JPS57206055A - Cooling system for electronic device - Google Patents
Cooling system for electronic deviceInfo
- Publication number
- JPS57206055A JPS57206055A JP8957881A JP8957881A JPS57206055A JP S57206055 A JPS57206055 A JP S57206055A JP 8957881 A JP8957881 A JP 8957881A JP 8957881 A JP8957881 A JP 8957881A JP S57206055 A JPS57206055 A JP S57206055A
- Authority
- JP
- Japan
- Prior art keywords
- metal foil
- semiconductor devices
- protrusions
- substrate
- cooling water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE:To reduce thermal distortion by a method wherein protrusions are formed on the regions of a heat conducting plate that are not in contact with semiconductor devices. CONSTITUTION:Several semiconductor devices 10 are fixed face down to a substrate 9 by balls 11. The rear surface of the substrate 10 is plated with a metal film by evaporation and the metal film is provided with a piece of thin metal foil 13 exemplifiedly of Al or Cu with a solder layer 12 between. A cooling plate 14 and some cooling water channels 14a are provided on the other side of the metal foil 13. The parts of the metal foil 13 not in contact with the semiconductor devices 10 are provided with protrusions 15. Thermal distortion to be generated between the cooling water channels and the semiconductor devices is absorbed because of the employment of the metal foil 13 in the channels and the provision of protrusions in the metal foil 13 contributing to the reduction of stiffness.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8957881A JPS57206055A (en) | 1981-06-12 | 1981-06-12 | Cooling system for electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8957881A JPS57206055A (en) | 1981-06-12 | 1981-06-12 | Cooling system for electronic device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57206055A true JPS57206055A (en) | 1982-12-17 |
JPS6251498B2 JPS6251498B2 (en) | 1987-10-30 |
Family
ID=13974675
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8957881A Granted JPS57206055A (en) | 1981-06-12 | 1981-06-12 | Cooling system for electronic device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57206055A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4531146A (en) * | 1983-07-14 | 1985-07-23 | Cutchaw John M | Apparatus for cooling high-density integrated circuit packages |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6275599U (en) * | 1985-10-30 | 1987-05-14 | ||
JPS62174406A (en) * | 1986-01-28 | 1987-07-31 | 星和電機株式会社 | Power source built-in type spontaneous light guide mark |
JPH01106992U (en) * | 1988-01-06 | 1989-07-19 |
-
1981
- 1981-06-12 JP JP8957881A patent/JPS57206055A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4531146A (en) * | 1983-07-14 | 1985-07-23 | Cutchaw John M | Apparatus for cooling high-density integrated circuit packages |
Also Published As
Publication number | Publication date |
---|---|
JPS6251498B2 (en) | 1987-10-30 |
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