JPS57176745A - Manufacture of multilayer wiring - Google Patents
Manufacture of multilayer wiringInfo
- Publication number
- JPS57176745A JPS57176745A JP6106781A JP6106781A JPS57176745A JP S57176745 A JPS57176745 A JP S57176745A JP 6106781 A JP6106781 A JP 6106781A JP 6106781 A JP6106781 A JP 6106781A JP S57176745 A JPS57176745 A JP S57176745A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- wiring
- lift
- multilayer wiring
- resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Drying Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE:To enable to form a wiring of multilayers in a multilayer wiring of a semiconductor integrated circuit device by reducing the width of the wire by a lift-off method, increasing the thickness of the wiring and flattening the upper surface of the wiring layer. CONSTITUTION:A conductor layer 3a and a resist layer 7a are laminated on an insulating of layer 2 on a semiconductor substrate 1, the layer 3a is patterned by a resist 7a, an insulating layer 4a is formed by low temperature chemical reaction such as an ERC type plasma accumulation method, is then lifted off, and a flat wiring surface is formed. After the layer 3a is etched, the resist mask 7a is used as a lift-off material to bury the insulating layer in the conductor layer, and the accumulation method having good directivity due to low temperature chemical reaction such as ERC type plasma accumulation method is used. Accordingly, the flatnes after the lift-off is improved, and the multilayer wiring can be formed by repeating the lamination of the insulating layer and the conductor layer similarly and the patterning of the layers.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6106781A JPS57176745A (en) | 1981-04-21 | 1981-04-21 | Manufacture of multilayer wiring |
US06/369,235 US4564997A (en) | 1981-04-21 | 1982-04-16 | Semiconductor device and manufacturing process thereof |
CA000401294A CA1204883A (en) | 1981-04-21 | 1982-04-20 | Semiconductor device and manufacturing process thereof |
EP82302044A EP0063917B1 (en) | 1981-04-21 | 1982-04-21 | Method of manufacturing a semiconductor device |
DE8282302044T DE3271995D1 (en) | 1981-04-21 | 1982-04-21 | Method of manufacturing a semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6106781A JPS57176745A (en) | 1981-04-21 | 1981-04-21 | Manufacture of multilayer wiring |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57176745A true JPS57176745A (en) | 1982-10-30 |
JPS639660B2 JPS639660B2 (en) | 1988-03-01 |
Family
ID=13160429
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6106781A Granted JPS57176745A (en) | 1981-04-21 | 1981-04-21 | Manufacture of multilayer wiring |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57176745A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63219140A (en) * | 1987-03-06 | 1988-09-12 | Matsushita Electronics Corp | Formation of multilayer interconnection of semiconductor element |
JPH04229625A (en) * | 1990-04-30 | 1992-08-19 | American Teleph & Telegr Co <Att> | Manufacture of semiconductor device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5495185A (en) * | 1978-01-13 | 1979-07-27 | Hitachi Ltd | Production of semiconductor device |
JPS5568655A (en) * | 1978-11-20 | 1980-05-23 | Fujitsu Ltd | Manufacturing method of wiring |
-
1981
- 1981-04-21 JP JP6106781A patent/JPS57176745A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5495185A (en) * | 1978-01-13 | 1979-07-27 | Hitachi Ltd | Production of semiconductor device |
JPS5568655A (en) * | 1978-11-20 | 1980-05-23 | Fujitsu Ltd | Manufacturing method of wiring |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63219140A (en) * | 1987-03-06 | 1988-09-12 | Matsushita Electronics Corp | Formation of multilayer interconnection of semiconductor element |
JPH04229625A (en) * | 1990-04-30 | 1992-08-19 | American Teleph & Telegr Co <Att> | Manufacture of semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPS639660B2 (en) | 1988-03-01 |
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