JPH05335452A - Hybrid integrated circuit device - Google Patents

Hybrid integrated circuit device

Info

Publication number
JPH05335452A
JPH05335452A JP4161771A JP16177192A JPH05335452A JP H05335452 A JPH05335452 A JP H05335452A JP 4161771 A JP4161771 A JP 4161771A JP 16177192 A JP16177192 A JP 16177192A JP H05335452 A JPH05335452 A JP H05335452A
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
hybrid integrated
opening
metal plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4161771A
Other languages
Japanese (ja)
Other versions
JP2748778B2 (en
Inventor
Koji Okada
康治 岡田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP4161771A priority Critical patent/JP2748778B2/en
Publication of JPH05335452A publication Critical patent/JPH05335452A/en
Application granted granted Critical
Publication of JP2748778B2 publication Critical patent/JP2748778B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Abstract

PURPOSE:To provide a hybrid integrated circuit device in which heat dissipation of a molded IC surface-mounted in an opening of a circuit board is improved. CONSTITUTION:The hybrid integrated circuit device comprises a circuit board 1 partly provided with an opening 1a and adhered with a metal plate 2 on its one side surface, a molded IC 5 of a surface mounting type so placed as to be dropped in the opening 1a of the board 1, and heat dissipating grease 3 filled in a gap between the IC 5 and the plate 2. Heat generated from the IC 5 is transferred to the plate 2 through the grease 3 and dissipated from the plate 2.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は混成集積回路装置に関
し、特に表面実装タイプのモールドＩＣを基板上に搭載
する混成集積回路装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device, and more particularly to a hybrid integrated circuit device having a surface mount type molded IC mounted on a substrate.

【０００２】[0002]

【従来の技術】従来のこの種の混成集積回路装置では、
その厚さ寸法を低減するために、図３に一例を示すよう
に、例えばガラスエポキシを使用した配線基板１に開口
部１ａを設け、この開口部１ａ内にリード成形した表面
実装タイプのモールドＩＣ５を落とし入れている。そし
て、開口部上の両側にある例えばＣｕを材質とした部品
搭載ランド６にはんだペースト４を使用してモールドＩ
Ｃ５のリード５ａを接続する構造がとられている。2. Description of the Related Art In a conventional hybrid integrated circuit device of this type,
In order to reduce the thickness dimension, as shown in FIG. 3, for example, a wiring board 1 made of glass epoxy is provided with an opening 1a, and lead molding is performed in the opening 1a to form a surface mount type molded IC 5 Is dropping. Then, the solder paste 4 is used on the component mounting lands 6 made of, for example, Cu on both sides of the opening to mold I.
The structure is such that the lead 5a of C5 is connected.

【０００３】[0003]

【発明が解決しようとする課題】上述した従来の混成集
積回路装置は、配線基板１の開口部内に表面実装タイプ
のモールドＩＣ５を落とし入れて搭載しているために、
モールドＩＣ５の周囲は空気に囲まれた状態となる。一
般に空気は熱伝導率が悪いために、モールドＩＣ５で発
生した熱が効率良く放熱されないという問題点があっ
た。本発明の目的は、表面実装されたモールドＩＣの放
熱性を改善した混成集積回路装置を提供することにあ
る。In the above-mentioned conventional hybrid integrated circuit device, the surface mount type mold IC 5 is dropped and mounted in the opening of the wiring board 1.
The mold IC 5 is surrounded by air. Generally, air has a poor thermal conductivity, so that the heat generated in the mold IC 5 is not efficiently dissipated. An object of the present invention is to provide a hybrid integrated circuit device in which the heat dissipation of the surface mounted mold IC is improved.

【０００４】[0004]

【課題を解決するための手段】本発明は、一部に開口部
が設けられ、かつその片面に金属板が貼付けられた配線
基板と、この配線基板の開口部内に落とし入れるように
して搭載した表面実装タイプのモールドＩＣと、このモ
ールドＩＣと前記金属板との隙間に充填した放熱用グリ
ースとで構成される。According to the present invention, a wiring board having an opening formed in a part thereof and a metal plate attached to one surface thereof and a wiring board mounted so as to be dropped into the opening of the wiring board are mounted. It is composed of a surface mount type mold IC and a heat dissipation grease filled in a gap between the mold IC and the metal plate.

【０００５】[0005]

【実施例】次に、本発明について図面を参照して説明す
る。図１は本発明の第１の実施例の断面図である。同図
のように配線基板１の一部には開口部１ａが設けてあ
り、この開口部１ａ内に表面実装タイプのモールドＩＣ
５の一部或いは全体がリード５ａの先端部より下に位置
するように落とし入れ、かつそのリード５ａを配線基板
１に設けた部品搭載ランド６にはんだペースト４を使用
して接続する。又、前記配線基板１の反対側の表面に
は、前記開口部１ａを含む領域にわたって金属板２を貼
付けており、かつ前記開口部１ａ内においては前記金属
板２と前記モールドＩＣ５との隙間に放熱用グリース３
を充填させている。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. FIG. 1 is a sectional view of the first embodiment of the present invention. As shown in the figure, an opening 1a is provided in a part of the wiring board 1, and a surface mounting type molded IC is provided in the opening 1a.
Part or all of the lead 5 is dropped so as to be located below the tip of the lead 5a, and the lead 5a is connected to the component mounting land 6 provided on the wiring board 1 by using the solder paste 4. Further, a metal plate 2 is attached to a surface on the opposite side of the wiring board 1 over a region including the opening 1a, and a gap between the metal plate 2 and the mold IC 5 is provided in the opening 1a. Heat dissipation grease 3
Is being filled.

【０００６】このため、モールドＩＣ５で発生した熱
は、放熱用グリース３を通して金属板２に伝達され、こ
の金属板２の表面から効率良く放熱されることになる。
尚、この構造においても金属板２を薄くすることによ
り、混成集積回路装置全体としての厚さは従来レベルに
抑えることができる。Therefore, the heat generated in the mold IC 5 is transferred to the metal plate 2 through the heat dissipation grease 3 and is efficiently dissipated from the surface of the metal plate 2.
Even in this structure, the thickness of the hybrid integrated circuit device as a whole can be suppressed to the conventional level by thinning the metal plate 2.

【０００７】図２は本発明の第２の実施例の断面図であ
り、図１と同一部分には同一符号を付してある。同図の
ように、配線基板１に貼付けた金属板２の表面には凹凸
の溝７を設けて金属板２の表面積を増加させ、放熱効果
を向上させている。又、図示は省略するが、金属板２の
表面に黒色の塗装膜を設けることにより、更に放熱性を
向上させることができる。尚、この構造においても、混
成集積回路装置全体としての厚さ寸法は、金属板２の厚
みを調整することにより、10％程度の増加で抑えること
ができる。FIG. 2 is a sectional view of a second embodiment of the present invention, in which the same parts as those in FIG. 1 are designated by the same reference numerals. As shown in the figure, the surface of the metal plate 2 attached to the wiring board 1 is provided with concave and convex grooves 7 to increase the surface area of the metal plate 2 and improve the heat dissipation effect. Although not shown in the drawing, the heat dissipation can be further improved by providing a black coating film on the surface of the metal plate 2. Even in this structure, the thickness of the hybrid integrated circuit device as a whole can be suppressed by about 10% by adjusting the thickness of the metal plate 2.

【０００８】[0008]

【発明の効果】以上説明したように本発明は、配線基板
に設けられた開口部内に搭載されたモールドＩＣと、配
線基板の片面に貼付けられた金属板との間に放熱用グリ
ースを充填しているので、モールドＩＣで発生した熱が
放熱用グリースを通して金属板に伝達され、この金属板
から効率良く放熱されるので、混成集積回路装置の放熱
効果を高めることができるという効果を有する。As described above, according to the present invention, the heat dissipation grease is filled between the mold IC mounted in the opening provided in the wiring board and the metal plate attached to one surface of the wiring board. Therefore, the heat generated in the mold IC is transferred to the metal plate through the heat dissipation grease and is efficiently dissipated from the metal plate, so that the heat dissipation effect of the hybrid integrated circuit device can be enhanced.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の混成集積回路装置の第１実施例の断面
図である。FIG. 1 is a cross-sectional view of a first embodiment of a hybrid integrated circuit device of the present invention.

【図２】本発明の混成集積回路装置の第２実施例の断面
図である。FIG. 2 is a sectional view of a second embodiment of the hybrid integrated circuit device of the present invention.

【図３】従来の混成集積回路装置の一例の断面図であ
る。FIG. 3 is a cross-sectional view of an example of a conventional hybrid integrated circuit device.

【符号の説明】[Explanation of symbols]

１ 配線基板 １ａ 開口部 ２ 金属板 ３ 放熱用グリース ５ モールドＩＣ ７ 溝 1 Wiring board 1a Opening 2 Metal plate 3 Heat dissipation grease 5 Molded IC 7 Groove

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】 一部に開口部が設けられ、かつその片面
に金属板が貼付けられた配線基板と、前記配線基板の開
口部内に落とし入れるようにして搭載した表面実装タイ
プのモールドＩＣと、前記モールドＩＣと前記金属板と
の隙間に充填した放熱用グリースとを備えることを特徴
とする混成集積回路装置。1. A wiring board having an opening provided in a part thereof and having a metal plate attached to one surface thereof, and a surface mount type molded IC mounted so as to be dropped into the opening of the wiring board. A hybrid integrated circuit device comprising: a heat dissipation grease filled in a gap between the mold IC and the metal plate.
JP4161771A 1992-05-29 1992-05-29 Hybrid integrated circuit device Expired - Lifetime JP2748778B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4161771A JP2748778B2 (en) 1992-05-29 1992-05-29 Hybrid integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4161771A JP2748778B2 (en) 1992-05-29 1992-05-29 Hybrid integrated circuit device

Publications (2)

Publication Number Publication Date
JPH05335452A true JPH05335452A (en) 1993-12-17
JP2748778B2 JP2748778B2 (en) 1998-05-13

Family

ID=15741593

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4161771A Expired - Lifetime JP2748778B2 (en) 1992-05-29 1992-05-29 Hybrid integrated circuit device

Country Status (1)

Country Link
JP (1) JP2748778B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0766506A2 (en) * 1995-09-29 1997-04-02 Allen-Bradley Company, Inc. A multilayer circuit board having a window exposing an enhanced conductive layer for use as an insulated mounting area
US7057891B2 (en) 2003-05-19 2006-06-06 Denso Corporation Heat dissipation structure
JP2007234886A (en) * 2006-03-01 2007-09-13 Compal Communications Inc Electronic element assembly with thermal dissipation constitution
CN110139462A (en) * 2018-02-09 2019-08-16 深南电路股份有限公司 A kind of printed circuit board and preparation method thereof and electronic device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0766506A2 (en) * 1995-09-29 1997-04-02 Allen-Bradley Company, Inc. A multilayer circuit board having a window exposing an enhanced conductive layer for use as an insulated mounting area
EP0766506A3 (en) * 1995-09-29 1998-12-23 Allen-Bradley Company, Inc. A multilayer circuit board having a window exposing an enhanced conductive layer for use as an insulated mounting area
US7057891B2 (en) 2003-05-19 2006-06-06 Denso Corporation Heat dissipation structure
JP2007234886A (en) * 2006-03-01 2007-09-13 Compal Communications Inc Electronic element assembly with thermal dissipation constitution
CN110139462A (en) * 2018-02-09 2019-08-16 深南电路股份有限公司 A kind of printed circuit board and preparation method thereof and electronic device

Also Published As

Publication number Publication date
JP2748778B2 (en) 1998-05-13

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