JPS57169250A - Bonding method for pellet - Google Patents
Bonding method for pelletInfo
- Publication number
- JPS57169250A JPS57169250A JP5443281A JP5443281A JPS57169250A JP S57169250 A JPS57169250 A JP S57169250A JP 5443281 A JP5443281 A JP 5443281A JP 5443281 A JP5443281 A JP 5443281A JP S57169250 A JPS57169250 A JP S57169250A
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- cavity
- collet
- recognized
- corner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
Abstract
PURPOSE:To bond the pellet by recognizing the position of the cavity of an IC package by a picture, controlling the position of a collet through the recognition and accurately positioning the pellet. CONSTITUTION:The first recognition visual field 17 of the cavity 3 is caught by means of a TV camera through mechanical operation. THe picture signals are processed, and the position 21 (X1, Y1) of the corner of the cavity is recognized. The position 22 (X2, Y2) of a corner is similarly recognized. The central position of the cavity is recognized from these value, and an error with the normal position (X0, Y0) of the cavity to a lead frame 1 is obtained. The quantity of displacement is fed back to a pellet bonder controller, the position of the collet is minutely adjusted by means of a servomotor, and the pellet and the collet are accurately positioned relatively.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5443281A JPS57169250A (en) | 1981-04-13 | 1981-04-13 | Bonding method for pellet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5443281A JPS57169250A (en) | 1981-04-13 | 1981-04-13 | Bonding method for pellet |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57169250A true JPS57169250A (en) | 1982-10-18 |
Family
ID=12970549
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5443281A Pending JPS57169250A (en) | 1981-04-13 | 1981-04-13 | Bonding method for pellet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57169250A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6018926A (en) * | 1983-07-13 | 1985-01-31 | Hitachi Ltd | Pellet bonding apparatus |
JPS6129134A (en) * | 1984-07-19 | 1986-02-10 | Toshiba Corp | Mounting apparatus |
JPH01183127A (en) * | 1988-01-18 | 1989-07-20 | Shinkawa Ltd | Die bonding method |
-
1981
- 1981-04-13 JP JP5443281A patent/JPS57169250A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6018926A (en) * | 1983-07-13 | 1985-01-31 | Hitachi Ltd | Pellet bonding apparatus |
JPH0566015B2 (en) * | 1983-07-13 | 1993-09-20 | Hitachi Ltd | |
JPS6129134A (en) * | 1984-07-19 | 1986-02-10 | Toshiba Corp | Mounting apparatus |
JPH01183127A (en) * | 1988-01-18 | 1989-07-20 | Shinkawa Ltd | Die bonding method |
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