JPS5747323A - Epoxy resin composition having improved resistance to hot water at high temperature - Google Patents

Epoxy resin composition having improved resistance to hot water at high temperature

Info

Publication number
JPS5747323A
JPS5747323A JP12310180A JP12310180A JPS5747323A JP S5747323 A JPS5747323 A JP S5747323A JP 12310180 A JP12310180 A JP 12310180A JP 12310180 A JP12310180 A JP 12310180A JP S5747323 A JPS5747323 A JP S5747323A
Authority
JP
Japan
Prior art keywords
epoxy resin
high temperature
hot water
resin composition
agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12310180A
Other languages
Japanese (ja)
Inventor
Masahito Shimizu
Shigeru Katayama
Hiroshi Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP12310180A priority Critical patent/JPS5747323A/en
Publication of JPS5747323A publication Critical patent/JPS5747323A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: The titled epoxy resin composition, capable of giving a cured article without deteriorating the adhesive strength even under severe conditions, e.g. high temperature, high humidity and hot water at a high temperature, and prepared by adding finely powdered dicyandiamide as a curing agent and a silane coupling agent, etc. to an epoxy resin.
CONSTITUTION: A composition prepared by incorporating an epoxy resin, e.g. bisphenol epoxy resin, with (A) finely powdered dicyandiamide containing 90wt% or more particles having a particle diameter ≤5μ as a curing agent, (B) a silane coupling agent, e.g. a silane compound of the formula XSiY3 (X is an unhydrolyzable organic group, e.g. vinyl group; Y is hydrolyzable group, e.g. halogen), (C) a curing accelerator, e.g. a tetraalkylguanidine, and (D) an additive, e.g. an inorganic filler or metallic powder. The amounts of the components (A), (B) and (C) are preferably 4W12pts.wt., 0.1W3pts.wt. and 0.1W10pts.wt. based on 100pts.wt. epoxy resin respectively.
USE: An adhesive, coating material, coating agent, a plastic solder, etc.
COPYRIGHT: (C)1982,JPO&Japio
JP12310180A 1980-09-04 1980-09-04 Epoxy resin composition having improved resistance to hot water at high temperature Pending JPS5747323A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12310180A JPS5747323A (en) 1980-09-04 1980-09-04 Epoxy resin composition having improved resistance to hot water at high temperature

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12310180A JPS5747323A (en) 1980-09-04 1980-09-04 Epoxy resin composition having improved resistance to hot water at high temperature

Publications (1)

Publication Number Publication Date
JPS5747323A true JPS5747323A (en) 1982-03-18

Family

ID=14852214

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12310180A Pending JPS5747323A (en) 1980-09-04 1980-09-04 Epoxy resin composition having improved resistance to hot water at high temperature

Country Status (1)

Country Link
JP (1) JPS5747323A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61211406A (en) * 1985-03-18 1986-09-19 日立造船株式会社 Flutter preventing apparatus of plate girder suspension bride
JPS61285267A (en) * 1985-06-12 1986-12-16 Toray Ind Inc Coating composition
JPS62253507A (en) * 1986-04-28 1987-11-05 Kayaba Ind Co Ltd Method of regulating damping force and device therefor
JPS62253506A (en) * 1986-04-28 1987-11-05 Kayaba Ind Co Ltd Damping force control method for vehicle
JPS6356706U (en) * 1986-09-29 1988-04-15

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5359798A (en) * 1976-11-09 1978-05-29 Nitto Electric Ind Co Ltd Epoxy resin composition of excellent warm-water resistance

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5359798A (en) * 1976-11-09 1978-05-29 Nitto Electric Ind Co Ltd Epoxy resin composition of excellent warm-water resistance

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61211406A (en) * 1985-03-18 1986-09-19 日立造船株式会社 Flutter preventing apparatus of plate girder suspension bride
JPS61285267A (en) * 1985-06-12 1986-12-16 Toray Ind Inc Coating composition
JPS62253507A (en) * 1986-04-28 1987-11-05 Kayaba Ind Co Ltd Method of regulating damping force and device therefor
JPS62253506A (en) * 1986-04-28 1987-11-05 Kayaba Ind Co Ltd Damping force control method for vehicle
JPS6356706U (en) * 1986-09-29 1988-04-15
JPH0421848Y2 (en) * 1986-09-29 1992-05-19

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