JPS58100487A - Method of producing printed circuit board - Google Patents
Method of producing printed circuit boardInfo
- Publication number
- JPS58100487A JPS58100487A JP19933981A JP19933981A JPS58100487A JP S58100487 A JPS58100487 A JP S58100487A JP 19933981 A JP19933981 A JP 19933981A JP 19933981 A JP19933981 A JP 19933981A JP S58100487 A JPS58100487 A JP S58100487A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive layer
- circuit
- metal foil
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 本発明は印刷配線板の製造方法に関するものである。[Detailed description of the invention] The present invention relates to a method of manufacturing a printed wiring board.
従来印刷配線板の製造方法としては、基板に金属箔を貼
り合わせた後、該金属箔上に所望の回路を形成する方法
が行なわれていた。しかしこの方法によると基板材料が
印刷配線板の製造工程中２各種洗浄液、エツチング液な
どに浸漬される几め、基板本体は該各種の液により屡々
劣化する。該劣化の状態としてハ、１几とえは酸やアル
カリにより基板費面が化学的に浸食されるとか、あるい
は吸湿により電気特性が低下するなどである。また最近
多く用いられるようになった金属芯印刷配線板用の金属
基板（たとえばアルミニウム）は従来の樹脂基板よりも
さらに酸、アルカリに浸食されやすいので印刷配線板の
製造工程上多くの難点を含んでい友。2. Description of the Related Art Conventionally, a method for manufacturing a printed wiring board has been such that a metal foil is bonded to a substrate and then a desired circuit is formed on the metal foil. However, according to this method, the substrate material is immersed in various cleaning liquids, etching liquids, etc. during the manufacturing process of the printed wiring board, and the substrate body is often deteriorated by the various liquids. Examples of the state of deterioration include chemical erosion of the substrate surface by acid or alkali, or deterioration of electrical characteristics due to moisture absorption. In addition, metal substrates (for example, aluminum) for metal-core printed wiring boards, which have recently become widely used, are more easily eroded by acids and alkalis than conventional resin substrates, so there are many difficulties in the manufacturing process of printed wiring boards. Good friend.
本発明はこれらの難点を克服するための好適な印刷配線
板の製造方法を提供するものである。The present invention provides a method for manufacturing a printed wiring board suitable for overcoming these difficulties.
本発明は金属箔に接着剤を層状に塗布して乾燥しプリプ
レーグの状態とした後、該ブリプレーグ状態の接着剤層
塗布金属箔上に所望の回路を形成し、しかる後基板に貼
合わせることを特徴とし、その目的は簡便にして安定な
印刷配線板の製造方法を提供することにある。以下本発
明の実施例について詳細に説明する。The present invention involves applying a layer of adhesive to metal foil and drying it to form a prepreg, forming a desired circuit on the metal foil coated with the adhesive layer in the prepreg state, and then bonding it to a substrate. The purpose is to provide a simple and stable method for manufacturing printed wiring boards. Examples of the present invention will be described in detail below.
本発明において用いることのできる金属箔としては、次
とえば銅、アルミニウム、ステンレス鋼あるいはこれら
の合金がある。また接着剤とし、てはエポキシ系、フェ
ノール系、ウレタン系など種種の系統のものが適用でき
るが、とくにこ＼に例示したものに限定されるものでは
なく、予備乾燥によシ該回路を形成した接着剤層塗布金
属箔の形状を維持できる程度に硬化し、基板と貼合せる
際の加熱、加圧条件下で基板と十分な接着性を示すもの
であればよい。１＋金属箔に接着剤を塗布し、プリプレ
ーグ状態に′ｔで予備乾燥し九接着剤付き金属箔も市販
されているのでこれらを利用することもできる。Examples of metal foils that can be used in the present invention include copper, aluminum, stainless steel, and alloys thereof. In addition, various kinds of adhesives such as epoxy, phenol, and urethane can be used, but they are not particularly limited to those mentioned above.The circuit can be formed by pre-drying. Any material may be used as long as it is cured to such an extent that the shape of the metal foil coated with the adhesive layer can be maintained, and exhibits sufficient adhesiveness to the substrate under heating and pressurizing conditions when bonding to the substrate. 1+ Metal foil coated with an adhesive and pre-dried to a prepreg state with 9 adhesive is also commercially available, so these can also be used.
本発明の一実施例を次に示す。エポキシ系接着剤付き鋼
箔に紫外線硬化型レジ玄トインクにより所望の回路パタ
ーンを描き、過硫酸アンモニウム水溶液により不要部分
の銅を溶解除去して回路を形成し友。該回路はプリプレ
ーグ状態の接着剤付き鋼箔上に配列を正しく維持し次ま
＼形成されていた。該回路の形成された接着剤付き銅箔
ｔ−３チ水酸化ナトリウム水溶液中に浸漬した後水洗し
てレジスト層を除去し、次いで１００Ｃで乾燥した後、
陽極酸化処理をしたアルミニウム基板に重ね、１８０Ｃ
で加分間、１０ Ｋｙ／ｃｍ’の圧力で加熱、加圧接着
することによシ所望の印刷配線板を得た。An embodiment of the present invention is shown below. Draw the desired circuit pattern on steel foil coated with epoxy adhesive using ultraviolet curing resist ink, then dissolve and remove unnecessary copper using ammonium persulfate solution to form the circuit. The circuit was formed on prepreg adhesive steel foil to maintain proper alignment. The adhesive-coated copper foil T-3 on which the circuit was formed was immersed in an aqueous sodium hydroxide solution, washed with water to remove the resist layer, and then dried at 100C.
Layered on anodized aluminum substrate, 180C
A desired printed wiring board was obtained by heating and pressure bonding at a pressure of 10 Ky/cm' during addition.
本実施例において、接着剤層側にポリエチレンフィルム
を軍ねて、該工程途中で接着剤層が処理液に触れないよ
うにした場合には、工程途中で接着剤層が処理液に触れ
た場合に比し該接着剤付き鋼箔がよシ安定であり、貼合
わせ作業中に接着剤層が破れるなどの支障は生じなかっ
た。また、接着剤層を工程中の処理液に触れさせない几
め、硬質塩化ビニール板を接着剤層側に押しつけて処理
を行なり九場合にはポリエチレンフィルムを重ねた場合
と同等の効果を得危げかりでなく、工程液中での操作が
より容易でおった。ま次工程中の処理液を銅箔の側から
のみ、友とえば噴霧によシ適用し次場合にも、接着剤層
を損傷させることなく所望の回路を得るととができた。In this example, if a polyethylene film is placed on the adhesive layer side to prevent the adhesive layer from touching the processing liquid during the process, if the adhesive layer comes into contact with the processing liquid during the process, The adhesive-coated steel foil was more stable than the previous example, and no problems such as tearing of the adhesive layer occurred during the lamination process. In addition, in order to prevent the adhesive layer from coming into contact with the processing solution during the process, the treatment is carried out by pressing a hard vinyl chloride board against the adhesive layer. This was not a problem, and the operation in the process solution was easier. Furthermore, by applying the treatment solution in the next step only from the side of the copper foil, for example by spraying, it was possible to obtain the desired circuit without damaging the adhesive layer.
また銅箔面の全面あるいは一部にニッケル、銀、半田な
どをめっきしてから回路パターンを印刷し回路形成を実
施した場合も該実施例と同様の結果を得た。また半田め
っき層をエツチングレジストとして用い過硫酸アンモニ
ウムをエツチング液とした場合にも全く支障なく所望の
回路を得ることができ友。In addition, when the circuit was formed by plating the whole or part of the copper foil surface with nickel, silver, solder, etc. and then printing a circuit pattern, results similar to those of the above example were obtained. Furthermore, even when the solder plating layer is used as an etching resist and ammonium persulfate is used as an etching solution, the desired circuit can be obtained without any problem.
なお本発明において、回路形成の前あるいは後に所望の
部分にめっきを施すことは、必要に応じて選択的にとり
得る方法であり本発明のとくに限定するところではない
。In the present invention, plating a desired portion before or after circuit formation is a method that can be selectively adopted as needed, and is not particularly limited to the present invention.
以上詳述したとおり本発明は接着剤層を設けた金属箔を
用い、該金属箔に所望の回路を形成し次後基板と貼合わ
せることにより簡便でかつ安定に印刷配耐板を製造する
ことができる。As detailed above, the present invention uses a metal foil provided with an adhesive layer, forms a desired circuit on the metal foil, and then attaches it to a substrate, thereby easily and stably manufacturing printed distribution boards. I can do it.
本発明の態様の特徴は次のとおりである。Features of embodiments of the invention are as follows.
１、 接着剤層塗布金属箔に回路を形成する工程の一部
ま九は全部にわ几シ、接着剤層側を該工程中の処理液か
ら遮蔽すること。1. During part or all of the process of forming a circuit on the metal foil coated with the adhesive layer, the adhesive layer side must be shielded from the processing liquid during the process.
２ 接着剤層塗布金属箔に回路を形成する工程において
、該工程中の処理液を金属箔側からのみ適用すること。2. In the step of forming a circuit on the metal foil coated with an adhesive layer, the treatment liquid in the step is applied only from the metal foil side.
特許出願人 住友電気工業株式会社Patent applicant: Sumitomo Electric Industries, Ltd.
Claims (1)
成し、該所望の回路を形成した接着剤層塗布金層箔を基
板に貼合わせることを特徴とする印刷配線板の製造方法
。A method for manufacturing a printed wiring board, which comprises applying an adhesive layer to a metal foil, drying it, forming a desired circuit, and laminating the gold layer foil coated with the adhesive layer on which the desired circuit has been formed to a substrate. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19933981A JPS58100487A (en) | 1981-12-10 | 1981-12-10 | Method of producing printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19933981A JPS58100487A (en) | 1981-12-10 | 1981-12-10 | Method of producing printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58100487A true JPS58100487A (en) | 1983-06-15 |
Family
ID=16406139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19933981A Pending JPS58100487A (en) | 1981-12-10 | 1981-12-10 | Method of producing printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58100487A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02500231A (en) * | 1987-06-22 | 1990-01-25 | ウーテーアー・エス・アー・フアブリツク・デボーシユ | Method for producing electronic module circuit tape and tape obtained by this method |
-
1981
- 1981-12-10 JP JP19933981A patent/JPS58100487A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02500231A (en) * | 1987-06-22 | 1990-01-25 | ウーテーアー・エス・アー・フアブリツク・デボーシユ | Method for producing electronic module circuit tape and tape obtained by this method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4724040A (en) | Method for producing electric circuits on a base boad | |
| JP3487562B2 (en) | Printed wiring board and method of manufacturing the same | |
| JP2003082135A (en) | Method for etching laminate containing polyimide layer | |
| JPS58100487A (en) | Method of producing printed circuit board | |
| JP4057748B2 (en) | Flexible printed circuit board and manufacturing method thereof | |
| KR100228257B1 (en) | Flexible pcb and manufacture method for suitable for fine circuit formation | |
| JPS61202491A (en) | Manufacture of wiring board | |
| JP3828205B2 (en) | Method for manufacturing transfer member and transfer member | |
| JPS6356991A (en) | Manufacture of printed wiring board | |
| JPS637475B2 (en) | ||
| JPS61279197A (en) | Manufacture of multilayer printed wiring board | |
| JPS5842294A (en) | Method of producing printed circuit board | |
| JPS6298696A (en) | Formation of multilayer wiring board | |
| KR20020060659A (en) | Manufacturing method of single side typed flexible printed circuit board | |
| JPH0139234B2 (en) | ||
| JPS6017988A (en) | Printed circuit material | |
| JPS5916930B2 (en) | Method of manufacturing laminates | |
| JPS647517B2 (en) | ||
| JPS58197898A (en) | Method of producing multilayer printed circuit board | |
| JPS62185884A (en) | Production of laminate of metal and resin layer | |
| JPS62147795A (en) | Manufacture of electric circuit board | |
| JPS61123197A (en) | Manufacture of printed wiring board | |
| JPS63304691A (en) | Manufacture of printed-wiring board | |
| JPH0946022A (en) | Manufacture of printed wiring board | |
| JPS61102092A (en) | Manufacture of printed wiring board |