JPS5735363A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5735363A JPS5735363A JP11028180A JP11028180A JPS5735363A JP S5735363 A JPS5735363 A JP S5735363A JP 11028180 A JP11028180 A JP 11028180A JP 11028180 A JP11028180 A JP 11028180A JP S5735363 A JPS5735363 A JP S5735363A
- Authority
- JP
- Japan
- Prior art keywords
- spacer
- copper
- insulating spacer
- contacted
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE:To prevent the gap between an insulating spacer and a spacer which is compressed by said insulating spacer due to a foreign material by providing a part made of soft metal at the end surface of the insulating spacer. CONSTITUTION:Heat radiating fins 6 for cooling are contacted with a semiconductor element 4. Wiring copper conductors 3 are contacted with the fins 4. Ceramic insulating spacers 1 are contacted with the conductors 3. Copper spacers 9 are provided between said insulating spacer 1 and a stack supporting part 2, and between the insulating spacer 1 and a spring supporting part 2. By holding both sides of the insulting spacer 1 with soft copper parts, the contact surface is kept in good condition even though the copper is deformed by the foreign material, and the crack of the ceramic spacer can be prevented.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11028180A JPS5846177B2 (en) | 1980-08-13 | 1980-08-13 | semiconductor equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11028180A JPS5846177B2 (en) | 1980-08-13 | 1980-08-13 | semiconductor equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5735363A true JPS5735363A (en) | 1982-02-25 |
JPS5846177B2 JPS5846177B2 (en) | 1983-10-14 |
Family
ID=14531706
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11028180A Expired JPS5846177B2 (en) | 1980-08-13 | 1980-08-13 | semiconductor equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5846177B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6079752U (en) * | 1983-11-08 | 1985-06-03 | 株式会社東芝 | Power semiconductor stack |
JPS60169660A (en) * | 1984-02-14 | 1985-09-03 | Nippon Mining Co Ltd | Combustivity improving method for diesel engine fuel |
JP2017188622A (en) * | 2016-04-08 | 2017-10-12 | 東芝三菱電機産業システム株式会社 | Semiconductor device |
-
1980
- 1980-08-13 JP JP11028180A patent/JPS5846177B2/en not_active Expired
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6079752U (en) * | 1983-11-08 | 1985-06-03 | 株式会社東芝 | Power semiconductor stack |
JPS60169660A (en) * | 1984-02-14 | 1985-09-03 | Nippon Mining Co Ltd | Combustivity improving method for diesel engine fuel |
JPH0448938B2 (en) * | 1984-02-14 | 1992-08-10 | Nippon Mining Co | |
JP2017188622A (en) * | 2016-04-08 | 2017-10-12 | 東芝三菱電機産業システム株式会社 | Semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPS5846177B2 (en) | 1983-10-14 |
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