, both the sliding brush and the pattern are likely to be damaged during sliding, resulting in a poor feeling of operation.

この対策として1969年3125日アメリカ特許第3
435157号明細書に記載された発明がある。
As a countermeasure to this problem, U.S. Patent No. 3, dated 3125/1969,
There is an invention described in the specification of No. 435157.

そうしてそのFig 5及び明細書第3頁5欄目の第1
7行〜71行にトいて詳しく説明している。
Then, Fig. 5 and the first page of page 3, column 5 of the specification.
It is explained in detail in lines 7 to 71.

ここで該発明の回転スイッチに対する実施例を見るとそ
れは複数の接触片を備えた摺動ブラシに対応して絶縁基
板上に設けた同心の複数のリング状固定電極の上を、所
定の組合せで貫通孔を設けた絶縁被覆で覆って、前記摺
動ブラシを回動させたとき所定の回転角度位置で摺動ブ
ラシとリング状固定電極が接触して、所望の組合せの電
気信号を取出す方法であり、多回路の多少複雑なスイッ
チではスイッチの設計の自由度は非常に改善された。
Here, looking at an embodiment of the rotary switch of the invention, it is possible to move a plurality of concentric ring-shaped fixed electrodes provided on an insulating substrate in a predetermined combination to correspond to a sliding brush equipped with a plurality of contact pieces. A method in which the sliding brush is covered with an insulating coating having through holes, and when the sliding brush is rotated, the sliding brush and the ring-shaped fixed electrode come into contact at a predetermined rotational angle position, and a desired combination of electrical signals is obtained. This greatly improves the flexibility in switch design for multi-circuit, somewhat complex switches.

しかしこの方式のスイッチは民生用や小型通信機器に使
用した場合には絶縁被覆の摩耗や絶縁被覆のピンホール
による絶縁不良等が発生した。
However, when this type of switch was used for consumer use or small communication equipment, insulation defects occurred due to abrasion of the insulation coating and pinholes in the insulation coating.

又固定電極の接触要部を形成する絶縁被膜の貫通孔周辺
の絶縁被覆の縁部での回転が円滑でなく操作での感触が
問題となった。
In addition, the rotation at the edge of the insulation coating around the through-hole of the insulation coating that forms the main contact part of the fixed electrode was not smooth, which caused problems with the feel during operation.

そうしてこれらの改善が求められていた。Improvements in these areas were therefore required.

本考案は上記欠点の改善を目的としている。The present invention aims to improve the above drawbacks.

本考案の実施例を図面とともに説明する。Embodiments of the present invention will be described with reference to the drawings.

第1図は本考案によるスイッチの内部配置を示す側面図
、第2図は第1図のX−X断面を含む平面図、第3図は
接点基板の拡大平面図、第4図イ9口は絶縁層の拡大断
面図である。
Fig. 1 is a side view showing the internal arrangement of the switch according to the present invention, Fig. 2 is a plan view including the XX section of Fig. 1, Fig. 3 is an enlarged plan view of the contact board, Fig. 4 is an enlarged cross-sectional view of an insulating layer.

第1図ネ・よび第2図にトいてシャフト1は軸受2によ
って保持され慣用の節度機構部3により所定の角度ずつ
節度をもって回転することができる。
As shown in FIGS. 1 and 2, a shaft 1 is held by a bearing 2 and can be rotated by a predetermined angle by a conventional moderation mechanism 3.

このシャフトは延長して、ケース4 、4’、 4”に
より一定の間隔をもって中心軸に対し垂直に配設固定し
た接点基板5,5′を貫通し末端をケース4″によって
支持されている。
This shaft extends to pass through contact substrates 5, 5' which are arranged and fixed perpendicularly to the central axis at regular intervals by the cases 4, 4', 4'', and is supported at its end by the case 4''.

シャフトの前記延長剤には、接点基板5,5′の表裏両
面又は片面上を押圧しつつ摺動するばね材から成る多接
点ブラシ6゜6′、6″を保持するローター7 、7’
、 7”を装着し、回転に伴いブラシ6.6’、6”を
半径線上、例えば第3図の入線上で基板5,5′の表面
に接触せしめている。
The shaft extension member includes rotors 7, 7' that hold multi-contact brushes 6°6', 6'' made of spring material that slide while pressing on both the front and back surfaces or one side of the contact substrates 5, 5'.
, 7'' are mounted, and as the brushes rotate, the brushes 6.6', 6'' are brought into contact with the surfaces of the substrates 5, 5' on the radial line, for example, on the entry line in FIG.

基板5,5は絶縁物から成り第3図に示すように中央部
にシャフト1が貫通する穴17゜17′を設け、この穴
の周辺に同心円状の複数の接点パターン8,8′、8″
、8″′を、銅張り積層板のエツチング又はスクリーン
印刷法等により、基板の片面あるいは両面に形成する。
The substrates 5, 5 are made of an insulating material, and as shown in FIG. 3, a hole 17° 17' is provided in the center through which the shaft 1 passes, and a plurality of concentric contact patterns 8, 8', 8 are formed around this hole. ″
, 8''' are formed on one or both sides of the substrate by etching or screen printing of a copper-clad laminate.

捷た基板5,5′の端縁卸に端子9,9′を固着するた
め導電性の端子取付部i o 、 i o’、 i o
”、 1o”’を配設しである。
Conductive terminal mounting portions io, io', io are used to secure the terminals 9, 9' to the edges of the cut boards 5, 5'.
", 1o"' are arranged.

更にこの取付@I O、10’、 10”、 10”’
を適当な順序で接点パターン8,8′、8″、8″′に
接続する導電パターン11 、11’、 11”、
11”’を互に交差しないように形成しである。
Furthermore, this installation @IO, 10', 10", 10"'
conductive patterns 11, 11', 11'', which are connected to the contact patterns 8, 8', 8'', 8'' in an appropriate order;
11"' are formed so as not to cross each other.

その後前記接点パターン上のブラシ6.6′と接触する
所要の組合せの接触要部12 、12’、 12’;1
2”’を残し、又ブラシ6.6′の摺動範囲の外側を残
して、絶縁層13をもって被覆を施しである。
1 of the desired combination of contact elements 12, 12', 12' which then come into contact with the brushes 6.6' on the contact pattern;
2"' and the outside of the sliding range of the brushes 6 and 6' are covered with an insulating layer 13.

この絶縁層13は熱硬化性樹脂より成り、上記基板や導
電層との濡れ性が良好であって、膜厚や樹脂の粘度を適
当に選んで加熱硬化の際拡張濡れを起してその端縁を滑
らかに形成するようにしている。
This insulating layer 13 is made of a thermosetting resin and has good wettability with the substrate and the conductive layer, and by appropriately selecting the film thickness and the viscosity of the resin, expansion wetting occurs during heating and curing. The edges are made to be smooth.

しかし1回の塗布厚さが厚遇き“たり薄過ぎたりすると
端縁の平面精度は低下する。
However, if the thickness of one application is too generous or too thin, the flatness of the edge will deteriorate.

従って絶縁被覆の一層の厚さは通常10μ程度である。Therefore, the thickness of one layer of insulation coating is usually about 10 microns.

一層の厚さを厚く塗ることは絶縁被覆の平面寸法の精度
の低下だけでなく、縁部の盛上りその他縁部の平滑性が
ひどく低下することが多い。
Applying a thicker layer not only reduces the accuracy of the planar dimensions of the insulating coating, but also often seriously reduces the smoothness of the edges, such as raised edges.

又絶縁被覆は基板の表崩状態との関係で1層ではピンホ
ールを生ずることもあるのに対し多層式では絶縁性の信
頼性の改善ともなる。
In addition, a single layer insulation coating may cause pinholes due to the surface collapse state of the substrate, whereas a multilayer insulation coating improves the reliability of the insulation.

ここで絶縁層13として初めに接点基板5,5′の上に
第一の絶縁層13aの被覆を施し、次に第一層13aの
外側の縁から僅かに内側にずらせて第二の絶縁層13b
を重ねて順次重ねて多層式に形成すると、絶縁層13の
縁部は1回の被覆で形成する場合に比べて絶縁層13の
厚さを一定とすれば1回の段差は遥かに小さくなるため
、縁部の滑らかさは改善され又端縁の平面精度の維持も
容易である。
Here, as the insulating layer 13, a first insulating layer 13a is first applied on the contact substrates 5, 5', and then a second insulating layer is applied slightly inwardly from the outer edge of the first layer 13a. 13b
If the edges of the insulating layer 13 are layered one after another to form a multilayer structure, the edge of the insulating layer 13 will have a much smaller step if the thickness of the insulating layer 13 is kept constant compared to the case where it is formed by one coating. Therefore, the smoothness of the edge is improved and the flatness of the edge can be easily maintained.

又節動機構部を設けたスイッチでは使用時の摺動子の位
置を確実に絶縁皮膜の多層部に合わせることが容易に可
能であるため、1層の絶R層に比べてピンホール等によ
る絶縁不良をほとんど無くすことも可能である。
In addition, in a switch equipped with an articulation mechanism, it is easier to precisely align the position of the slider with the multi-layered insulation film during use, so it is less likely to be caused by pinholes, etc. than with a single layer of R layer. It is also possible to almost eliminate insulation defects.

なか、絶縁層13の形成方法としては、通常第一の絶縁
層13aを第一のマスクを介してスクリーン印刷で塗布
したあと予備乾燥後第一のマスクより縁部が僅かに内側
になるように形成した第二のマスクを介して第二の絶縁
層13bをスクリーン印刷で塗布して再度予備乾燥後、
高温で焼付を行なう。
Among these, the method for forming the insulating layer 13 is usually to apply the first insulating layer 13a by screen printing through a first mask, and then after preliminary drying, apply the first insulating layer 13a so that the edge is slightly inside from the first mask. After applying the second insulating layer 13b by screen printing through the formed second mask and pre-drying again,
Baking is performed at high temperature.

ここで必要に応じて上記に準じて第三絶縁層13c等を
重ねてもよい。
Here, if necessary, the third insulating layer 13c etc. may be layered according to the above.

本考案にトいては上記の如く、パターンを形成した後接
点又は接触部となる接触要部を残して導電パターン全体
に絶縁層を施すのでブラシが要部以外でパターンに接触
することがなく、従って端子部への導出が簡単であり、
又基板の表裏両面の使用ができるのでスイッチ全体の小
形化が容易である。
In the present invention, as described above, after the pattern is formed, an insulating layer is applied to the entire conductive pattern, leaving only the main contact parts that will become contacts or contact parts, so that the brush does not come into contact with the pattern other than the main parts. Therefore, it is easy to lead out to the terminal part,
Furthermore, since both the front and back sides of the board can be used, the entire switch can be easily miniaturized.

特に絶縁被覆13は最も外側の第一の絶縁層13aの僅
かに内側にずらして第二の絶縁層13bを重ねた多層式
としているため、絶縁層が一層の場合に比べてピンホー
ルによる絶縁不良が少なく、又絶縁層13の端函の段差
は比較的小さくなり絶縁被覆の縁はよシ平滑となり、摺
動感触は滑らかで平面精度も高く、ブラシの摺動による
損傷は少なく耐久性が優れている等実用的効果がい。
In particular, since the insulation coating 13 is of a multilayer type in which the second insulation layer 13b is stacked slightly inwardly of the outermost first insulation layer 13a, insulation defects due to pinholes are more likely to occur than in the case where the insulation layer is one layer. In addition, the step of the end box of the insulating layer 13 is relatively small, the edges of the insulating coating are much smoother, the sliding feel is smooth, the flatness is high, and there is little damage caused by sliding of the brush, resulting in excellent durability. It has practical effects such as:

な11以上の実施例は基板をケースで挾んで配設したも
のを示したが、ケースを用いず例えば基板間を支柱によ
って保持することも可能である。
In the eleventh embodiment and above, the substrates are sandwiched between cases, but it is also possible to hold the substrates with supports, for example, without using the case.

又多段構造とせず一段のスイッチに利用すること、さら
には直行形のスライドスイッチに応用することも容易で
ある。
In addition, it is easy to use it as a single-stage switch without having a multi-stage structure, and furthermore, it can be easily applied to a straight slide switch.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案によるスイッチの内部配置を示す側面図
、第2図は第1図のX−X断面を含む平面図、第3図は
接点基板の拡大平面図、第4図イ、口は絶縁層の拡大断
面図、第5図は従来のスイッチの部分的拡大断面図、第
6図イ ロはそれぞれの従来の接点基板の拡大平面図及
び背面図である。 1:シャフト、2:軸受、3:節度機構部、4:ケース
、5:接点基板、6:多接点ブラシ、7:ローター、8
:接点パターン、9:端子、10:端子取付部、11
:導電パターン、12:接触要部、13:絶縁層、14
:従来の接点パターン、15:貫通孔、16:接続パタ
ーン、17:シャフト貫通孔。
Fig. 1 is a side view showing the internal arrangement of the switch according to the present invention, Fig. 2 is a plan view including the cross section taken along the line X-X in Fig. 1, Fig. 3 is an enlarged plan view of the contact board, and Fig. 4 is a 5 is an enlarged sectional view of an insulating layer, FIG. 5 is a partially enlarged sectional view of a conventional switch, and FIG. 1: Shaft, 2: Bearing, 3: Moderation mechanism, 4: Case, 5: Contact board, 6: Multi-contact brush, 7: Rotor, 8
: Contact pattern, 9: Terminal, 10: Terminal mounting part, 11
: Conductive pattern, 12: Contact main part, 13: Insulating layer, 14
: conventional contact pattern, 15: through hole, 16: connection pattern, 17: shaft through hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁基板上に複数の接点パターン及びその接続パターン
を形成し、これらパターンの上に所要の組合せで接触要
部を残して濡れ性の良好な樹脂による被覆を施し、摺動
ブラシを前記樹脂被覆のない接触要部のみに電気的に接
触せしめた節動機構部を備えた多回路の多接点スイッチ
において、前記樹脂被覆13として第一の絶縁層13a
の上に、その接点要部の縁辺部において僅かに内側にず
らせて第二以降の絶縁層13b・・・を多層式に重ねて
構成したことを特徴とした多回路多接点スイッチ。
A plurality of contact patterns and their connection patterns are formed on an insulating substrate, a resin coating with good wettability is applied to these patterns leaving the main contact parts in the required combinations, and a sliding brush is coated with the resin coating. In a multi-circuit multi-contact switch equipped with an articulating mechanism section that electrically contacts only the main contact sections, the first insulating layer 13a serves as the resin coating 13.
A multi-circuit multi-contact switch characterized in that second and subsequent insulating layers 13b are superimposed in a multilayered manner on top of the insulating layers 13b, slightly shifted inward at the edge portions of the main contact portions.
JP1975155377U 1975-11-14 1975-11-14 Takairotasetsuten Switch Expired JPS5821053Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1975155377U JPS5821053Y2 (en) 1975-11-14 1975-11-14 Takairotasetsuten Switch

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1975155377U JPS5821053Y2 (en) 1975-11-14 1975-11-14 Takairotasetsuten Switch

Publications (2)

Publication Number Publication Date
JPS5267977U JPS5267977U (en) 1977-05-19
JPS5821053Y2 true JPS5821053Y2 (en) 1983-05-04

Family

ID=28634585

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1975155377U Expired JPS5821053Y2 (en) 1975-11-14 1975-11-14 Takairotasetsuten Switch

Country Status (1)

Country Link
JP (1) JPS5821053Y2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5114149A (en) * 1974-07-26 1976-02-04 Kurita Water Ind Ltd KINZOKUFUSHOKUBOSHIZAI

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5114149A (en) * 1974-07-26 1976-02-04 Kurita Water Ind Ltd KINZOKUFUSHOKUBOSHIZAI

Also Published As

Publication number Publication date
JPS5267977U (en) 1977-05-19

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