JPS57172731A - Position alignment device for mask substrate and wafer - Google Patents

Position alignment device for mask substrate and wafer

Info

Publication number
JPS57172731A
JPS57172731A JP56057906A JP5790681A JPS57172731A JP S57172731 A JPS57172731 A JP S57172731A JP 56057906 A JP56057906 A JP 56057906A JP 5790681 A JP5790681 A JP 5790681A JP S57172731 A JPS57172731 A JP S57172731A
Authority
JP
Japan
Prior art keywords
alignment reference
mask
reference points
substrate
time interval
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56057906A
Other languages
Japanese (ja)
Inventor
Toru Tojo
Toshiaki Shinozaki
Ichiro Mori
Kazuyoshi Sugihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP56057906A priority Critical patent/JPS57172731A/en
Publication of JPS57172731A publication Critical patent/JPS57172731A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7026—Focusing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7076—Mark details, e.g. phase grating mark, temporary mark

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE:To align the position by a method wherein the first and the second single color light are changed at the short time interval, synchronized to change the output signal of the photoelectric detector for the mask and the wafer detecting the mutual location of each alignment reference point. CONSTITUTION:The alignment reference points 2, 4 on the mask 1 and the substrate 3 are illuminated alternately at the short time interval by the single color light with the wave length of lambda1, lambda2 through the shutters 7, 10 synchrinized with the opening and closing of the switches 26, 27. The location of the Fresnel zone plate 11 and the distance between the mask 1 and the substrate 3 are selected to form the images of the alignment reference points 2, 4 on the receiving surface of the photoelectric detector 13. The resultant output is A/D converted 28 and alternately switched 26, 27 to collect the data on the mutual location. Besides, the alignment reference points may be provided on the locations exceeding three to arrange the Fresnel zone plate respectively corresponding to said points aligning the relative locations in the x, y, and z directions.
JP56057906A 1981-04-17 1981-04-17 Position alignment device for mask substrate and wafer Pending JPS57172731A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56057906A JPS57172731A (en) 1981-04-17 1981-04-17 Position alignment device for mask substrate and wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56057906A JPS57172731A (en) 1981-04-17 1981-04-17 Position alignment device for mask substrate and wafer

Publications (1)

Publication Number Publication Date
JPS57172731A true JPS57172731A (en) 1982-10-23

Family

ID=13069024

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56057906A Pending JPS57172731A (en) 1981-04-17 1981-04-17 Position alignment device for mask substrate and wafer

Country Status (1)

Country Link
JP (1) JPS57172731A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6296804A (en) * 1985-10-24 1987-05-06 Shimadzu Corp Measuring method of distance between two planes
EP0715214A1 (en) * 1994-11-29 1996-06-05 Ushiodenki Kabushiki Kaisha Process for positioning a mask relative to a workpiece and device for carrying out the process

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6296804A (en) * 1985-10-24 1987-05-06 Shimadzu Corp Measuring method of distance between two planes
EP0715214A1 (en) * 1994-11-29 1996-06-05 Ushiodenki Kabushiki Kaisha Process for positioning a mask relative to a workpiece and device for carrying out the process

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