JPS571250A - Equipping structure of outside lead - Google Patents

Equipping structure of outside lead

Info

Publication number
JPS571250A
JPS571250A JP7448380A JP7448380A JPS571250A JP S571250 A JPS571250 A JP S571250A JP 7448380 A JP7448380 A JP 7448380A JP 7448380 A JP7448380 A JP 7448380A JP S571250 A JPS571250 A JP S571250A
Authority
JP
Japan
Prior art keywords
outside lead
solder material
lead
metalized layer
space
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7448380A
Other languages
Japanese (ja)
Other versions
JPS6129547B2 (en
Inventor
Shinzo Anazawa
Hideaki Kozu
Akiyoshi Okamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyoto Ceramic Co Ltd
Kyocera Corp
NEC Corp
Original Assignee
Kyoto Ceramic Co Ltd
Kyocera Corp
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyoto Ceramic Co Ltd, Kyocera Corp, NEC Corp, Nippon Electric Co Ltd filed Critical Kyoto Ceramic Co Ltd
Priority to JP7448380A priority Critical patent/JPS571250A/en
Publication of JPS571250A publication Critical patent/JPS571250A/en
Publication of JPS6129547B2 publication Critical patent/JPS6129547B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals

Abstract

PURPOSE:To enlarge intensity of adhesion of an outside lead to a substrate by a method wherein a solder material is filled up in the space on the outside lead side as to have a chevron type sectional area making the contact face between the solder material and a metalized layer as the bottom face, and a nonfilled part with solder is provided in the space between the free end side of the outside lead and the metalized layer. CONSTITUTION:The metalized layer 2 is led out at the circumference of the upper face of the ceramic substrate 1, and surface treatment is performed on the surface thereof. A bending part 3' is formed in the outside lead 3, and when soldering is to be performed, the solder material 4 is filled up on the outside lead 3 side as to have the chevron type sectional area making the contact face between the solder material 4 and the metalized layer 2 as the bottom face, and the nonfilled part 5 is formed in the space between the free end side of the outside lead 3 and the solder material 4 in the gap formed by the lead 3. By this constitution, even when exteral force F1 being in a right-angled direction to the lead 3 or external force F2 being in the horizontal direction is increased, the metalized layer 2 is not peeled off from the ceramic substrate 1.
JP7448380A 1980-06-03 1980-06-03 Equipping structure of outside lead Granted JPS571250A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7448380A JPS571250A (en) 1980-06-03 1980-06-03 Equipping structure of outside lead

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7448380A JPS571250A (en) 1980-06-03 1980-06-03 Equipping structure of outside lead

Publications (2)

Publication Number Publication Date
JPS571250A true JPS571250A (en) 1982-01-06
JPS6129547B2 JPS6129547B2 (en) 1986-07-07

Family

ID=13548562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7448380A Granted JPS571250A (en) 1980-06-03 1980-06-03 Equipping structure of outside lead

Country Status (1)

Country Link
JP (1) JPS571250A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6030550U (en) * 1983-08-09 1985-03-01 富士電機株式会社 semiconductor equipment
JPH0247058U (en) * 1988-09-27 1990-03-30
US5025348A (en) * 1987-11-20 1991-06-18 Casio Computer Co., Ltd. Bonding structure of an electronic device and a method for manufacturing the same
JP2015195237A (en) * 2014-03-31 2015-11-05 住友電工デバイス・イノベーション株式会社 Package for mounting electronic component

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6030550U (en) * 1983-08-09 1985-03-01 富士電機株式会社 semiconductor equipment
US5025348A (en) * 1987-11-20 1991-06-18 Casio Computer Co., Ltd. Bonding structure of an electronic device and a method for manufacturing the same
JPH0247058U (en) * 1988-09-27 1990-03-30
JP2015195237A (en) * 2014-03-31 2015-11-05 住友電工デバイス・イノベーション株式会社 Package for mounting electronic component

Also Published As

Publication number Publication date
JPS6129547B2 (en) 1986-07-07

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