JPS58129670U - Mounting structure of chip parts - Google Patents

Mounting structure of chip parts

Info

Publication number
JPS58129670U
JPS58129670U JP2603082U JP2603082U JPS58129670U JP S58129670 U JPS58129670 U JP S58129670U JP 2603082 U JP2603082 U JP 2603082U JP 2603082 U JP2603082 U JP 2603082U JP S58129670 U JPS58129670 U JP S58129670U
Authority
JP
Japan
Prior art keywords
chip component
mounting structure
wiring board
chip parts
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2603082U
Other languages
Japanese (ja)
Inventor
富塚　俊雄
Original Assignee
株式会社精工舎
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社精工舎 filed Critical 株式会社精工舎
Priority to JP2603082U priority Critical patent/JPS58129670U/en
Publication of JPS58129670U publication Critical patent/JPS58129670U/en
Pending legal-status Critical Current

Links

Landscapes

  • Details Of Resistors (AREA)
  • Non-Adjustable Resistors (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例の展開斜視図、第２図は第１
図のチップ部品の断面図、第３図はチップ部品の他の実
施例の斜視図を示す。 １・・・・・・配線基板、２，３・・・・・・配線パタ
ーン、４・・・・・・取付穴、５．６・・・・・・チッ
プ部品、５ａ、　　７ａ・・・・・・突部、５ｂ、　　
５ｃ、　　ａ、　　９・・・・・・電極。Fig. 1 is an exploded perspective view of one embodiment of the present invention, and Fig. 2 is an exploded perspective view of an embodiment of the present invention.
FIG. 3 is a cross-sectional view of the chip component shown in the figure, and FIG. 3 is a perspective view of another embodiment of the chip component. 1... Wiring board, 2, 3... Wiring pattern, 4... Mounting hole, 5.6... Chip parts, 5a, 7a... ...protrusion, 5b,
5c, a, 9... electrode.

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）配線パターンを形成してあり取付穴を穿設しであ
る配線基板と、この配線基板の取付穴に嵌合保持される
突部を突設したチップ部品とからなり、上記取付穴に上
記突部を嵌合し上記チップ部品を上記配線基板に取付け
、上記配線パターンと上記チップ部品の電極とを接続す
ることを特徴とするチップ部品の取付構造。(1) Consists of a wiring board on which a wiring pattern is formed and mounting holes are drilled, and a chip component that has protrusions that are fitted and held in the mounting holes of the wiring board. A mounting structure for a chip component, characterized in that the chip component is attached to the wiring board by fitting the protrusion, and the wiring pattern and the electrode of the chip component are connected. （２）実用新案登録請求の範囲第１項において、配線基
板の取付穴は角穴であり、チップ部品の突部は上記角穴
に嵌合する角柱状であることを特徴とするチップ部品の
取付構造。(2) Utility model registration In claim 1, the chip component is characterized in that the mounting hole of the wiring board is a square hole, and the protrusion of the chip component has a prismatic shape that fits into the square hole. Mounting structure.
JP2603082U 1982-02-25 1982-02-25 Mounting structure of chip parts Pending JPS58129670U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2603082U JPS58129670U (en) 1982-02-25 1982-02-25 Mounting structure of chip parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2603082U JPS58129670U (en) 1982-02-25 1982-02-25 Mounting structure of chip parts

Publications (1)

Publication Number Publication Date
JPS58129670U true JPS58129670U (en) 1983-09-02

Family

ID=30037984

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2603082U Pending JPS58129670U (en) 1982-02-25 1982-02-25 Mounting structure of chip parts

Country Status (1)

Country Link
JP (1) JPS58129670U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006134920A (en) * 2004-11-02 2006-05-25 Neomax Co Ltd Lamination components and packaging structure thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006134920A (en) * 2004-11-02 2006-05-25 Neomax Co Ltd Lamination components and packaging structure thereof
JP4604656B2 (en) * 2004-11-02 2011-01-05 日立金属株式会社 Multilayer component mounting structure

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