JPS57190333A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS57190333A JPS57190333A JP7588681A JP7588681A JPS57190333A JP S57190333 A JPS57190333 A JP S57190333A JP 7588681 A JP7588681 A JP 7588681A JP 7588681 A JP7588681 A JP 7588681A JP S57190333 A JPS57190333 A JP S57190333A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- pad
- insulation film
- substrate
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05541—Structure
- H01L2224/05548—Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05556—Shape in side view
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7588681A JPS57190333A (en) | 1981-05-20 | 1981-05-20 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7588681A JPS57190333A (en) | 1981-05-20 | 1981-05-20 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57190333A true JPS57190333A (en) | 1982-11-22 |
Family
ID=13589219
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7588681A Pending JPS57190333A (en) | 1981-05-20 | 1981-05-20 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57190333A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60150678A (ja) * | 1984-01-18 | 1985-08-08 | Mitsubishi Electric Corp | 半導体装置の入力保護回路 |
JPS61198765A (ja) * | 1985-02-28 | 1986-09-03 | Nippon Denso Co Ltd | 半導体装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5146069A (ja) * | 1974-10-18 | 1976-04-20 | Hitachi Ltd | Handotaisochi |
-
1981
- 1981-05-20 JP JP7588681A patent/JPS57190333A/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5146069A (ja) * | 1974-10-18 | 1976-04-20 | Hitachi Ltd | Handotaisochi |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60150678A (ja) * | 1984-01-18 | 1985-08-08 | Mitsubishi Electric Corp | 半導体装置の入力保護回路 |
JPS61198765A (ja) * | 1985-02-28 | 1986-09-03 | Nippon Denso Co Ltd | 半導体装置 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS56162864A (en) | Semiconductor device | |
JPS5756958A (en) | Semiconductor device | |
JPS57190333A (en) | Semiconductor device | |
JPS56115557A (en) | Manufacture of semiconductor device | |
JPS57106084A (en) | Amorphous silicon diode | |
JPS57162360A (en) | Complementary insulated gate field effect semiconductor device | |
JPS56100441A (en) | Semiconductor ic device with protection element and manufacture thereof | |
JPS54128296A (en) | Wiring structure and its manufacture | |
JPS57202776A (en) | Semiconductor device | |
JPS57180158A (en) | Input protector for complementary mos integrated circuit | |
JPS5427382A (en) | Semiconductor integrated circuit device | |
JPS55108771A (en) | Semiconductor device | |
JPS55110056A (en) | Semiconductor device | |
JPS5399782A (en) | Semiconductor integrated circuit device and its manufacture | |
JPS57162356A (en) | Integrated circuit device | |
JPS5565470A (en) | Mos integrated circuit | |
JPS57211782A (en) | Semiconductor device | |
JPS647550A (en) | Semiconductor device | |
JPS54160186A (en) | Semiconductor integrated circuit device | |
JPS5410688A (en) | Production of semiconductor device | |
JPS52109370A (en) | Semiconductor device | |
JPS5289476A (en) | Semiconductor device | |
JPS55130145A (en) | Semiconductor integrated circuit device | |
JPS57115858A (en) | Semiconductor device | |
JPS5740968A (en) | Semiconductor device |