JPS57190768A - Soldering method for parts - Google Patents

Soldering method for parts

Info

Publication number
JPS57190768A
JPS57190768A JP7521981A JP7521981A JPS57190768A JP S57190768 A JPS57190768 A JP S57190768A JP 7521981 A JP7521981 A JP 7521981A JP 7521981 A JP7521981 A JP 7521981A JP S57190768 A JPS57190768 A JP S57190768A
Authority
JP
Japan
Prior art keywords
solder
grooves
soldering
central
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7521981A
Other languages
Japanese (ja)
Other versions
JPS6023906B2 (en
Inventor
Harumi Aoki
Shiyouei Sakashi
Kazumine Koshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP7521981A priority Critical patent/JPS6023906B2/en
Publication of JPS57190768A publication Critical patent/JPS57190768A/en
Publication of JPS6023906B2 publication Critical patent/JPS6023906B2/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To improve the reliability and productivity of soldering of electronic parts by disposing plural pieces of grooves which are finer in the peripheral directions than in the central direction of a soldering part, radially from the recess provided in a part mounting member and supplying molten solder from said recess along the grooves to the soldering part. CONSTITUTION:Ball solder 8 is placed in a recess 9 and is heated to allow molten solder 7 to advance along grooves 10, 12 by capillarity, so that the entire part of the solder is conducted in the circtuion of the grooves 10, 12. When the solder 7 arrives at a soldering part 1, it is similarly spread over the entire part of the soldering part by capillarity. Since the groove 10 in the central direction is made larger than the grooves 12 in the peripheral direction, the velocity v1 in the groove in the central part where the solder 7 flows is higher than the velocity v2 in the grooves 12 in the peripheral parts. As a result, air is expelled by spreading the solder 7 always from the central part to the outside parts and therefore the soldering part 11 can be soldered with extremely less voides despite its large area. Here, 1 in the figure denotes a power transistor, 3 a heat diffusion plate and 5 a heat radiation plate, respectively.
JP7521981A 1981-05-18 1981-05-18 How to solder parts Expired JPS6023906B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7521981A JPS6023906B2 (en) 1981-05-18 1981-05-18 How to solder parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7521981A JPS6023906B2 (en) 1981-05-18 1981-05-18 How to solder parts

Publications (2)

Publication Number Publication Date
JPS57190768A true JPS57190768A (en) 1982-11-24
JPS6023906B2 JPS6023906B2 (en) 1985-06-10

Family

ID=13569882

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7521981A Expired JPS6023906B2 (en) 1981-05-18 1981-05-18 How to solder parts

Country Status (1)

Country Link
JP (1) JPS6023906B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4995546A (en) * 1988-03-31 1991-02-26 Bt&D Technologies Limited Device mounting
US5727727A (en) * 1995-02-02 1998-03-17 Vlt Corporation Flowing solder in a gap
US5808358A (en) * 1994-11-10 1998-09-15 Vlt Corporation Packaging electrical circuits

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6218803U (en) * 1985-07-17 1987-02-04
JPH05967Y2 (en) * 1985-08-02 1993-01-12
JPS62140201A (en) * 1985-12-13 1987-06-23 Matsushita Electric Ind Co Ltd Rotating head device
JPS62234202A (en) * 1986-04-04 1987-10-14 Akai Electric Co Ltd Rotary magnetic head device
JPS63200303A (en) * 1987-02-13 1988-08-18 Pioneer Electronic Corp Rotary magnetic head mechanism
JPS63200204U (en) * 1987-06-15 1988-12-23
JPH0185910U (en) * 1987-11-27 1989-06-07

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4995546A (en) * 1988-03-31 1991-02-26 Bt&D Technologies Limited Device mounting
US5808358A (en) * 1994-11-10 1998-09-15 Vlt Corporation Packaging electrical circuits
US5906310A (en) * 1994-11-10 1999-05-25 Vlt Corporation Packaging electrical circuits
US6096981A (en) * 1994-11-10 2000-08-01 Vlt Corporation Packaging electrical circuits
US6119923A (en) * 1994-11-10 2000-09-19 Vlt Corporation Packaging electrical circuits
US6159772A (en) * 1994-11-10 2000-12-12 Vlt Corporation Packaging electrical circuits
US5727727A (en) * 1995-02-02 1998-03-17 Vlt Corporation Flowing solder in a gap

Also Published As

Publication number Publication date
JPS6023906B2 (en) 1985-06-10

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