JPS5745965A - Semiconductor element connecting substrate - Google Patents

Semiconductor element connecting substrate

Info

Publication number
JPS5745965A
JPS5745965A JP12150280A JP12150280A JPS5745965A JP S5745965 A JPS5745965 A JP S5745965A JP 12150280 A JP12150280 A JP 12150280A JP 12150280 A JP12150280 A JP 12150280A JP S5745965 A JPS5745965 A JP S5745965A
Authority
JP
Japan
Prior art keywords
substrate
pad
element connecting
transparent
sio2
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12150280A
Other languages
Japanese (ja)
Inventor
Katsuhiko Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP12150280A priority Critical patent/JPS5745965A/en
Publication of JPS5745965A publication Critical patent/JPS5745965A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To obtain a semiconductor element connecting substrate inexpensively in high yield by superposing an intimately contacting metal and a barrier metal on a transparent insulator substrate having an optically planar surface to form conductor wires and covering the substrate with an SiO2 while maintaining transparent except the pad of the conductor wires. CONSTITUTION:Ti 8 is deposited on a quartz substrate 7 having an optically planar surface, a barrier metal 9, e.g., Cu or the like is deposited on the substrate, is etched in desired dimension and shape, and wires are formed. Then, an SiO2 10 is grown in gas phase on the overall srface, is etched to expose the internal pad, Au is then plated to form a bump 11. Since a fine pattern can be formed by a photographic etching method and the substrate 7 is further transparent, the pad of the element and the pad of the sbustrate can be acculately aligned, thereby improving the connecting accuracy. With this configuration the element connecting substrate with pads of more than 200 pins can be stably obtained in high yield.
JP12150280A 1980-09-02 1980-09-02 Semiconductor element connecting substrate Pending JPS5745965A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12150280A JPS5745965A (en) 1980-09-02 1980-09-02 Semiconductor element connecting substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12150280A JPS5745965A (en) 1980-09-02 1980-09-02 Semiconductor element connecting substrate

Publications (1)

Publication Number Publication Date
JPS5745965A true JPS5745965A (en) 1982-03-16

Family

ID=14812768

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12150280A Pending JPS5745965A (en) 1980-09-02 1980-09-02 Semiconductor element connecting substrate

Country Status (1)

Country Link
JP (1) JPS5745965A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61170840U (en) * 1985-04-05 1986-10-23
JPS63172810A (en) * 1987-01-13 1988-07-16 Rinnai Corp Forced draft type burner
KR100339016B1 (en) * 1998-10-02 2002-10-25 한국과학기술원 multi-chip package of millimeter wave band using quartz base

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61170840U (en) * 1985-04-05 1986-10-23
JPS63172810A (en) * 1987-01-13 1988-07-16 Rinnai Corp Forced draft type burner
JPH0445724B2 (en) * 1987-01-13 1992-07-27 Rinnai Kk
KR100339016B1 (en) * 1998-10-02 2002-10-25 한국과학기술원 multi-chip package of millimeter wave band using quartz base

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