JPS5753948A - Mounting method of semiconductor element - Google Patents

Mounting method of semiconductor element

Info

Publication number
JPS5753948A
JPS5753948A JP12883680A JP12883680A JPS5753948A JP S5753948 A JPS5753948 A JP S5753948A JP 12883680 A JP12883680 A JP 12883680A JP 12883680 A JP12883680 A JP 12883680A JP S5753948 A JPS5753948 A JP S5753948A
Authority
JP
Japan
Prior art keywords
solder
supporting plate
mounting part
sucked
slag
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12883680A
Other languages
Japanese (ja)
Inventor
Takao Emoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP12883680A priority Critical patent/JPS5753948A/en
Publication of JPS5753948A publication Critical patent/JPS5753948A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
    • H01L2224/26152—Auxiliary members for layer connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/26175—Flow barriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To prevent generation of slag or cavity in an adhered solder layer and to enhance electric characteristic and heat radiating characteristic of a semiconductor element by a method wherein after a melted solder material is sucked in a gap between a supporting plate and the element by a capillary phenomenon, the element is made to slide up to a mounting part and is fixed. CONSTITUTION:A solder melting part 23 consisted of a circular concave part is formed preliminary at the outside of the mounting part 22 of a supporting copper plate 21. When melted solder 24 is formed on the melting part, a slag layer 25 is formed on the surface. The element 26 is made to come in contact with the solder 24 placing the prescribed interval between the supporting plate 21, and the solder is made to be sucked to the interval part. At this time, the slag layer 25 is obstructed to flow to remain in the melting part 23. Then the element 26 is made to slide to the mounting part 22 and is fixed to the supporting plate 21. At this sliding time, bubbles contained in the solder 24 are removed by scribing. Accodingly because superior adhesive property is enabled to obtain, electric and thermal characterstics can be improved.
JP12883680A 1980-09-17 1980-09-17 Mounting method of semiconductor element Pending JPS5753948A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12883680A JPS5753948A (en) 1980-09-17 1980-09-17 Mounting method of semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12883680A JPS5753948A (en) 1980-09-17 1980-09-17 Mounting method of semiconductor element

Publications (1)

Publication Number Publication Date
JPS5753948A true JPS5753948A (en) 1982-03-31

Family

ID=14994595

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12883680A Pending JPS5753948A (en) 1980-09-17 1980-09-17 Mounting method of semiconductor element

Country Status (1)

Country Link
JP (1) JPS5753948A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58195435U (en) * 1982-06-21 1983-12-26 新電元工業株式会社 semiconductor equipment
JPS5939035A (en) * 1982-08-27 1984-03-03 Shindengen Electric Mfg Co Ltd Manufacture of semiconductor device
JPS5939034A (en) * 1982-08-27 1984-03-03 Shindengen Electric Mfg Co Ltd Manufacture of semiconductor device
JPS59214033A (en) * 1983-05-12 1984-12-03 ゼロツクス・コ−ポレ−シヨン Manufacture of migration image forming material
US5727727A (en) * 1995-02-02 1998-03-17 Vlt Corporation Flowing solder in a gap
US5808358A (en) * 1994-11-10 1998-09-15 Vlt Corporation Packaging electrical circuits
US6316737B1 (en) 1999-09-09 2001-11-13 Vlt Corporation Making a connection between a component and a circuit board

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4949577A (en) * 1972-09-14 1974-05-14
JPS509383A (en) * 1973-05-22 1975-01-30
JPS548462A (en) * 1977-06-21 1979-01-22 Nec Home Electronics Ltd Manufacture for semiconductor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4949577A (en) * 1972-09-14 1974-05-14
JPS509383A (en) * 1973-05-22 1975-01-30
JPS548462A (en) * 1977-06-21 1979-01-22 Nec Home Electronics Ltd Manufacture for semiconductor

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58195435U (en) * 1982-06-21 1983-12-26 新電元工業株式会社 semiconductor equipment
JPH0222989Y2 (en) * 1982-06-21 1990-06-21
JPS5939035A (en) * 1982-08-27 1984-03-03 Shindengen Electric Mfg Co Ltd Manufacture of semiconductor device
JPS5939034A (en) * 1982-08-27 1984-03-03 Shindengen Electric Mfg Co Ltd Manufacture of semiconductor device
JPS59214033A (en) * 1983-05-12 1984-12-03 ゼロツクス・コ−ポレ−シヨン Manufacture of migration image forming material
US5808358A (en) * 1994-11-10 1998-09-15 Vlt Corporation Packaging electrical circuits
US5906310A (en) * 1994-11-10 1999-05-25 Vlt Corporation Packaging electrical circuits
US6096981A (en) * 1994-11-10 2000-08-01 Vlt Corporation Packaging electrical circuits
US6119923A (en) * 1994-11-10 2000-09-19 Vlt Corporation Packaging electrical circuits
US6159772A (en) * 1994-11-10 2000-12-12 Vlt Corporation Packaging electrical circuits
US5727727A (en) * 1995-02-02 1998-03-17 Vlt Corporation Flowing solder in a gap
US6316737B1 (en) 1999-09-09 2001-11-13 Vlt Corporation Making a connection between a component and a circuit board

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