JPS55120144A - Automatic wire bonding system for semiconductor - Google Patents

Automatic wire bonding system for semiconductor

Info

Publication number
JPS55120144A
JPS55120144A JP2747979A JP2747979A JPS55120144A JP S55120144 A JPS55120144 A JP S55120144A JP 2747979 A JP2747979 A JP 2747979A JP 2747979 A JP2747979 A JP 2747979A JP S55120144 A JPS55120144 A JP S55120144A
Authority
JP
Japan
Prior art keywords
capillary tube
camera
signal
wire
controller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2747979A
Other languages
Japanese (ja)
Other versions
JPS6150381B2 (en
Inventor
Kiyoyuki Tada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP2747979A priority Critical patent/JPS55120144A/en
Publication of JPS55120144A publication Critical patent/JPS55120144A/en
Publication of JPS6150381B2 publication Critical patent/JPS6150381B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To automatically bond a wire with high reliability by identifying a trouble occurring with malfunction at the end of a capillary tube and controlling the continuation of the bonding work thereafter. CONSTITUTION:The semiconductor chip 2 of a lead frame 1 fed to a bonding position is taken by a camera 3, a video signal from the camera 3 is processed by a processor 4 and transferred to a memory 5 for a comparison signal. The comprison signal is applied from the memory 5 to a controller 7, which compares the signal with a preset value and produces an electrode position information. The displacing amount of the capillary tube 8 is calculated with the position information from the controller 7 and a wire supply end is disposed directly at the electrode position of the chip 2 to be bonded thereto. Then, the capillary tube is displaced at a distance l, the surface of the chip 2 after the wire is bonded is again taken by the camera 3 while the position of the capillary tube is controlled, a video signal from the camera 3 is compared by the comparator 6 with a signal stored in the memory 5 to identify the abnormal state by the controller 7, which thereby produces a command for stopping the bonding work and an alarm. Thus, it can prevent the damage of the capillary tube and improve the reliability of the wire bonding work.
JP2747979A 1979-03-08 1979-03-08 Automatic wire bonding system for semiconductor Granted JPS55120144A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2747979A JPS55120144A (en) 1979-03-08 1979-03-08 Automatic wire bonding system for semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2747979A JPS55120144A (en) 1979-03-08 1979-03-08 Automatic wire bonding system for semiconductor

Publications (2)

Publication Number Publication Date
JPS55120144A true JPS55120144A (en) 1980-09-16
JPS6150381B2 JPS6150381B2 (en) 1986-11-04

Family

ID=12222251

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2747979A Granted JPS55120144A (en) 1979-03-08 1979-03-08 Automatic wire bonding system for semiconductor

Country Status (1)

Country Link
JP (1) JPS55120144A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100274136B1 (en) * 1996-07-16 2001-01-15 후지야마 겐지 How to set return data of lead frame
US7458496B2 (en) * 2004-08-11 2008-12-02 F&K Delvotec Bondtechnik Gmbh Wire bonder and method of operating the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100274136B1 (en) * 1996-07-16 2001-01-15 후지야마 겐지 How to set return data of lead frame
US7458496B2 (en) * 2004-08-11 2008-12-02 F&K Delvotec Bondtechnik Gmbh Wire bonder and method of operating the same

Also Published As

Publication number Publication date
JPS6150381B2 (en) 1986-11-04

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