JPS53125770A - Mounting method of semiconductor element to heat sink - Google Patents
Mounting method of semiconductor element to heat sinkInfo
- Publication number
- JPS53125770A JPS53125770A JP4052477A JP4052477A JPS53125770A JP S53125770 A JPS53125770 A JP S53125770A JP 4052477 A JP4052477 A JP 4052477A JP 4052477 A JP4052477 A JP 4052477A JP S53125770 A JPS53125770 A JP S53125770A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- semiconductor element
- mounting method
- adhere
- press
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE: To press-adhere a element by heating and melting a metal of low melting point on a heat sink with laser light.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4052477A JPS53125770A (en) | 1977-04-08 | 1977-04-08 | Mounting method of semiconductor element to heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4052477A JPS53125770A (en) | 1977-04-08 | 1977-04-08 | Mounting method of semiconductor element to heat sink |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS53125770A true JPS53125770A (en) | 1978-11-02 |
Family
ID=12582877
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4052477A Pending JPS53125770A (en) | 1977-04-08 | 1977-04-08 | Mounting method of semiconductor element to heat sink |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53125770A (en) |
-
1977
- 1977-04-08 JP JP4052477A patent/JPS53125770A/en active Pending
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