JPS58187143U - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS58187143U JPS58187143U JP8480282U JP8480282U JPS58187143U JP S58187143 U JPS58187143 U JP S58187143U JP 8480282 U JP8480282 U JP 8480282U JP 8480282 U JP8480282 U JP 8480282U JP S58187143 U JPS58187143 U JP S58187143U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor equipment
- standard
- corresponds
- standardization
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54406—Marks applied to semiconductor devices or parts comprising alphanumeric information
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
- H01L2223/5448—Located on chip prior to dicing and remaining on chip after dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第１図、第２図は、本考案の一実施例の構成図である。
図において、１・・・・・・ペレット、２〜４・・・・
・・アルミニウムのパターン、５〜７・・・・・・規格
を示すアルミニウムのパターン、８〜１０・・・・・・
針である。
・・アルミニウムのパターン、５〜７・・・・・・規格
を示すアルミニウムのパターン、８〜１０・・・・・・
針である。
Claims (1)
- 性能の違いによって規格分けを必要とする半導体装置に
於て、前もって規格に対応した金属層のパターンを備え
、特性チェック時に、前記規格に対応した該パターンに
キズを付け、ウェハー状態での規格分けが出来るように
した事を特徴とした半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8480282U JPS58187143U (ja) | 1982-06-08 | 1982-06-08 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8480282U JPS58187143U (ja) | 1982-06-08 | 1982-06-08 | 半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58187143U true JPS58187143U (ja) | 1983-12-12 |
Family
ID=30093724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8480282U Pending JPS58187143U (ja) | 1982-06-08 | 1982-06-08 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58187143U (ja) |
-
1982
- 1982-06-08 JP JP8480282U patent/JPS58187143U/ja active Pending
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