JPS57180133A - Semiconductor device and manufacture thereof - Google Patents

Semiconductor device and manufacture thereof

Info

Publication number
JPS57180133A
JPS57180133A JP6553881A JP6553881A JPS57180133A JP S57180133 A JPS57180133 A JP S57180133A JP 6553881 A JP6553881 A JP 6553881A JP 6553881 A JP6553881 A JP 6553881A JP S57180133 A JPS57180133 A JP S57180133A
Authority
JP
Japan
Prior art keywords
spraying method
plasma jet
insulation film
flame spraying
jet flame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6553881A
Other languages
Japanese (ja)
Other versions
JPS6322455B2 (en
Inventor
Hideo Ishii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP6553881A priority Critical patent/JPS57180133A/en
Publication of JPS57180133A publication Critical patent/JPS57180133A/en
Publication of JPS6322455B2 publication Critical patent/JPS6322455B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE:To form a thick cover insulation film at low temperature in a shor time by covering the surface of a functional element containing wiring by the cover insulation film formed by plasma jet flame spraying method. CONSTITUTION:A functional element such as MIS transistor 8 is covered by a cover insulation film 15 formed by plasma jet flame spraying method. The temperature of a treated substrate rises only about 10-100 deg.C and accumulation speed is also very high with this plasma jet flame spraying method, so that thick insulation layer can be accumulated and formed without generation of hillock in Al wiring and diffusion of Al into a semiconductor layer.
JP6553881A 1981-04-30 1981-04-30 Semiconductor device and manufacture thereof Granted JPS57180133A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6553881A JPS57180133A (en) 1981-04-30 1981-04-30 Semiconductor device and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6553881A JPS57180133A (en) 1981-04-30 1981-04-30 Semiconductor device and manufacture thereof

Publications (2)

Publication Number Publication Date
JPS57180133A true JPS57180133A (en) 1982-11-06
JPS6322455B2 JPS6322455B2 (en) 1988-05-12

Family

ID=13289886

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6553881A Granted JPS57180133A (en) 1981-04-30 1981-04-30 Semiconductor device and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS57180133A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006266500A (en) * 2005-03-24 2006-10-05 Leica Microsystems (Schweiz) Ag Fixing device for fixing component transmitting object vibration

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006266500A (en) * 2005-03-24 2006-10-05 Leica Microsystems (Schweiz) Ag Fixing device for fixing component transmitting object vibration

Also Published As

Publication number Publication date
JPS6322455B2 (en) 1988-05-12

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