JPS5736833A - Cleaning of wafer - Google Patents

Cleaning of wafer

Info

Publication number
JPS5736833A
JPS5736833A JP11172380A JP11172380A JPS5736833A JP S5736833 A JPS5736833 A JP S5736833A JP 11172380 A JP11172380 A JP 11172380A JP 11172380 A JP11172380 A JP 11172380A JP S5736833 A JPS5736833 A JP S5736833A
Authority
JP
Japan
Prior art keywords
wafer
clean
chuck
drying
dried
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11172380A
Other languages
Japanese (ja)
Inventor
Haruo Amada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11172380A priority Critical patent/JPS5736833A/en
Publication of JPS5736833A publication Critical patent/JPS5736833A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3046—Mechanical treatment, e.g. grinding, polishing, cutting using blasting, e.g. sand-blasting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

PURPOSE:To improve the quality and yield of a wafer by a wafer cleaning apparatus which has a loader for supplying the wafer, a clean tunnel unit for conveying it in a clean atmosphere, a unit for washing and rotatably drying the wafer, and a microwave heater for completely drying it. CONSTITUTION:A cartridge 7 containing wafers 6 is charged into a clean loader chamber 11, wafers are supplied one by one, and are conveyed in a direction C1. The wafer is then introduced through a clean tunnel 21 in the clean atmosphere and is set on a wafer chuck 24 of a washing and rotatably drying unit. After water 25 is supplied from a cleaning nozzle 30 and the wafer is washed, the chuck 24 is rotated at a high speed, and the wafer is thus dried from water. After completion, the wafer is set via a conveyor belt 22 on the chuck of the next drying chamber, and is completely dried by microwave induction heating with a magnetron. In this manner, the wafer can be cleaned and dried completely, thereby improving the quality and the yield of the characteristics of a semiconductor device.
JP11172380A 1980-08-15 1980-08-15 Cleaning of wafer Pending JPS5736833A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11172380A JPS5736833A (en) 1980-08-15 1980-08-15 Cleaning of wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11172380A JPS5736833A (en) 1980-08-15 1980-08-15 Cleaning of wafer

Publications (1)

Publication Number Publication Date
JPS5736833A true JPS5736833A (en) 1982-02-27

Family

ID=14568524

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11172380A Pending JPS5736833A (en) 1980-08-15 1980-08-15 Cleaning of wafer

Country Status (1)

Country Link
JP (1) JPS5736833A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5935568A (en) * 1982-08-18 1984-02-27 Mitsubishi Electric Corp Inverter device of dc bus type
JPS5994840A (en) * 1982-11-22 1984-05-31 Hitachi Plant Eng & Constr Co Ltd Wafer conveying device
US4546423A (en) * 1982-02-23 1985-10-08 Tokyo Shibaura Denki Kabushiki Kaisha Multiple inverters with overcurrent and shoot-through protection
JPS62192637U (en) * 1986-05-28 1987-12-08
JPH01179422A (en) * 1988-01-08 1989-07-17 Shimada Phys & Chem Ind Co Ltd Double side cleaner

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5269557A (en) * 1975-12-08 1977-06-09 Mitsubishi Electric Corp Processing method of semiconductor wafer
JPS5473475A (en) * 1977-11-24 1979-06-12 Hitachi Ltd Device for washing and drying

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5269557A (en) * 1975-12-08 1977-06-09 Mitsubishi Electric Corp Processing method of semiconductor wafer
JPS5473475A (en) * 1977-11-24 1979-06-12 Hitachi Ltd Device for washing and drying

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4546423A (en) * 1982-02-23 1985-10-08 Tokyo Shibaura Denki Kabushiki Kaisha Multiple inverters with overcurrent and shoot-through protection
JPS5935568A (en) * 1982-08-18 1984-02-27 Mitsubishi Electric Corp Inverter device of dc bus type
JPS5994840A (en) * 1982-11-22 1984-05-31 Hitachi Plant Eng & Constr Co Ltd Wafer conveying device
JPS62192637U (en) * 1986-05-28 1987-12-08
JPH01179422A (en) * 1988-01-08 1989-07-17 Shimada Phys & Chem Ind Co Ltd Double side cleaner

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