JPS5728359A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5728359A
JPS5728359A JP10342180A JP10342180A JPS5728359A JP S5728359 A JPS5728359 A JP S5728359A JP 10342180 A JP10342180 A JP 10342180A JP 10342180 A JP10342180 A JP 10342180A JP S5728359 A JPS5728359 A JP S5728359A
Authority
JP
Japan
Prior art keywords
layer
substrate
electrode
metallic layer
auzn
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10342180A
Other languages
Japanese (ja)
Inventor
Masahiro Morimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP10342180A priority Critical patent/JPS5728359A/en
Publication of JPS5728359A publication Critical patent/JPS5728359A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/45Ohmic electrodes
    • H01L29/456Ohmic electrodes on silicon

Abstract

PURPOSE:To prevent the separation of an ohmic electrode by forming a first metallic layer ohmically contacting with the surface of a semiconcuctor substrate or a semiconductor layer and by providing a second metallic layer on the first metallic layer and around the circumference of the first layer. CONSTITUTION:On an Si or compound semiconductor substrate 14, an SiO2 film 15 and an opening 16 are formed. Then, a metallic layer 17 of, for example, AuZn or AuSn etc is evaporatd on the substrae. Next, the metallic layer 17 is etched to form an electrode 17a and then Ti, Pt, Au are evaporated successively to obtain a metal covered layer 18. For example, in a semiconductor laser formed by depositing epitaxial layers 6-9 on an N type 1nP substrate 5, and AuZn electrode 11 is provided on a Zn-diffused layer 10 and the substrate back face, and then a Ti-Pt-Au layer 13 is formed on the substrate top face, obtaining an ohmic electrode. The stickness of the Ti layers on the electrodes 11, 17a is highly improved, so that almost no separation occurs on the electrode.
JP10342180A 1980-07-28 1980-07-28 Semiconductor device Pending JPS5728359A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10342180A JPS5728359A (en) 1980-07-28 1980-07-28 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10342180A JPS5728359A (en) 1980-07-28 1980-07-28 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5728359A true JPS5728359A (en) 1982-02-16

Family

ID=14353567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10342180A Pending JPS5728359A (en) 1980-07-28 1980-07-28 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5728359A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4695869A (en) * 1983-05-31 1987-09-22 Kabushiki Kaisha Toshiba GAAS semiconductor device
JP2012123184A (en) * 2010-12-08 2012-06-28 Sumitomo Electric Ind Ltd Semiconductor optical modulation element and method for manufacturing the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53110465A (en) * 1977-03-09 1978-09-27 Nec Corp Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53110465A (en) * 1977-03-09 1978-09-27 Nec Corp Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4695869A (en) * 1983-05-31 1987-09-22 Kabushiki Kaisha Toshiba GAAS semiconductor device
JP2012123184A (en) * 2010-12-08 2012-06-28 Sumitomo Electric Ind Ltd Semiconductor optical modulation element and method for manufacturing the same

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